Design Tools For The 3D Roadmap

• doi: 10.1109/3DIC.2009.5306521
• title: Design tools for the 3D roadmap
• publisher: IEEE
• isbn: 978-1-4244-4512-7
• issn:
• partnum: 09EX2915
• rank: 2206
• access_type: LOCKED
• content_type: Conferences
• abstract: 3D TSV technology will soon be widely available and consumer products with embedded TSVs will be the norm rather than the exception. The roadmap envisioned by most for 3D development shows CMOS image sensors and TSVs as mainstream items in 2009 with heterogeneous stacked systems and logic-on-memory following in 2010 and 2011. By 2015, we expect to see complex embedded devices combining sensors, CPUs, and memories. This roadmap is, however, conditioned on the appropriate 3D design software being available. We present the fundamental elements required for a true 3D design flow. We discuss the requirements for standards, design for manufacturing and test guidelines, and tools needed to solve today's as well as tomorrow's problem. Alongside the 3D technology roadmap we propose a 3D EDA roadmap that will have to be followed in parallel if progress is to continue at the anticipated pace.
• article_number: 5306521
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5306521
• html_url: https://ieeexplore.ieee.org/document/5306521/
• abstract_url: https://ieeexplore.ieee.org/document/5306521/
• publication_title: 2009 IEEE International Conference on 3D System Integration
• conference_location: San Francisco, CA, USA
• conference_dates: 28-30 Sept. 2009
• publication_number: 5290624
• is_number: 5306519
• publication_year: 2009
• publication_date: 28-30 Sept. 2009
• start_page: 1
• end_page: 4
• citing_paper_count: 5
• citing_patent_count: 0
• download_count: 396
• insert_date: 20091030
• index_terms:
  • ieee_terms:
    • Through-silicon vias
    • Production
    • Electronic design automation and methodology
    • Prototypes
    • CMOS technology
    • CMOS image sensors
    • Manufacturing
    • Consumer products
    • Software design
    • Testing
  • dynamic_index_terms:
    • Design Tool
    • Ideal Tool
    • 3D Technology
    • Design Flow
    • 3D Design
    • Design Manufacturing
    • True 3D
    • Near Future
    • Commercial Products
    • 3D System
    • Test Design
    • 3D Architecture
    • Physical Design
    • 3D Flow
    • 3D Stacks
    • 3D Tool
    • 3D Integration
    • Stacking Process
    • Ideal Flow
• isbn_formats:
  • format: CD, value: 978-1-4244-4512-7, isbnType: New-2005
  • format: Print ISBN, value: 978-1-4244-4511-0, isbnType: New-2005
• authors:
  • Author Name: L. McIlrath
    Affiliation: R3 Logic, Inc., Waltham, MA, USA
    Author URL: https://ieeexplore.ieee.org/author/37323715100
    ID: 37323715100
    Order: 1
    Author Affiliations:
    • R3 Logic, Inc., Waltham, MA, USA
  • Author Name: W. Ahmed
    Affiliation: R3 Logic, Inc., Waltham, MA, USA
    Author URL: https://ieeexplore.ieee.org/author/37089147917
    ID: 37089147917
    Order: 2
    Author Affiliations:
    • R3 Logic, Inc., Waltham, MA, USA
  • Author Name: A. Yip
    Affiliation: R3 Logic, Inc., Waltham, MA, USA
    Author URL: https://ieeexplore.ieee.org/author/37679374400
    ID: 37679374400
    Order: 3
    Author Affiliations:
    • R3 Logic, Inc., Waltham, MA, USA

Image Sensor

• sensor_type: CMOS
• resolution: Not specified
• dynamic_range: Not specified
• pixel_size: Not specified
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: Details about cell imaging applications not specified.
• benefits: Not specified

Supporting Organizations

• supported_by: NCSU 3D group, ST Microelectronics, DARPA

Manuscript Details

• publication_date: 28-30 Sept. 2009

Relevancy Score

• score: 8
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise
  • cell_imaging
  • benefits

Processed JSON Filename

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