Exploring The 3D Integration Technology For Cmos Image Sensors

• doi: 10.1109/ECMSM.2013.6648935
• title: Exploring the 3D integration technology for CMOS image sensors
• publisher: IEEE
• isbn: 978-1-4673-6298-6
• issn:
• rank: 2438
• access_type: LOCKED
• content_type: Conferences
• abstract: 3D fabrication technologies allow microelectronic circuits such as processors or memories to achieve very high integration densities. These technologies applied to CMOS image sensors, make possible the implementation of specific processing architectures without damaging key parameters of CMOS imagers. This paper illustrates these benefits with an implementation of a 3D image sensor integrating at the pixel level a low noise circuit coupled to an analog to digital converter.
• article_number: 6648935
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6648935
• html_url: https://ieeexplore.ieee.org/document/6648935/
• abstract_url: https://ieeexplore.ieee.org/document/6648935/
• publication_title: 2013 IEEE 11th International Workshop of Electronics, Control, Measurement, Signals and their application to Mechatronics
• conference_location: Toulouse, France
• conference_dates: 24-26 June 2013
• publication_number: 6599409
• is_number: 6648925
• publication_year: 2013
• publication_date: 24-26 June 2013
• start_page: 1
• end_page: 5
• citing_paper_count: 6
• citing_patent_count: 0
• download_count: 1385
• insert_date: 20131031
• index_terms:
  • ieee_terms:
    • Three-dimensional displays
    • CMOS image sensors
    • CMOS integrated circuits
    • CMOS technology
    • Decoding
    • Random access memory
  • author_terms:
    • CMOS Image Sensor
    • Three dimensional integration technology
    • ADC
    • parallelism
  • dynamic_index_terms:
    • Image Sensor
    • Camera Sensor
    • 3D Integration Technology
    • Low Noise
    • Analog-to-digital Converter
    • Analog-to-digital
    • Digital-to-analog Converter
    • Pixel Level
    • High-density Integration
    • Functional Integrity
    • Partition Function
    • 3D Technology
    • Conversion Time
    • 3D Constructs
    • Parallel Configuration
    • Heterogeneous Integration
    • Multichip Module
    • Readout Circuit
• isbn_formats:
  • format: Electronic ISBN, value: 978-1-4673-6298-6, isbnType: New-2005
• authors:
  • Author Name: Fernando Raymundo
    Affiliation: CIMI Image Sensor Laboratory, University of Toulouse, Toulouse, France
    Author URL: https://ieeexplore.ieee.org/author/37086796469
    ID: 37086796469
    Order: 1
    Author Affiliations:
    • CIMI Image Sensor Laboratory, University of Toulouse, Toulouse, France
  • Author Name: Phillipe Martin-Gonthier
    Affiliation: CIMI Image Sensor Laboratory, University of Toulouse, Toulouse, France
    Author URL: https://ieeexplore.ieee.org/author/38278141700
    ID: 38278141700
    Order: 2
    Author Affiliations:
    • CIMI Image Sensor Laboratory, University of Toulouse, Toulouse, France
  • Author Name: Romain Molina
    Affiliation: CIMI Image Sensor Laboratory, University of Toulouse, Toulouse, France
    Author URL: https://ieeexplore.ieee.org/author/38285932500
    ID: 38285932500
    Order: 3
    Author Affiliations:
    • CIMI Image Sensor Laboratory, University of Toulouse, Toulouse, France
  • Author Name: Sebastien Rolando
    Affiliation: CIMI Image Sensor Laboratory, University of Toulouse, Toulouse, France
    Author URL: https://ieeexplore.ieee.org/author/37085619853
    ID: 37085619853
    Order: 4
    Author Affiliations:
    • CIMI Image Sensor Laboratory, University of Toulouse, Toulouse, France
  • Author Name: Pierre Magnan
    Affiliation: CIMI Image Sensor Laboratory, University of Toulouse, Toulouse, France
    Author URL: https://ieeexplore.ieee.org/author/37400751600
    ID: 37400751600
    Order: 5
    Author Affiliations:
    • CIMI Image Sensor Laboratory, University of Toulouse, Toulouse, France

Image Sensor

• sensor_type: CMOS
• resolution: 128 x 128 pixels
• dynamic_range: Not specified
• pixel_size: 10 µm x 10 µm
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

• frame_rate: 200 fps

Applications & Benefits

• cell_imaging: Not specified
• benefits: Allows high integration of processing functions without degrading key parameters.

Supporting Organizations

• supported_by: CIMI-ISAE, ST Microelectronics, CEA-LETI, IZM Berlin, MIT Lincoln Laboratory.

Manuscript Details

• publication_date: 24-26 June 2013

Relevancy Score

• score: 10
• missing_fields:
  • dynamic_range
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

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