Chipbased Heterointegration Technology For Highperformance 3D Stacked Image Sensor

• doi: 10.1109/ICSJ.2012.6523452
• title: Chip-based hetero-integration technology for high-performance 3D stacked image sensor
• publisher: IEEE
• isbn: 978-1-4673-2653-7
• issn:
• partnum: 12EX7456
• rank: 1936
• access_type: LOCKED
• content_type: Conferences
• abstract: We have developed a 3D-stacked image sensor chip composed of CMOS image sensor (CIS) layer, correlated double sampling circuit (CDS) layer, and analog-to-digital converter (ADC) array layer using the chip-based 3D heterogeneous integration technology. Three kinds of chips, CIS chip, CDS chip, and ADC chip, which were fabricated by different technologies, are processed and stacked vertically to form a prototype 3D-stacked image sensor. Through-Si vias (TSVs) and metal micro-bumps are formed in chip-level before stacking. The fundamental characteristics are evaluated in the fabricated prototype 3D-stacked image sensor.
• article_number: 6523452
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6523452
• html_url: https://ieeexplore.ieee.org/document/6523452/
• abstract_url: https://ieeexplore.ieee.org/document/6523452/
• publication_title: 2012 2nd IEEE CPMT Symposium Japan
• conference_location: Kyoto, Japan
• conference_dates: 10-12 Dec. 2012
• publication_number: 6520952
• is_number: 6523374
• publication_year: 2012
• publication_date: 10-12 Dec. 2012
• start_page: 1
• end_page: 4
• citing_paper_count: 5
• citing_patent_count: 0
• download_count: 315
• insert_date: 20130606
• index_terms:
  • dynamic_index_terms:
    • Image Sensor
    • Camera Sensor
    • Chip-based Technology
    • Analog-to-digital Converter
    • Analog-to-digital
    • Digital-to-analog Converter
    • Heterogeneous Integration
    • Multichip Module
    • Sensor Layer
    • Image Processing
    • Vertical Direction
    • Electroplating
    • Electrochemical Deposition
    • CMOS Technology
    • Metal Lines
    • Landing Pad
    • 3D Integration
• isbn_formats:
  • format: CD, value: 978-1-4673-2653-7, isbnType: New-2005
  • format: Print ISBN, value: 978-1-4673-2654-4, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-4673-2655-1, isbnType: New-2005
• authors:
  • Author Name: Yuki Ohara
    Affiliation: Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37390858100
    ID: 37390858100
    Order: 1
    Author Affiliations:
    • Tohoku University, Sendai, Japan
  • Author Name: Kang Wook Lee
    Affiliation: Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37407640200
    ID: 37407640200
    Order: 2
    Author Affiliations:
    • Tohoku University, Sendai, Japan
  • Author Name: Koji Kiyoyama
    Affiliation: Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37327656500
    ID: 37327656500
    Order: 3
    Author Affiliations:
    • Tohoku University, Sendai, Japan
    • Nagasaki Institute of Applied Science, Sendai, Japan
  • Author Name: Shigehide Konno
    Affiliation: Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/38575511200
    ID: 38575511200
    Order: 4
    Author Affiliations:
    • Tohoku University, Sendai, Japan
  • Author Name: Yutaka Sato
    Affiliation: Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37290223300
    ID: 37290223300
    Order: 5
    Author Affiliations:
    • Tohoku University, Sendai, Japan
  • Author Name: Shuichi Watanabe
    Affiliation: Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37088138170
    ID: 37088138170
    Order: 6
    Author Affiliations:
    • Tohoku University, Sendai, Japan
  • Author Name: Atsushi Yabata
    Affiliation: Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/38132463100
    ID: 38132463100
    Order: 7
    Author Affiliations:
    • Tohoku University, Sendai, Japan
  • Author Name: Harufumi Kobayashi
    Affiliation: ASET, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37857576900
    ID: 37857576900
    Order: 8
    Author Affiliations:
    • ASET, Sendai, Japan
  • Author Name: Tadashi Kamada
    Affiliation: ASET, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/38468919700
    ID: 38468919700
    Order: 9
    Author Affiliations:
    • ASET, Sendai, Japan
  • Author Name: Jichel Bea
    Affiliation: Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37393017200
    ID: 37393017200
    Order: 10
    Author Affiliations:
    • Tohoku University, Sendai, Japan
  • Author Name: Mariappan Murugesan
    Affiliation: Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37322536300
    ID: 37322536300
    Order: 11
    Author Affiliations:
    • Tohoku University, Sendai, Japan
  • Author Name: Hiroyuki Hashimoto
    Affiliation: Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/38569020700
    ID: 38569020700
    Order: 12
    Author Affiliations:
    • Tohoku University, Sendai, Japan
  • Author Name: Takafumi. Fukushima
    Affiliation: Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37396820300
    ID: 37396820300
    Order: 13
    Author Affiliations:
    • Tohoku University, Sendai, Japan
  • Author Name: Tetsu. Tanaka
    Affiliation: Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37403329200
    ID: 37403329200
    Order: 14
    Author Affiliations:
    • Tohoku University, Sendai, Japan
  • Author Name: Mitsumasa. Koyanagi
    Affiliation: Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37283392400
    ID: 37283392400
    Order: 15
    Author Affiliations:
    • Tohoku University, Sendai, Japan

Image Sensor

• sensor_type: CMOS
• resolution: 320x240
• dynamic_range: not specified
• pixel_size: 10µm×10µm
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

• frame_rate: 1385 fps
• shutter_speed: 100µs
• power_consumption: 381µW
• noise: 8.6% of peak value (FPN reduced by CDS circuits)

Applications & Benefits

• cell_imaging: not specified
• benefits: not specified

Supporting Organizations

• supported_by: NEDO, METI

Manuscript Details

• publication_date: 10-12 Dec. 2012

Relevancy Score

• score: 9
• missing_fields:
  • fill factor
  • quantum efficiency
  • readout speed
  • microlenses
  • on-chip colour filters
  • global or rolling shutters
  • backside illumination

Processed JSON Filename

request_4890583d-5831-41b7-8804-0de0fb1efc73-chipbased_heterointegration_technology_for_highperformance_3d_stacked_image_sensor.json