Development Of 3Layer Stacked Global Shutter Cmos Image Sensor With Pixel Pitch Cutocu Interconnection And Highcapacity Capacitors

• doi: 10.1109/IITC/MAM57687.2023.10154780
• title: Development of 3-layer stacked global shutter CMOS image sensor with pixel pitch Cu-to-Cu interconnection and high-capacity capacitors
• publisher: IEEE
• isbn: 979-8-3503-1098-6
• issn: 2380-632X
• rank: 2231
• access_type: LOCKED
• content_type: Conferences
• abstract: We have successfully developed two kinds of novel 3-layer stacked backside-illuminated (BSI) voltage-domain global shutter (GS) CMOS image sensors (CIS) with consecutive void-free hybrid bonding processes. A new 3-layer stacked GS CIS contains the separate high-capacity capacitors on the middle wafer which are connected to pixel transistors via pixel-pitch Cu-to-Cu hybrid bonding, followed by another Cu-to-Cu hybrid bonding that connects middle capacitor wafer to bottom logic wafer. Another type of sensor architecture contains thinned Si layer in middle wafer that enables 3-dimensional (3D) integration of transistors for GS operation. Our proposed 3-layer stacking integrations provide a pathway to pixel-level integration of ultrahigh-capacity capacitors for further shrink of GS CIS.
• article_number: 10154780
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10154780
• html_url: https://ieeexplore.ieee.org/document/10154780/
• abstract_url: https://ieeexplore.ieee.org/document/10154780/
• publication_title: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)
• conference_location: Dresden, Germany
• conference_dates: 22-25 May 2023
• publication_number: 10154618
• is_number: 10154586
• publication_year: 2023
• publication_date: 22-25 May 2023
• start_page: 1
• end_page: 3
• citing_paper_count: 7
• citing_patent_count: 0
• download_count: 1398
• insert_date: 20230622
• index_terms:
  • ieee_terms:
    • Metallization
    • Capacitors
    • Stacking
    • CMOS image sensors
    • Silicon
    • Transistors
    • Bonding
  • author_terms:
    • 3-layer stacked device
    • Cu-to-Cu hybrid bonding
    • Pixel-pitch hybrid bonding
    • Global shutter
  • dynamic_index_terms:
    • Image Sensor
    • Camera Sensor
    • Pixel Pitch
    • Global Shutter
    • Global Shutter CMOS Image
    • Si Layer
    • 3D Integration
    • Pixel Area
    • Peripheral Areas
    • Electrical Connection
    • Thin Processes
    • Optimal Process Conditions
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 979-8-3503-1098-6, isbnType: New-2005
  • format: Electronic ISBN, value: 979-8-3503-1097-9, isbnType: New-2005
• authors:
  • Author Name: Seungjae Oh
    Affiliation: Samsung Electronics, Hwaseong, Korea
    Author URL: https://ieeexplore.ieee.org/author/37089700247
    ID: 37089700247
    Order: 1
    Author Affiliations:
    • Samsung Electronics, Hwaseong, Korea
  • Author Name: Doowon Kwon
    Affiliation: Samsung Electronics, Hwaseong, Korea
    Author URL: https://ieeexplore.ieee.org/author/37291436600
    ID: 37291436600
    Order: 2
    Author Affiliations:
    • Samsung Electronics, Hwaseong, Korea
  • Author Name: Haejung Lee
    Affiliation: Samsung Electronics, Hwaseong, Korea
    Author URL: https://ieeexplore.ieee.org/author/37089698425
    ID: 37089698425
    Order: 3
    Author Affiliations:
    • Samsung Electronics, Hwaseong, Korea
  • Author Name: Kyungtae Lim
    Affiliation: Samsung Electronics, Hwaseong, Korea
    Author URL: https://ieeexplore.ieee.org/author/37089883208
    ID: 37089883208
    Order: 4
    Author Affiliations:
    • Samsung Electronics, Hwaseong, Korea
  • Author Name: Taeyeong Kim
    Affiliation: Samsung Electronics, Hwaseong, Korea
    Author URL: https://ieeexplore.ieee.org/author/37086951934
    ID: 37086951934
    Order: 5
    Author Affiliations:
    • Samsung Electronics, Hwaseong, Korea
  • Author Name: Jae-Hyung Park
    Affiliation: Samsung Electronics, Hwaseong, Korea
    Author URL: https://ieeexplore.ieee.org/author/37089883341
    ID: 37089883341
    Order: 6
    Author Affiliations:
    • Samsung Electronics, Hwaseong, Korea
  • Author Name: Kyuha Lee
    Affiliation: Samsung Electronics, Hwaseong, Korea
    Author URL: https://ieeexplore.ieee.org/author/37086952204
    ID: 37086952204
    Order: 7
    Author Affiliations:
    • Samsung Electronics, Hwaseong, Korea
  • Author Name: Hyo Ju Kim
    Affiliation: Samsung Electronics, Hwaseong, Korea
    Author URL: https://ieeexplore.ieee.org/author/37089883462
    ID: 37089883462
    Order: 8
    Author Affiliations:
    • Samsung Electronics, Hwaseong, Korea
  • Author Name: Yoonjay Han
    Affiliation: Samsung Electronics, Hwaseong, Korea
    Author URL: https://ieeexplore.ieee.org/author/37089883269
    ID: 37089883269
    Order: 9
    Author Affiliations:
    • Samsung Electronics, Hwaseong, Korea
  • Author Name: Jae-Kyu Lee
    Affiliation: Samsung Electronics, Hwaseong, Korea
    Author URL: https://ieeexplore.ieee.org/author/37367230200
    ID: 37367230200
    Order: 10
    Author Affiliations:
    • Samsung Electronics, Hwaseong, Korea
  • Author Name: Chang-Rok Moon
    Affiliation: Samsung Electronics, Hwaseong, Korea
    Author URL: https://ieeexplore.ieee.org/author/37287589400
    ID: 37287589400
    Order: 11
    Author Affiliations:
    • Samsung Electronics, Hwaseong, Korea
  • Author Name: Jaihyuk Song
    Affiliation: Samsung Electronics, Hwaseong, Korea
    Author URL: https://ieeexplore.ieee.org/author/37348950200
    ID: 37348950200
    Order: 12
    Author Affiliations:
    • Samsung Electronics, Hwaseong, Korea

Image Sensor

• sensor_type: CMOS
• resolution: Not specified
• dynamic_range: Not specified
• pixel_size: 1.8 µm
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: Applications in smartphones, medical devices, and automotive systems for imaging purposes.
• benefits: Enhanced functionality of pixel transistors, ultrahigh-capacity capacitors, improved pixel integration, high performance.

Supporting Organizations

• supported_by: Samsung Electronics

Manuscript Details

• publication_date: 22-25 May 2023

Relevancy Score

• score: 9
• missing_fields:
  • resolution
  • dynamic_range
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_01533384-f5e1-4c3b-9734-614b51df1735-development_of_3layer_stacked_global_shutter_cmos_image_sensor_with_pixel_pitch_cutocu_interconnection_and_highcapacity_capacitors.json