Cmos Image Sensor Using Pixel Aperture Technique For Singlechip 2D And 3D Imaging

• doi: 10.1109/ICSENS.2017.8234113
• title: CMOS image sensor using pixel aperture technique for single-chip 2D and 3D imaging
• publisher: IEEE
• isbn: 978-1-5090-1013-4
• issn:
• rank: 1830
• access_type: LOCKED
• content_type: Conferences
• abstract: This paper presents a CMOS image sensor that uses the pixel aperture technique for extracting depth information while producing conventional 2D images. In conventional image sensors, the aperture is located at the camera lens. However, in the proposed image sensor, the aperture is integrated on the CMOS image sensor chip and is formed at a metal layer of the CMOS process. The pixel array of the proposed image sensor, used for extracting color and depth information, is composed of four different types of pixels - white pixels with aperture, blue pixels, green pixels, and white pixels without aperture. The size of the pixel, which is based on a four-transistor active pixel sensor with pinned photodiode, is 2.8 μm × 2.8 μm. A prototype of the proposed image sensor was fabricated using the 0.11 μm CMOS image sensor process, and the feasibility of the pixel aperture technique was verified.
• article_number: 8234113
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8234113
• html_url: https://ieeexplore.ieee.org/document/8234113/
• abstract_url: https://ieeexplore.ieee.org/document/8234113/
• publication_title: 2017 IEEE SENSORS
• conference_location: Glasgow, UK
• conference_dates: 29 Oct.-1 Nov. 2017
• publication_number: 8169642
• is_number: 8233862
• publication_year: 2017
• publication_date: 29 Oct.-1 Nov. 2017
• start_page: 1
• end_page: 3
• citing_paper_count: 4
• citing_patent_count: 0
• download_count: 1634
• insert_date: 20171225
• index_terms:
  • ieee_terms:
    • Apertures
    • Cameras
    • CMOS image sensors
    • Lenses
    • Photodiodes
    • Three-dimensional displays
  • author_terms:
    • CMOS
    • image sensor
    • pixel aperture
    • depth information
    • 3D image
  • dynamic_index_terms:
    • 3D Images
    • 2D Images
    • Image Sensor
    • Camera Sensor
    • Pixel Aperture
    • Metal Layer
    • Depth Information
    • Camera Lens
    • Camera Lenses
    • White Pixels
    • Pixel Array
    • Blue Pixels
    • Sensor Pixel
    • PIN Photodiode
    • Complex Systems
    • Time-of-flight
    • Analog-to-digital Converter
    • Analog-to-digital
    • Digital-to-analog Converter
    • Point Spread Function
    • Structured Illumination
    • Structured Light
    • Output Image
    • Stereopsis
    • Stereovision
    • Stereoscopic Vision
    • External Light Source
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 978-1-5090-1013-4, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-5090-1012-7, isbnType: New-2005
• authors:
  • Author Name: Byoung-Soo Choi
    Affiliation: School of Electronics Engineering, Kyungpook National University, Korea
    Author URL: https://ieeexplore.ieee.org/author/37085467553
    ID: 37085467553
    Order: 1
    Author Affiliations:
    • School of Electronics Engineering, Kyungpook National University, Korea
  • Author Name: Sang-Hwan Kim
    Affiliation: School of Electronics Engineering, Kyungpook National University, Korea
    Author URL: https://ieeexplore.ieee.org/author/37086042022
    ID: 37086042022
    Order: 2
    Author Affiliations:
    • School of Electronics Engineering, Kyungpook National University, Korea
  • Author Name: Jimin Lee
    Affiliation: School of Electronics Engineering, Kyungpook National University, Korea
    Author URL: https://ieeexplore.ieee.org/author/37086264339
    ID: 37086264339
    Order: 3
    Author Affiliations:
    • School of Electronics Engineering, Kyungpook National University, Korea
  • Author Name: Seunghyuk Chang
    Affiliation: School of Electronics Engineering, Kyungpook National University, Korea
    Author URL: https://ieeexplore.ieee.org/author/37086267326
    ID: 37086267326
    Order: 4
    Author Affiliations:
    • School of Electronics Engineering, Kyungpook National University, Korea
  • Author Name: JongHo Park
    Affiliation: School of Electronics Engineering, Kyungpook National University, Korea
    Author URL: https://ieeexplore.ieee.org/author/37085661138
    ID: 37085661138
    Order: 5
    Author Affiliations:
    • School of Electronics Engineering, Kyungpook National University, Korea
  • Author Name: Sang-Jin Lee
    Affiliation: School of Electronics Engineering, Kyungpook National University, Korea
    Author URL: https://ieeexplore.ieee.org/author/37086269570
    ID: 37086269570
    Order: 6
    Author Affiliations:
    • School of Electronics Engineering, Kyungpook National University, Korea
  • Author Name: Jang-Kyoo Shin
    Affiliation: School of Electronics Engineering, Kyungpook National University, Korea
    Author URL: https://ieeexplore.ieee.org/author/37288996500
    ID: 37288996500
    Order: 7
    Author Affiliations:
    • School of Electronics Engineering, Kyungpook National University, Korea

Image Sensor

• sensor_type: CMOS
• resolution: 1632 (H) × 1124 (V)
• dynamic_range: Not specified
• pixel_size: 2.8 µm × 2.8 µm
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Diameter of pixel aperture 0.9 µm
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

• frame_rate: 30 frames per second (fps)

Applications & Benefits

• cell_imaging: Not specified
• benefits: Can produce both 2D and 3D images using depth information, useful for motion detection, gesture recognition, and object reconstruction.

Supporting Organizations

• supported_by: Ministry of Science, ICT & Future Planning, BK21 Plus project funded by the Ministry of Education, Korea

Manuscript Details

• publication_date: 29 Oct.-1 Nov. 2017

Relevancy Score

• score: 9
• missing_fields:
  • dynamic_range
  • dark_current
  • quantum_efficiency
  • fill_factor
  • noise
  • microlenses
  • on-chip colour filters
  • global or rolling shutters
  • backside illumination

Processed JSON Filename

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