Cmoscompatible Timeofflight 3D Imaging Sensors And Systems

• doi: 10.1109/ASICON52560.2021.9620308
• title: CMOS-Compatible Time-of-Flight 3D Imaging Sensors and Systems
• publisher: IEEE
• isbn: 978-1-6654-1149-3
• issn: 2162-7541
• rank: 1875
• access_type: LOCKED
• content_type: Conferences
• abstract: This paper describes the operation principle of Time-of-Flight (ToF) sensors and systems for 3D imaging. It starts with an overview of the simplest ToF sensors formed by traditional photogate and pinned photodiode pixels readily available in a standard CMOS process. The performance limitations of such pixels are explained, leading to more advanced sensor structures such as the current assisted photonic demodulator (CAPD) and gate assisted photonic demodulator (GAPD), wherein both use an electric field to guide carriers and achieve a more effective signal modulation. To overcome the tradeoff between modulation contrast and power consumption for mobile ToF applications, a junction assisted photonic demodulator (JAPD) pixel architecture is proposed and experimentally demonstrated. Finally, the design of the readout circuit of a ToF pixel is discussed.
• article_number: 9620308
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9620308
• html_url: https://ieeexplore.ieee.org/document/9620308/
• abstract_url: https://ieeexplore.ieee.org/document/9620308/
• publication_title: 2021 IEEE 14th International Conference on ASIC (ASICON)
• conference_location: Kunming, China
• conference_dates: 26-29 Oct. 2021
• publication_number: 9620208
• is_number: 9620199
• publication_year: 2021
• publication_date: 26-29 Oct. 2021
• start_page: 1
• end_page: 4
• citing_paper_count: 0
• citing_patent_count: 0
• download_count: 307
• insert_date: 20211201
• index_terms:
  • ieee_terms:
    • Image sensors
    • Three-dimensional displays
    • Power demand
    • Logic gates
    • Sensor systems
    • Photodiodes
    • Optoelectronic and photonic sensors
  • dynamic_index_terms:
    • Imaging System
    • 3D Images
    • Image Sensor
    • Camera Sensor
    • 3D Imaging System
    • 3D-image Sensors
    • Power Consumption
    • Readout Circuit
    • Time-of-flight Sensors
    • Time Of Flight Camera
    • Time-of-flight Camera
    • PIN Photodiode
    • Light-emitting Diodes
    • LED Light
    • Light Emission
    • LEDs
    • Phase Shift
    • Phase Difference
    • Modulation Frequency
    • Optical Absorption
    • Near-infrared
    • Optical Signal
    • Low Power Consumption
    • Photogenerated Electrons
    • Major Carrier
    • High Power Consumption
    • Single-photon Avalanche Diode
    • Single Photon Avalanche Diode
    • Integration Stage
    • Gate Oxide
    • Gate-oxide
    • Pulse Emission
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 978-1-6654-1149-3, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-6654-3867-4, isbnType: New-2005
• authors:
  • Author Name: Shun-Qi Dai
    Affiliation: Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
    Author URL: https://ieeexplore.ieee.org/author/37089174584
    ID: 37089174584
    Order: 1
    Author Affiliations:
    • Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
    • Thrust of Artificial Intelligence, The Hong Kong University of Science and Technology (Guangzhou), Guangzhou, China
    • CCESS - AI Chip Center for Emerging Smart Systems, Hong Kong Science Park, Hong Kong, China
  • Author Name: Cristine Jin Estrada
    Affiliation: Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
    Author URL: https://ieeexplore.ieee.org/author/37087469021
    ID: 37087469021
    Order: 2
    Author Affiliations:
    • Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
  • Author Name: An-Nan Xiong
    Affiliation: Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
    Author URL: https://ieeexplore.ieee.org/author/37089174345
    ID: 37089174345
    Order: 3
    Author Affiliations:
    • Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
    • CCESS - AI Chip Center for Emerging Smart Systems, Hong Kong Science Park, Hong Kong, China
  • Author Name: Chen Xu
    Affiliation: SmartSens Technology, San Jose, CA
    Author URL: https://ieeexplore.ieee.org/author/37087468196
    ID: 37087468196
    Order: 4
    Author Affiliations:
    • SmartSens Technology, San Jose, CA
  • Author Name: Jie George Yuan
    Affiliation: Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
    Author URL: https://ieeexplore.ieee.org/author/37089168988
    ID: 37089168988
    Order: 5
    Author Affiliations:
    • Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
    • CCESS - AI Chip Center for Emerging Smart Systems, Hong Kong Science Park, Hong Kong, China
  • Author Name: Mansun Chan
    Affiliation: Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
    Author URL: https://ieeexplore.ieee.org/author/37275216900
    ID: 37275216900
    Order: 6
    Author Affiliations:
    • Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
    • CCESS - AI Chip Center for Emerging Smart Systems, Hong Kong Science Park, Hong Kong, China

Image Sensor

• sensor_type: CMOS
• resolution: 320x240
• dynamic_range: Not specified
• pixel_size: 10 µm
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

• power_consumption: 4 orders of magnitude lower than CAPD

Applications & Benefits

• cell_imaging: CMOS image sensors are suitable for a variety of applications including automotive systems and gesture control interfaces.
• benefits: Enable low-cost 3D imaging with high accuracy and low power consumption.

Supporting Organizations

• supported_by: ACCESS – AI Chip Center for Emerging Smart Systems, sponsored by Innovation and Technology Fund (ITF), Hong Kong SAR.

Manuscript Details

• publication_date: 26-29 Oct. 2021

Relevancy Score

• score: 9
• missing_fields:
  • dynamic_range
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • noise

Processed JSON Filename

request_a14d6df8-078e-481d-9839-7ab5c49cbbbf-cmoscompatible_timeofflight_3d_imaging_sensors_and_systems.json