Development On Superthin Highpixel Cmos Image Sensor Module
- doi: 10.1109/ICEPT.2018.8480525
-
title: Development on Super-thin & High-Pixel CMOS
Image Sensor Module
- publisher: IEEE
- isbn: 978-1-5386-6387-5
- issn:
- rank: 2275
- access_type: LOCKED
- content_type: Conferences
-
abstract: This paper systematically reports the
development on super-thin and high-pixel CMOS image sensor (CIS) module
in terms of substrate design, process development, materials selection
and reliability test. The as-developed super-thin chip scale package
(SCSP) can greatly reduce the CIS module thickness up to 0.4 mm without
sacrificing its reliability.
- article_number: 8480525
-
pdf_url:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8480525
-
html_url:
https://ieeexplore.ieee.org/document/8480525/
-
abstract_url:
https://ieeexplore.ieee.org/document/8480525/
-
publication_title: 2018 19th International Conference
on Electronic Packaging Technology (ICEPT)
- conference_location: Shanghai, China
- conference_dates: 8-11 Aug. 2018
- publication_number: 8464037
- is_number: 8480417
- publication_year: 2018
- publication_date: 8-11 Aug. 2018
- start_page: 1716
- end_page: 1719
- citing_paper_count: 0
- citing_patent_count: 0
- download_count: 221
- insert_date: 20181004
-
index_terms:
-
ieee_terms:
- Bonding
- Flip-chip devices
- Packaging
- Chip scale packaging
- Reliability
- Substrates
- Glass
-
author_terms:
- CMOS image sensor
- CIS module
- Super-thin chip scale package
-
dynamic_index_terms:
- Sensor Module
- Reliability Test
- Material Selection
- Excellent Mechanical Properties
- Innovative Techniques
- Maleimide
- Bismaleimide
- Physical Vapor Deposition
- Physical Vapour Deposition
-
isbn_formats:
-
format: Print on Demand(PoD) ISBN,
value: 978-1-5386-6387-5,
isbnType: New-2005
-
format: USB ISBN,
value: 978-1-5386-6385-1,
isbnType: New-2005
-
format: Electronic ISBN,
value: 978-1-5386-6386-8,
isbnType: New-2005
-
authors:
-
Author Name: Mark Huang
Affiliation: A-Kelon (Huizhou) Optronic Co., Ltd,
Huizhou of Guangdong, CHINA
Author URL:
https://ieeexplore.ieee.org/author/37086470219
ID: 37086470219
Order: 1
Author Affiliations:
-
A-Kelon (Huizhou) Optronic Co., Ltd, Huizhou of Guangdong, CHINA
-
Author Name: Huisheng Han
Affiliation: A-Kelon (Huizhou) Optronic Co., Ltd,
Huizhou of Guangdong, CHINA
Author URL:
https://ieeexplore.ieee.org/author/37086470613
ID: 37086470613
Order: 2
Author Affiliations:
-
A-Kelon (Huizhou) Optronic Co., Ltd, Huizhou of Guangdong, CHINA
-
Author Name: Huabin Wu
Affiliation: A-Kelon (Huizhou) Optronic Co., Ltd,
Huizhou of Guangdong, CHINA
Author URL:
https://ieeexplore.ieee.org/author/37086470904
ID: 37086470904
Order: 3
Author Affiliations:
-
A-Kelon (Huizhou) Optronic Co., Ltd, Huizhou of Guangdong, CHINA
-
Author Name: Chuangwen Huang
Affiliation: A-Kelon (Huizhou) Optronic Co., Ltd,
Huizhou of Guangdong, CHINA
Author URL:
https://ieeexplore.ieee.org/author/37086471277
ID: 37086471277
Order: 4
Author Affiliations:
-
A-Kelon (Huizhou) Optronic Co., Ltd, Huizhou of Guangdong, CHINA
-
Author Name: Weiqing Zhang
Affiliation: A-Kelon (Huizhou) Optronic Co., Ltd,
Huizhou of Guangdong, CHINA
Author URL:
https://ieeexplore.ieee.org/author/37086469953
ID: 37086469953
Order: 5
Author Affiliations:
-
A-Kelon (Huizhou) Optronic Co., Ltd, Huizhou of Guangdong, CHINA
Image Sensor
- sensor_type: CMOS
- resolution: 5M and above
- dynamic_range: Not specified
- pixel_size: Not specified
- dark_current: Not specified
Optical Data
- focal_length: Not specified
- aperture: Not specified
- field_of_view: Not specified
- distortion: Not specified
Performance Metrics
Applications & Benefits
-
cell_imaging: Cell imaging and other applications
requiring ultra-thin and high-pixel image sensors.
-
benefits: The ability to achieve super-thin design (0.4
mm) without sacrificing reliability, suitable for portable electronic
products.
Supporting Organizations
-
supported_by: Huizhou Science and Technology Creative
Team Program, Suzhou Speed Semiconductor Pte Ltd.
Manuscript Details
- publication_date: 8-11 Aug. 2018
Relevancy Score
- score: 9
-
missing_fields:
- dynamic_range
- pixel_size
- dark_current
- focal_length
- aperture
- field_of_view
- distortion
- frame_rate
- signal_to_noise_ratio
- sensitivity
- shutter_speed
- power_consumption
- noise
Processed JSON Filename
request_27445588-41e3-4862-bce7-d07bc1b0f027-development_on_superthin__highpixel_cmos_image_sensor_module.json