Essential Edge Protection Techniques For Successful Multiwafer Stacking

• doi: 10.1109/S3S.2015.7333492
• title: Essential edge protection techniques for successful multi-wafer stacking
• publisher: IEEE
• isbn: 978-1-5090-0258-0
• issn:
• rank: 2405
• access_type: LOCKED
• content_type: Conferences
• abstract: 3D edge protection for wafer scale stacking using oxide bonding has been demonstrated with readily available CMOS compatible processes. Edge voiding has been shown to vastly reduce as well CMP edge removal. By utilizing edge protection schemes such as this, in combination with other approaches for bevel/edge protection for wafer thinning [4], wafer edges can be preserved with minimal additional processing complexity to enable multi-wafer 3D stacking and technologies such as Backside Illuminated Image Sensors (BSI) [9] and 3Dm, all of which can benefit from such an approach.
• article_number: 7333492
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7333492
• html_url: https://ieeexplore.ieee.org/document/7333492/
• abstract_url: https://ieeexplore.ieee.org/document/7333492/
• publication_title: 2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)
• conference_location: Rohnert Park, CA, USA
• conference_dates: 5-8 Oct. 2015
• publication_number: 7321935
• is_number: 7333477
• publication_year: 2015
• publication_date: 5-8 Oct. 2015
• start_page: 1
• end_page: 2
• citing_paper_count: 5
• citing_patent_count: 0
• download_count: 545
• insert_date: 20151123
• index_terms:
  • ieee_terms:
    • Decision support systems
    • Through-silicon vias
    • Silicon
    • Substrates
  • author_terms:
    • 3D
    • Edge Protection
    • wafer stacking
  • dynamic_index_terms:
    • Delamination
    • Protection Scheme
    • Protection Strategies
    • Buffer Zone
    • Buffer Region
    • Use Of Protection
    • Narrow Zone
    • Standard Module
    • Large Beads
    • Multiple Chips
    • Metal Layer Thickness
    • Thickness Of The Metallic Layer
    • Bandwidth Improvement
    • Photoresist
    • Large Voids
    • Metal Lines
• isbn_formats:
  • format: USB ISBN, value: 978-1-5090-0258-0, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-5090-0259-7, isbnType: New-2005
• authors:
  • Author Name: Joshua Rubin
    Affiliation: IBM Research, Yorktown Heights, NY, US
    Author URL: https://ieeexplore.ieee.org/author/37085736977
    ID: 37085736977
    Order: 1
    Author Affiliations:
    • IBM Research, Yorktown Heights, NY, US
  • Author Name: Kevin Winstel
    Affiliation: IBM Research, Albany, NY
    Author URL: https://ieeexplore.ieee.org/author/37294088500
    ID: 37294088500
    Order: 2
    Author Affiliations:
    • IBM Research, Albany, NY
  • Author Name: Alex Hubbard
    Affiliation: IBM Research, Albany, NY
    Author URL: https://ieeexplore.ieee.org/author/38569650200
    ID: 38569650200
    Order: 3
    Author Affiliations:
    • IBM Research, Albany, NY
  • Author Name: Cody Murray
    Affiliation: IBM Research, Albany, NY
    Author URL: https://ieeexplore.ieee.org/author/37085590578
    ID: 37085590578
    Order: 4
    Author Affiliations:
    • IBM Research, Albany, NY
  • Author Name: Kisup Chung
    Affiliation: IBM Research, Albany, NY
    Author URL: https://ieeexplore.ieee.org/author/37085732358
    ID: 37085732358
    Order: 5
    Author Affiliations:
    • IBM Research, Albany, NY
  • Author Name: James Kelly
    Affiliation: IBM Research, NY
    Author URL: https://ieeexplore.ieee.org/author/37531717300
    ID: 37531717300
    Order: 6
    Author Affiliations:
    • IBM Research, NY
  • Author Name: Babar Khan
    Affiliation: IBM Research, NY
    Author URL: https://ieeexplore.ieee.org/author/37286864200
    ID: 37286864200
    Order: 7
    Author Affiliations:
    • IBM Research, NY
  • Author Name: Arvind Kumar
    Affiliation: IBM Research, NY
    Author URL: https://ieeexplore.ieee.org/author/37279682200
    ID: 37279682200
    Order: 8
    Author Affiliations:
    • IBM Research, NY
  • Author Name: Vamsi Paruchuri
    Affiliation: IBM Research, Albany, NY
    Author URL: https://ieeexplore.ieee.org/author/37287132900
    ID: 37287132900
    Order: 9
    Author Affiliations:
    • IBM Research, Albany, NY

Image Sensor

• sensor_type: CMOS
• resolution: (not specified in text)
• dynamic_range: (not specified in text)
• pixel_size: (not specified in text)
• dark_current: (not specified in text)

Optical Data

• focal_length: (not specified in text)
• aperture: (not specified in text)
• field_of_view: (not specified in text)
• distortion: (not specified in text)

Performance Metrics

• frame_rate: (not specified in text)
• signal_to_noise_ratio: (not specified in text)
• sensitivity: (not specified in text)
• shutter_speed: (not specified in text)
• power_consumption: (not specified in text)
• noise: (not specified in text)

Applications & Benefits

• cell_imaging: (not specified in text)
• benefits: (not specified in text)

Supporting Organizations

• supported_by: (not specified in text)

Manuscript Details

• publication_date: 5-8 Oct. 2015

Relevancy Score

• score: 10
• missing_fields:
  • sensor_type
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise
  • cell_imaging
  • benefits
  • supported_by
  • authors
  • publication_date

Processed JSON Filename

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