Delamination Analysis And Reliability Design For Cmos Image Sensors Packages

• doi: 10.1109/ICEPT.2013.6756522
• title: Delamination analysis and reliability design for CMOS image sensors packages
• publisher: IEEE
• isbn: 978-1-4799-0498-3
• issn:
• rank: 2066
• access_type: LOCKED
• content_type: Conferences
• abstract: Through-silicon via (TSV) technology known as the core of the next generation of 3D integration has drawn more and more attention. However, due to its high cost and yield problems, it has not been used widely. Nevertheless, TSV is becoming a main stream interconnect method for CIS (CMOS image sensors) packaging. In order to assess the reliability behavior of typical CMOS image sensor such as delamination during CIS packaging and reliability testing, CSP packages are subjected to JEDEC reliability test to identify the failure modes and failure locations. According to the subsequent cross-section analysis, delamination occurs between the bonding attach and oxide layer. The glass crack after reliability test is observed, the crack propagates from the interface between the glass and cavity wall into the interior of the glass. Regarding the experimental results, a plane strain finite element model (FEM) is established to study the underlying mechanisms of reliability problems. According to the FEM results, the maximum shear stress in cavity wall occurs at the outside interface between cavity wall and the glass. The maximum shear stress in bonding attach occurs at the outside interface between the bonding attach and oxide layer. Besides, the maximum stress occurs in the low-temperature phase, which is correlated well with the SEM results. Based on the FEM analysis, the influence of geometric parameters such as the height and width of cavity wall, the thickness of the backside SMF, the thickness of silicon are also investigated to develop the guidelines for CIS packaging design.
• article_number: 6756522
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6756522
• html_url: https://ieeexplore.ieee.org/document/6756522/
• abstract_url: https://ieeexplore.ieee.org/document/6756522/
• publication_title: 2013 14th International Conference on Electronic Packaging Technology
• conference_location: Dalian, China
• conference_dates: 11-14 Aug. 2013
• publication_number: 6745316
• is_number: 6756403
• publication_year: 2013
• publication_date: 11-14 Aug. 2013
• start_page: 507
• end_page: 511
• citing_paper_count: 0
• citing_patent_count: 0
• download_count: 541
• insert_date: 20140306
• index_terms:
  • ieee_terms:
    • Cavity resonators
    • Glass
    • Stress
    • Reliability
    • Finite element analysis
    • Silicon
    • Bonding
  • author_terms:
    • CIS
    • Through-silicon-via(TSV)
    • Delamination
    • Finite element method
  • dynamic_index_terms:
    • Delamination
    • Image Sensor
    • Camera Sensor
    • Scanning Electron Microscopy
    • Finite Element
    • Shear Stress
    • Reliability Test
    • Finite Element Model
    • FE Model
    • Oxide Layer
    • Maximum Stress
    • Design Guidelines
    • Scanning Electron Microscopy Results
    • Maximum Shear Stress
    • Low-temperature Phase
    • Glass Wall
    • Problems Of High Cost
    • Relative Humidity
    • Preconditioning
    • Finite Element Method
    • Thermal Expansion
    • Coefficient Of Thermal Expansion
    • Stress Intensity
    • Lower Levels Of Stress
    • Mirror Symmetry
    • Symmetry Plane
    • Reflection Symmetry
    • Mirror-symmetric
    • Photolithography Process
    • Sensor Behavior
    • Sense Of Behaviour
    • Temperature Cycles
• isbn_formats:
  • format: Electronic ISBN, value: 978-1-4799-0498-3, isbnType: New-2005
• authors:
  • Author Name: Wu Wei
    Affiliation: College of Mechanical Engineering and Applied Electronics Technology Beijing University of Technology, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/38561813400
    ID: 38561813400
    Order: 1
    Author Affiliations:
    • College of Mechanical Engineering and Applied Electronics Technology Beijing University of Technology, Beijing, China
  • Author Name: Qin Fei
    Affiliation: College of Mechanical Engineering and Applied Electronics Technology Beijing University of Technology, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37690124700
    ID: 37690124700
    Order: 2
    Author Affiliations:
    • College of Mechanical Engineering and Applied Electronics Technology Beijing University of Technology, Beijing, China
  • Author Name: Zhu Wenhui
    Affiliation: Packaging Technology Research Institute Tian Shui Hua Tian Technology Co. LTD, Tianshui, China
    Author URL: https://ieeexplore.ieee.org/author/38479411300
    ID: 38479411300
    Order: 3
    Author Affiliations:
    • Packaging Technology Research Institute Tian Shui Hua Tian Technology Co. LTD, Tianshui, China

Image Sensor

• sensor_type: CMOS
• resolution: Not specified in the paper
• dynamic_range: Not specified in the paper
• pixel_size: Not specified in the paper
• dark_current: Not specified in the paper

Optical Data

• focal_length: Not specified in the paper
• aperture: Not specified in the paper
• field_of_view: Not specified in the paper
• distortion: Not specified in the paper

Performance Metrics

• frame_rate: Not specified in the paper
• signal_to_noise_ratio: Not specified in the paper
• sensitivity: Not specified in the paper
• shutter_speed: Not specified in the paper
• power_consumption: Not specified in the paper
• noise: Not specified in the paper

Applications & Benefits

• cell_imaging: CMOS image sensors are used in a variety of applications such as smartphones, medical devices, automotive systems, and high-end cameras.
• benefits: Faster, smaller, more integrated, and more power-efficient compared to CCD sensors.

Supporting Organizations

• supported_by: National Natural Science Foundation of China (NSFC) under the Grant No. 11272018.

Manuscript Details

• publication_date: 11-14 Aug. 2013

Relevancy Score

• score: 8
• missing_fields:
  • fill factor
  • quantum efficiency
  • readout speed
  • temporal noise
  • fixed-pattern noise
  • analog-to-digital conversion techniques
  • microlenses
  • on-chip colour filters
  • global or rolling shutters
  • backside illumination

Processed JSON Filename

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