Cmos Imager Technology Shrinks And Image Performance

• doi: 10.1109/WMED.2004.1297338
• title: CMOS imager technology shrinks and image performance
• publisher: IEEE
• isbn: 0-7803-8369-9
• issn:
• partnum: 04EX810
• rank: 1853
• access_type: LOCKED
• content_type: Conferences
• abstract: In this paper, we present a performance summary of CMOS imager pixels from 5.2 /spl mu/m to 4.2 /spl mu/m using 0.18 /spl mu/m imager design rules, then to 3.2 /spl mu/m using 0.15 /spl mu/m imager design rules. These pixels support 1.3-megapixel, 2.0-megapixel, and 3.1-megapixel CMOS image sensors for digital still cameral (DSC) applications at 3.3 V, respectively. The 4TC pixels are all based on technology shrinks of Micron's 2P3M imager process, and each of the technology nodes report excellent CMOS imager low-noise, high-sensitivity, low-lag, and low-light performance, matching that of state-of-the-art charged-coupled device (CCD) imagers. We have put a model in place to provide the predictive performance of smaller pixels, and then use that model to discuss performance expectations down to 2.0 /spl mu/m pixels. With the combination of imager design rules, pixel architecture, and process technology tailored for CMOS imagers, we see no fundamental reason that CMOS imagers should not be able to continue matching CCD performance as pixel sizes shrink.
• article_number: 1297338
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=1297338
• html_url: https://ieeexplore.ieee.org/document/1297338/
• abstract_url: https://ieeexplore.ieee.org/document/1297338/
• publication_title: 2004 IEEE Workshop on Microelectronics and Electron Devices
• conference_location: Boise, ID, USA
• conference_dates: 16-16 April 2004
• publication_number: 9087
• is_number: 28845
• publication_year: 2004
• publication_date: 16-16 April 2004
• start_page: 7
• end_page: 18
• citing_paper_count: 27
• citing_patent_count: 17
• download_count: 1357
• insert_date: 20040927
• index_terms:
  • ieee_terms:
    • CMOS technology
    • Pixel
    • CMOS process
    • Charge coupled devices
    • CMOS image sensors
    • Semiconductor device noise
    • Random access memory
    • Semiconductor device modeling
    • Predictive models
    • Design optimization
  • dynamic_index_terms:
    • CCD Camera
    • Charge-coupled Device
    • Pixel Size
    • Placement Model
    • Crosstalk
    • Small Area
    • Spot Size
    • Focal Length
    • Focal Distance
    • Quantum Efficiency
    • Analog-to-digital Converter
    • Analog-to-digital
    • Digital-to-analog Converter
    • Supply Voltage
    • Sub-pixel
    • Fill Factor
    • Technological Issues
    • Engineering Issues
    • Dark Current
    • Camera Lens
    • Camera Lenses
    • Charge Capacity
    • Field Edge
    • Gate Oxide
    • Microlenses
    • Micro Lens
    • Blue Pixels
    • Conversion Gain
    • Lens Design
    • Design Of Lenses
    • Angular Response
    • Signal-to-noise
    • Signal-to-noise Ratio
• isbn_formats:
  • format: Print ISBN, value: 0-7803-8369-9, isbnType: Historical
• authors:
  • Author Name: H. Rhodes
    Affiliation: Micron Technology, Inc., Boise, ID, USA
    Author URL: https://ieeexplore.ieee.org/author/37088612977
    ID: 37088612977
    Order: 1
    Author Affiliations:
    • Micron Technology, Inc., Boise, ID, USA
  • Author Name: G. Agranov
    Affiliation: Micron Technology, Inc., Boise, ID, USA
    Author URL: https://ieeexplore.ieee.org/author/37946122400
    ID: 37946122400
    Order: 2
    Author Affiliations:
    • Micron Technology, Inc., Boise, ID, USA
  • Author Name: C. Hong
    Affiliation: Micron Technology, Inc., Boise, ID, USA
    Author URL: https://ieeexplore.ieee.org/author/37089118630
    ID: 37089118630
    Order: 3
    Author Affiliations:
    • Micron Technology, Inc., Boise, ID, USA
  • Author Name: U. Boettiger
    Affiliation: Micron Technology, Inc., Boise, ID, USA
    Author URL: https://ieeexplore.ieee.org/author/37088604909
    ID: 37088604909
    Order: 4
    Author Affiliations:
    • Micron Technology, Inc., Boise, ID, USA
  • Author Name: R. Mauritzson
    Affiliation: Micron Technology, Inc., Boise, ID, USA
    Author URL: https://ieeexplore.ieee.org/author/38075655900
    ID: 38075655900
    Order: 5
    Author Affiliations:
    • Micron Technology, Inc., Boise, ID, USA
  • Author Name: J. Ladd
    Affiliation: Micron Technology, Inc., Boise, ID, USA
    Author URL: https://ieeexplore.ieee.org/author/37683774500
    ID: 37683774500
    Order: 6
    Author Affiliations:
    • Micron Technology, Inc., Boise, ID, USA
  • Author Name: I. Karasev
    Affiliation: Micron Technology, Inc., Boise, ID, USA
    Author URL: https://ieeexplore.ieee.org/author/37088604771
    ID: 37088604771
    Order: 7
    Author Affiliations:
    • Micron Technology, Inc., Boise, ID, USA
  • Author Name: J. McKee
    Affiliation: Micron Technology, Inc., Boise, ID, USA
    Author URL: https://ieeexplore.ieee.org/author/37713252600
    ID: 37713252600
    Order: 8
    Author Affiliations:
    • Micron Technology, Inc., Boise, ID, USA
  • Author Name: E. Jenkins
    Affiliation: Micron Technology, Inc., Boise, ID, USA
    Author URL: https://ieeexplore.ieee.org/author/37088604707
    ID: 37088604707
    Order: 9
    Author Affiliations:
    • Micron Technology, Inc., Boise, ID, USA
  • Author Name: W. Quinlin
    Affiliation: Micron Technology, Inc., Boise, ID, USA
    Author URL: https://ieeexplore.ieee.org/author/37088604729
    ID: 37088604729
    Order: 10
    Author Affiliations:
    • Micron Technology, Inc., Boise, ID, USA
  • Author Name: I. Patrick
    Affiliation: Micron Technology, Inc., Boise, ID, USA
    Author URL: https://ieeexplore.ieee.org/author/37088604615
    ID: 37088604615
    Order: 11
    Author Affiliations:
    • Micron Technology, Inc., Boise, ID, USA
  • Author Name: J. Li
    Affiliation: Micron Technology, Inc., Boise, ID, USA
    Author URL: https://ieeexplore.ieee.org/author/37964088400
    ID: 37964088400
    Order: 12
    Author Affiliations:
    • Micron Technology, Inc., Boise, ID, USA
  • Author Name: X. Fan
    Affiliation: Micron Technology, Inc., Boise, ID, USA
    Author URL: https://ieeexplore.ieee.org/author/37692193300
    ID: 37692193300
    Order: 13
    Author Affiliations:
    • Micron Technology, Inc., Boise, ID, USA
  • Author Name: R. Panicacci
    Affiliation: Micron Technology, Inc., Boise, ID, USA
    Author URL: https://ieeexplore.ieee.org/author/37620189200
    ID: 37620189200
    Order: 14
    Author Affiliations:
    • Micron Technology, Inc., Boise, ID, USA
  • Author Name: S. Smith
    Affiliation: Micron Technology, Inc., Boise, ID, USA
    Author URL: https://ieeexplore.ieee.org/author/37089095305
    ID: 37089095305
    Order: 15
    Author Affiliations:
    • Micron Technology, Inc., Boise, ID, USA
  • Author Name: C. Mouli
    Affiliation: Micron Technology, Inc., Boise, ID, USA
    Author URL: https://ieeexplore.ieee.org/author/37267421200
    ID: 37267421200
    Order: 16
    Author Affiliations:
    • Micron Technology, Inc., Boise, ID, USA
  • Author Name: J. Bruce
    Affiliation: Micron Technology, Inc., Boise, ID, USA
    Author URL: https://ieeexplore.ieee.org/author/37088604717
    ID: 37088604717
    Order: 17
    Author Affiliations:
    • Micron Technology, Inc., Boise, ID, USA

Image Sensor

• sensor_type: CMOS
• resolution: 3.1 megapixel (2048(H) x 1536(V))
• dynamic_range: 72.9 dB
• pixel_size: 3.2 µm
• dark_current: 15 e-/s at 25°C

Optical Data

• focal_length: not specified
• aperture: f/2.8
• field_of_view: not specified
• distortion: not specified

Performance Metrics

• frame_rate: 12 fps
• signal_to_noise_ratio: 45.2 dB
• sensitivity: 0.93 V/(lux-s)
• noise: 7.5 e-

Applications & Benefits

• cell_imaging: not specified
• benefits: Excellent low-light performance, low-noise and high-sensitivity attributes, matching that of state-of-the-art CCD imagers.

Supporting Organizations

• supported_by: Micron Technology, Inc.

Manuscript Details

• publication_date: 16-16 April 2004

Relevancy Score

• score: 9
• missing_fields:
  • readout speed
  • temporal noise
  • fixed-pattern noise
  • microlenses
  • on-chip colour filters
  • global or rolling shutters
  • backside illumination

Processed JSON Filename

request_f71886dc-ae20-45fb-ab5c-4c1ca76af1b7-cmos_imager_technology_shrinks_and_image_performance.json