Fast Transient And Steady State Thermal Imaging Of Cmos Integrated Circuit Chips Considering Package Thermal Boundaries

• doi: 10.1109/ITHERM.2012.6231584
• title: Fast transient and steady state thermal imaging of CMOS integrated circuit chips considering package thermal boundaries
• publisher: IEEE
• isbn: 978-1-4244-9531-3
• issn: 1087-9870
• partnum: 12CH38809
• rank: 2486
• access_type: LOCKED
• content_type: Conferences
• abstract: This study shows the results of a transient and steady-state thermal imaging, using an infrared (IR) imaging system and thermoreflectance (TR) imaging for comparison. The experiments, carried out on a wire-bond package and a flip-chip package of a CMOS thermal test chip, show the characteristics of localized heating and the mass heat capacitance depending on the package. Both chips share an array using the same unit cells, each containing heaters and diode sensors. To identify a local heating spot on a chip, spatial resolution of the thermal image is a main limiting factor. The resolution is theoretically limited by the diffraction limit, which is 3-5 microns for infrared thermal emission. While, visible light achieves 200-300nm spatial resolution with thermoreflectance. For the transient response, IR cameras provide crude spatial resolution given by the video frame rate. Thermoreflectance imaging can provide a full field mega pixel transient thermal image with wide dynamic range from 100ns up to 10's of milliseconds. The experiments are carried out on an identical sample for comparison. The full field image of a uniformly heated 5.1mm × 5.1mm wire-bond chip provides the accurate temperature values using both IR and TR methods. The accuracy is proven by multiple embedded thermal diode sensors.. In addition, transient imaging of the same chip is presented. The through-silicon-substrate transient thermal imaging, using near-infrared light for thermoreflectance, demonstrates a promising new technique to identify the small temporal (lasting a few milliseconds) hotspots in a chip with flip-chip packaging or stacked packaging under high frequency operation.
• article_number: 6231584
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6231584
• html_url: https://ieeexplore.ieee.org/document/6231584/
• abstract_url: https://ieeexplore.ieee.org/document/6231584/
• publication_title: 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
• conference_location: San Diego, CA, USA
• conference_dates: 30 May-1 June 2012
• publication_number: 6222648
• is_number: 6231398
• publication_year: 2012
• publication_date: 30 May-1 June 2012
• start_page: 1405
• end_page: 1411
• citing_paper_count: 2
• citing_patent_count: 0
• download_count: 525
• insert_date: 20120705
• index_terms:
  • ieee_terms:
    • Temperature measurement
    • Heating
    • Transient analysis
    • Imaging
    • Electronic packaging thermal management
    • Substrates
    • Sensors
  • author_terms:
    • Thermoreflectance
    • infrared thermography
    • transient
    • thermal mass
  • dynamic_index_terms:
    • Infrared Imaging
    • Infrared Camera
    • Thermal Imaging
    • Thermal Camera
    • Fast Transients
    • Transient Imaging
    • Spatial Resolution
    • Visible Light
    • Visible Region
    • Visible Spectrum
    • Transient Response
    • Local Heat
    • Central Heating
    • Diffraction Limit
    • Near-infrared Light
    • Spatial Resolution Images
    • Uniform Heat
    • High Frequency Operation
    • Test Chip
    • Video Frame Rate
    • Illumination
    • Lighting
    • Light Source
    • Temperature Changes
    • Optical Tomography
    • Optical Imaging
    • Time Constant
    • Hot Spots
    • Emissive Materials
    • Infrared Measurements
    • Changes In Reflectance
    • Thermal Signal
    • Silicon Substrate
    • Heat Sink
    • Differences In Emissions
    • Metal Heat
    • Temperature Resolution
    • Thermal Infrared Images
• isbn_formats:
  • format: Online ISBN, value: 978-1-4244-9531-3, isbnType: New-2005
  • format: Print ISBN, value: 978-1-4244-9533-7, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-4244-9532-0, isbnType: New-2005
• authors:
  • Author Name: Kazuaki Yazawa
    Affiliation: Microsanj LLC, Santa Clara, CA, USA
    Author URL: https://ieeexplore.ieee.org/author/37281832000
    ID: 37281832000
    Order: 1
    Author Affiliations:
    • Microsanj LLC, Santa Clara, CA, USA
  • Author Name: Dustin Kendig
    Affiliation: Microsanj LLC, Santa Clara, CA, USA
    Author URL: https://ieeexplore.ieee.org/author/37394493700
    ID: 37394493700
    Order: 2
    Author Affiliations:
    • Microsanj LLC, Santa Clara, CA, USA
  • Author Name: James Christofferson
    Affiliation: Microsanj LLC, Santa Clara, CA, USA
    Author URL: https://ieeexplore.ieee.org/author/37283997300
    ID: 37283997300
    Order: 3
    Author Affiliations:
    • Microsanj LLC, Santa Clara, CA, USA
  • Author Name: Amy Marconnet
    Affiliation: University of Stanford, Stanford, CA, USA
    Author URL: https://ieeexplore.ieee.org/author/37945828800
    ID: 37945828800
    Order: 4
    Author Affiliations:
    • University of Stanford, Stanford, CA, USA
  • Author Name: Ali Shakouri
    Affiliation: Birck Nanotechnology Center, Purdue University, West Lafayette, IN, USA
    Author URL: https://ieeexplore.ieee.org/author/37284800600
    ID: 37284800600
    Order: 5
    Author Affiliations:
    • Birck Nanotechnology Center, Purdue University, West Lafayette, IN, USA

Image Sensor

• sensor_type: CMOS
• resolution: 256x256 pixels
• dynamic_range: Not specified
• pixel_size: 3-5 microns
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

• frame_rate: 60Hz
• shutter_speed: 16.3ms

Applications & Benefits

• cell_imaging: Used for thermal imaging of CMOS chips, identifying hotspots, and evaluating thermal performance.
• benefits: Enhanced sensitivity and resolution for transient thermal imaging.

Supporting Organizations

• supported_by: Stanford University, Purdue University, NVIDIA Corp., Thermal Engineering Associates

Manuscript Details

• publication_date: 30 May-1 June 2012

Relevancy Score

• score: 8
• missing_fields:
  • dynamic_range
  • fill_factor
  • quantum_efficiency
  • dark_current
  • signal-to-noise_ratio
  • power_consumption
  • sensitivity
  • readout_speed
  • noise_sources
  • analog-to-digital_conversion
  • focal_length
  • aperture
  • field_of_view
  • distortion

Processed JSON Filename

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