Effects Of Stacked Al2o3 Hfo2 Films Deposited In Deep Trench Isolation On
White Pixels Noise
- doi: 10.1109/CSTIC55103.2022.9856838
-
title: Effects of Stacked Al2O3 / HFO2 Films Deposited
in Deep Trench Isolation on White Pixels Noise
- publisher: IEEE
- isbn: 978-1-6654-9759-6
- issn:
- rank: 2355
- access_type: LOCKED
- content_type: Conferences
-
abstract: In the stacked-BSI CMOS image sensor process,
deposition of high-k thin films in deep trench isolation (DTI) to
further reduce white pixels noise has attracted lots of attention. In
this paper, we explore the influence of stacked two films of Al2O3/HfO2
on the white pixel properties of the CMOS image sensor. Here, the two
oxide layers are deposited using PEALD. We found that the as-deposited
Al2O3 / HfO2 (TH1/TH1) films show a suppression of the white pixels up
to 175 PPM(P95). This achievement could open a possible way to
remarkably further reduce the white pixels noise.
- article_number: 9856838
-
pdf_url:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9856838
-
html_url:
https://ieeexplore.ieee.org/document/9856838/
-
abstract_url:
https://ieeexplore.ieee.org/document/9856838/
-
publication_title: 2022 China Semiconductor Technology
International Conference (CSTIC)
- conference_location: Shanghai, China
- conference_dates: 20-21 June 2022
- publication_number: 9856647
- is_number: 9856709
- publication_year: 2022
- publication_date: 20-21 June 2022
- start_page: 1
- end_page: 3
- citing_paper_count: 0
- citing_patent_count: 0
- download_count: 871
- insert_date: 20220823
-
index_terms:
-
ieee_terms:
- Films
- CMOS image sensors
- Hafnium compounds
- High-k dielectric materials
- Leakage currents
- Aluminum oxide
- Diffusion tensor imaging
-
dynamic_index_terms:
- White Noise
- White Pixels
- Deep Trench Isolation
- Thin Films
- Alumina
- Charge Density
- Charge Distribution
- Sidewall
- Side Walls
- Silicon Wafer
- Deep Groove
- Oxygen Source
- Si Surface
- Al2O3 Layer
- Interfacial Density
-
isbn_formats:
-
format: Print on Demand(PoD) ISBN,
value: 978-1-6654-9759-6,
isbnType: New-2005
-
format: USB ISBN,
value: 978-1-6654-9757-2,
isbnType: New-2005
-
format: Electronic ISBN,
value: 978-1-6654-9758-9,
isbnType: New-2005
-
authors:
-
Author Name: Qixin Wu
Affiliation: University of Science and Technology
Beijing, Semiconductor Manufacturing International Corporation,
Beijing, P. R. China
Author URL:
https://ieeexplore.ieee.org/author/37089498998
ID: 37089498998
Order: 1
Author Affiliations:
-
University of Science and Technology Beijing, Semiconductor
Manufacturing International Corporation, Beijing, P. R. China
-
Author Name: Hebao Liu
Affiliation: University of Science and Technology
Beijing, Semiconductor Manufacturing International Corporation,
Beijing, P. R. China
Author URL:
https://ieeexplore.ieee.org/author/37089498006
ID: 37089498006
Order: 2
Author Affiliations:
-
University of Science and Technology Beijing, Semiconductor
Manufacturing International Corporation, Beijing, P. R. China
-
Author Name: Haitao Jin
Affiliation: University of Science and Technology
Beijing, Semiconductor Manufacturing International Corporation,
Beijing, P. R. China
Author URL:
https://ieeexplore.ieee.org/author/37089498811
ID: 37089498811
Order: 3
Author Affiliations:
-
University of Science and Technology Beijing, Semiconductor
Manufacturing International Corporation, Beijing, P. R. China
-
Author Name: Felix Li
Affiliation: University of Science and Technology
Beijing, Semiconductor Manufacturing International Corporation,
Beijing, P. R. China
Author URL:
https://ieeexplore.ieee.org/author/37089498668
ID: 37089498668
Order: 4
Author Affiliations:
-
University of Science and Technology Beijing, Semiconductor
Manufacturing International Corporation, Beijing, P. R. China
-
Author Name: Enjoy Yin
Affiliation: University of Science and Technology
Beijing, Semiconductor Manufacturing International Corporation,
Beijing, P. R. China
Author URL:
https://ieeexplore.ieee.org/author/37089499071
ID: 37089499071
Order: 5
Author Affiliations:
-
University of Science and Technology Beijing, Semiconductor
Manufacturing International Corporation, Beijing, P. R. China
-
Author Name: Horse Ma
Affiliation: University of Science and Technology
Beijing, Semiconductor Manufacturing International Corporation,
Beijing, P. R. China
Author URL:
https://ieeexplore.ieee.org/author/37089496140
ID: 37089496140
Order: 6
Author Affiliations:
-
University of Science and Technology Beijing, Semiconductor
Manufacturing International Corporation, Beijing, P. R. China
-
Author Name: Xinhe Zheng
Affiliation: University of Science and Technology
Beijing, Semiconductor Manufacturing International Corporation,
Beijing, P. R. China
Author URL:
https://ieeexplore.ieee.org/author/37089497308
ID: 37089497308
Order: 7
Author Affiliations:
-
University of Science and Technology Beijing, Semiconductor
Manufacturing International Corporation, Beijing, P. R. China
Image Sensor
- sensor_type: CMOS
- resolution: not specified
- dynamic_range: not specified
- pixel_size: not specified
- dark_current: not specified
Optical Data
- focal_length: not specified
- aperture: not specified
- field_of_view: not specified
- distortion: not specified
Performance Metrics
Applications & Benefits
-
cell_imaging: CMOS sensors are used in cell imaging
applications as part of digital imaging systems.
-
benefits: Enable digital imaging in smartphones,
medical devices, and automotive systems.
Supporting Organizations
-
supported_by: University of Science and Technology
Beijing, Semiconductor Manufacturing International Corporation
Manuscript Details
- publication_date: 20-21 June 2022
Relevancy Score
- score: 9
-
missing_fields:
- resolution
- dynamic_range
- pixel_size
- dark_current
- frame_rate
- signal_to_noise_ratio
- sensitivity
- shutter_speed
- power_consumption
- noise
- focal_length
- aperture
- field_of_view
- distortion
Processed JSON Filename
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