Development Of A Threedimensional Integrated Image Sensor With Pixelparallel Signal Processing Architecture

• doi: 10.1109/ICSENS.2015.7370672
• title: Development of a three-dimensional integrated image sensor with pixel-parallel signal processing architecture
• publisher: IEEE
• isbn: 978-1-4799-8202-8
• issn:
• rank: 2258
• access_type: LOCKED
• content_type: Conferences
• abstract: A prototype sensor was built to demonstrate a 3D integrated CMOS image sensor that incorporates pixel-parallel signal processing architecture. FDSOI substrates with photodiodes and in-pixel ADC circuits were directly bonded after surface activation by plasma treatment. X, Y and θ alignment errors of 20 bonded samples were reduced to within ±0.7 μm, ±0.4 μm, and ±0.004°, respectively by using IR camera system. The resulting sensor successfully captured video images, thus demonstrating the feasibility of 3D integration technology and pixel-parallel architecture for future CMOS image sensors.
• article_number: 7370672
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7370672
• html_url: https://ieeexplore.ieee.org/document/7370672/
• abstract_url: https://ieeexplore.ieee.org/document/7370672/
• publication_title: 2015 IEEE SENSORS
• conference_location: Busan, Korea (South)
• conference_dates: 1-4 Nov. 2015
• publication_number: 7350021
• is_number: 7370096
• publication_year: 2015
• publication_date: 1-4 Nov. 2015
• start_page: 1
• end_page: 4
• citing_paper_count: 0
• citing_patent_count: 0
• download_count: 237
• insert_date: 20160107
• index_terms:
  • ieee_terms:
    • Substrates
    • CMOS image sensors
    • Prototypes
    • Surface treatment
    • Yttrium
    • Bonding
  • author_terms:
    • 3D integration technology
    • CMOS image sensor
    • wafer bonding
  • dynamic_index_terms:
    • Signal Processing
    • Image Sensor
    • Camera Sensor
    • Signal Processing Architecture
    • Photodiode
    • Video Images
    • IR Camera
    • 3D Integration
    • Sensor Prototype
    • Technology Architecture
    • Atomic Force Microscopy
    • Fabrication Process
    • Substrate Layer
    • Conventional Architecture
    • Pixel Pitch
    • Alignment Marks
• isbn_formats:
  • format: USB ISBN, value: 978-1-4799-8202-8, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-4799-8203-5, isbnType: New-2005
• authors:
  • Author Name: Kei Hagiwara
    Affiliation: Science and Technology Research Laboratories, NHK (Japan Broadcasting Corporation), Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/37399139900
    ID: 37399139900
    Order: 1
    Author Affiliations:
    • Science and Technology Research Laboratories, NHK (Japan Broadcasting Corporation), Tokyo, Japan
  • Author Name: Masahide Goto
    Affiliation: Science and Technology Research Laboratories, NHK (Japan Broadcasting Corporation), Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/37330360100
    ID: 37330360100
    Order: 2
    Author Affiliations:
    • Science and Technology Research Laboratories, NHK (Japan Broadcasting Corporation), Tokyo, Japan
  • Author Name: Yuki Honda
    Affiliation: Science and Technology Research Laboratories, NHK (Japan Broadcasting Corporation), Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/37588911000
    ID: 37588911000
    Order: 3
    Author Affiliations:
    • Science and Technology Research Laboratories, NHK (Japan Broadcasting Corporation), Tokyo, Japan
  • Author Name: Masakazu Nanba
    Affiliation: Science and Technology Research Laboratories, NHK (Japan Broadcasting Corporation), Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/37283665600
    ID: 37283665600
    Order: 4
    Author Affiliations:
    • Science and Technology Research Laboratories, NHK (Japan Broadcasting Corporation), Tokyo, Japan
  • Author Name: Hiroshi Ohtake
    Affiliation: Science and Technology Research Laboratories, NHK (Japan Broadcasting Corporation), Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/37331518200
    ID: 37331518200
    Order: 5
    Author Affiliations:
    • Science and Technology Research Laboratories, NHK (Japan Broadcasting Corporation), Tokyo, Japan
  • Author Name: Yoshinori Iguchi
    Affiliation: Science and Technology Research Laboratories, NHK (Japan Broadcasting Corporation), Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/37429827800
    ID: 37429827800
    Order: 6
    Author Affiliations:
    • Science and Technology Research Laboratories, NHK (Japan Broadcasting Corporation), Tokyo, Japan
  • Author Name: Takuya Saraya
    Affiliation: The University of Tokyo, Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/37293949700
    ID: 37293949700
    Order: 7
    Author Affiliations:
    • The University of Tokyo, Tokyo, Japan
  • Author Name: Masaharu Kobayashi
    Affiliation: The University of Tokyo, Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/37085444063
    ID: 37085444063
    Order: 8
    Author Affiliations:
    • The University of Tokyo, Tokyo, Japan
  • Author Name: Hiroshi Toshiyoshi
    Affiliation: The University of Tokyo, Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/37274513000
    ID: 37274513000
    Order: 9
    Author Affiliations:
    • The University of Tokyo, Tokyo, Japan
  • Author Name: Eiji Higurashi
    Affiliation: The University of Tokyo, Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/37265713900
    ID: 37265713900
    Order: 10
    Author Affiliations:
    • The University of Tokyo, Tokyo, Japan
  • Author Name: Toshiro Hiramoto
    Affiliation: The University of Tokyo, Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/37268252200
    ID: 37268252200
    Order: 11
    Author Affiliations:
    • The University of Tokyo, Tokyo, Japan

Image Sensor

• sensor_type: CMOS
• resolution: 64 pixels of 80×80 µm2
• dynamic_range: Not specified
• pixel_size: 80 µm
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: Optimized for video image capture, utilizing pixel-parallel signal processing architecture for improved performance.
• benefits: Demonstrated feasibility of 3D integration technology and pixel-parallel architecture.

Supporting Organizations

• supported_by: NHK (Japan Broadcasting Corporation), The University of Tokyo

Manuscript Details

• publication_date: 1-4 Nov. 2015

Relevancy Score

• score: 10
• missing_fields:
  • fill factor
  • quantum efficiency
  • readout speed
  • temporal noise
  • fixed-pattern noise
  • analog-to-digital conversion techniques
  • microlenses
  • on-chip colour filters
  • global or rolling shutters
  • backside illumination

Processed JSON Filename

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