Embedded Camera Module For Automotive Camera System

• doi: 10.1109/PanPacific.2016.7428414
• title: Embedded camera module for automotive camera system
• publisher: IEEE
• isbn: 978-1-9445-4390-7
• issn:
• rank: 2377
• access_type: LOCKED
• content_type: Conferences
• abstract: This paper presents embedded camera module using embedded assembly technology to meet the industry's growing needs for rearview cameras, front-view cameras, surround-view cameras, multi-lens array cameras, stereoscopic and most other automotive camera assembly and test requirements. Embedded camera module is configured by device embedded substrate with embedding passive components using embedding process, glass lens with horizontal view more than 100 degree, blue filter with image tuning, holder with heat dissipation structure design, and low power CMOS image sensor with full HD. The fabricated embedded camera module provides many features required to deliver a high-quality product to the automotive market. Due to their applications being directly linked to the safety of consumers, quality and reliability in the manufacturing of automotive cameras is critical and we evaluated performance and thermal characteristics of embedded camera module with heat dissipation package for improving high thermal reliability for automotive camera module.
• article_number: 7428414
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7428414
• html_url: https://ieeexplore.ieee.org/document/7428414/
• abstract_url: https://ieeexplore.ieee.org/document/7428414/
• publication_title: 2016 Pan Pacific Microelectronics Symposium (Pan Pacific)
• conference_location: Big Island, HI, USA
• conference_dates: 25-28 Jan. 2016
• publication_number: 7422513
• is_number: 7428382
• publication_year: 2016
• publication_date: 25-28 Jan. 2016
• start_page: 1
• end_page: 7
• citing_paper_count: 2
• citing_patent_count: 0
• download_count: 1105
• insert_date: 20160310
• index_terms:
  • ieee_terms:
    • Cameras
    • Lenses
    • Automotive engineering
    • Substrates
    • Heating
    • Reliability
    • Optical filters
  • author_terms:
    • Embedded camera module
    • Device embedded substrate
    • CMOS image sensor
    • heat dissipation package
    • automotive camera system
  • dynamic_index_terms:
    • Camera System
    • Camera Module
    • Automotive Cameras
    • High Reliability
    • High Dependence
    • Image Sensor
    • Camera Sensor
    • Heat Dissipation
    • Passive Components
    • Embedding Process
    • Camera Array
    • Plenoptic Camera
    • Light Field Camera
    • Assembly Technology
    • Horizontal View
    • Electrode
    • Spatial Resolution
    • Heavy Metals
    • Evaluation System
    • Rating System
    • Etching
    • Thermal Effects
    • Thermal Events
    • Diet-induced Thermogenesis
    • Thermal Stress
    • Heat Load
    • Photolithography
    • Optical Lithography
    • Accurate Image
    • Automotive Systems
    • Modulation Transfer Function
    • Optical Transfer Function
    • Bottom Substrate
    • Advanced Driver Assistance Systems
    • Driver Assistance Systems
    • Electroless Plating
    • Electroless Deposition
    • Thermal Test
    • Front Camera
    • Properties Of Components
    • Properties Of Each Component
• isbn_formats:
  • format: USB ISBN, value: 978-1-9445-4390-7, isbnType: New-2005
  • format: Electronic ISBN, value: 978-0-9888-8739-8, isbnType: New-2005
• authors:
  • Author Name: Hyunho Kim
    Affiliation: Center for Integrated Smart Sensors, KAIST, Daejeon, Korea
    Author URL: https://ieeexplore.ieee.org/author/37085397842
    ID: 37085397842
    Order: 1
    Author Affiliations:
    • Center for Integrated Smart Sensors, KAIST, Daejeon, Korea
  • Author Name: Jongtae Lee
    Affiliation: Simmtech Co., Ltd, Cheongju, Chungcheongbuk-Do, Korea
    Author URL: https://ieeexplore.ieee.org/author/37085770578
    ID: 37085770578
    Order: 2
    Author Affiliations:
    • Simmtech Co., Ltd, Cheongju, Chungcheongbuk-Do, Korea
  • Author Name: Se-meyung Hwang
    Affiliation: Simmtech Co., Ltd, Cheongju, Chungcheongbuk-Do, Korea
    Author URL: https://ieeexplore.ieee.org/author/37085776870
    ID: 37085776870
    Order: 3
    Author Affiliations:
    • Simmtech Co., Ltd, Cheongju, Chungcheongbuk-Do, Korea
  • Author Name: Sangsuk Cha
    Affiliation: Simmtech Co., Ltd, Cheongju, Chungcheongbuk-Do, Korea
    Author URL: https://ieeexplore.ieee.org/author/37085770971
    ID: 37085770971
    Order: 4
    Author Affiliations:
    • Simmtech Co., Ltd, Cheongju, Chungcheongbuk-Do, Korea

Image Sensor

• sensor_type: CMOS
• resolution: 1920x1080 (Full HD)
• dynamic_range: Not explicitly specified in text, but expected to be high due to application in automotive systems
• pixel_size: Not specified, but relevant to performance metrics
• dark_current: Low dark current is stated as a feature of the sensor, exact value not specified in text

Optical Data

• focal_length: 2.7 mm
• aperture: f/2.0
• field_of_view: 137 degrees
• distortion: Not specified, but optical quality is emphasized in text

Performance Metrics

• frame_rate: Not explicitly stated, but typical high-speed operation expected for automotive applications
• signal_to_noise_ratio: Not specified in text
• sensitivity: High sensitivity specified due to design characteristics
• shutter_speed: Not explicitly mentioned, but usually compatible with automotive active systems
• power_consumption: Low power CMOS image sensor mentioned but not quantified in the text
• noise: Not specified, although dark current is highlighted

Applications & Benefits

• cell_imaging: Suitable for automotive applications, such as ADAS systems for risk detection and driver assistance
• benefits: High reliability, robustness, and small form factor suitable for automotive environments is emphasized

Supporting Organizations

• supported_by: Center for Integrated Smart Sensors, funded by the Ministry of Science, ICT & Future Planning as Global Frontier Project

Manuscript Details

• publication_date: 25-28 Jan. 2016

Relevancy Score

• score: 9
• missing_fields:
  • Detailed specifications for pixel size, dynamic range, signal-to-noise ratio, power consumption, and other performance metrics.

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