Characterization Of Chiplevel Heterointegration Technology For Highspeed Highly Parallel 3Dstacked Image Processing System

• doi: 10.1109/IEDM.2012.6479156
• title: Characterization of chip-level hetero-integration technology for high-speed, highly parallel 3D-stacked image processing system
• publisher: IEEE
• isbn: 978-1-4673-4870-6
• issn: 0163-1918
• partnum: 12CH39038
• rank: 1921
• access_type: LOCKED
• content_type: Conferences
• abstract: We demonstrate the chip-based 3D heterogeneous integration technology for realizing highly parallel 3D-stacked image sensor. Three kinds of chips, CMOS image sensor chip, analog circuit chip, and ADC array chip, which were fabricated by different technologies, are processed and stacked vertically to form a prototype 3D-stacked image sensor. Through-Si vias (TSVs) and metal micro-bumps are formed in chip-level before stacking. The fundamental characteristics are evaluated in the fabricated prototype 3D-stacked image sensor.
• article_number: 6479156
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6479156
• html_url: https://ieeexplore.ieee.org/document/6479156/
• abstract_url: https://ieeexplore.ieee.org/document/6479156/
• publication_title: 2012 International Electron Devices Meeting
• conference_location: San Francisco, CA
• conference_dates: 10-13 Dec. 2012
• publication_number: 6471855
• is_number: 6478950
• publication_year: 2012
• publication_date: 10-13 Dec. 2012
• start_page: 33.2.1
• end_page: 33.2.4
• citing_paper_count: 12
• citing_patent_count: 0
• download_count: 505
• insert_date: 20130314
• index_terms:
  • ieee_terms:
    • Image sensors
    • Silicon
    • Image processing
    • Through-silicon vias
    • Tin
    • Prototypes
  • dynamic_index_terms:
    • Image Processing
    • Parallel Imaging
    • Image Sensor
    • Camera Sensor
    • Heterogeneous Integration
    • Multichip Module
    • High Speed
    • Vertical Direction
    • Spin-coated
    • Frame Rate
    • Analog-to-digital Converter
    • Analog-to-digital
    • Digital-to-analog Converter
    • Function Of Layer
    • Electroplating
    • Electrochemical Deposition
    • Electrical Connection
    • Chip Surface
    • Metal Wire
    • 3D Integration
• isbn_formats:
  • format: Online ISBN, value: 978-1-4673-4870-6, isbnType: New-2005
  • format: Print ISBN, value: 978-1-4673-4872-0, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-4673-4871-3, isbnType: New-2005
• authors:
  • Author Name: K-W Lee
    Affiliation: New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37407640200
    ID: 37407640200
    Order: 1
    Author Affiliations:
    • New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan
  • Author Name: Y. Ohara
    Affiliation: Graduate School of Biomedical Engineering, Tohoku University, Japan
    Author URL: https://ieeexplore.ieee.org/author/37390858100
    ID: 37390858100
    Order: 2
    Author Affiliations:
    • Graduate School of Biomedical Engineering, Tohoku University, Japan
  • Author Name: K. Kiyoyama
    Affiliation: New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37327656500
    ID: 37327656500
    Order: 3
    Author Affiliations:
    • New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan
    • Department of Electrical and Electronics Engineering, Nagasaki Institute of Applied Science, Japan
  • Author Name: S. Konno
    Affiliation: New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/38575511200
    ID: 38575511200
    Order: 4
    Author Affiliations:
    • New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan
  • Author Name: Y. Sato
    Affiliation: Tohoku Daigaku, Sendai, Miyagi, JP
    Author URL: https://ieeexplore.ieee.org/author/37290223300
    ID: 37290223300
    Order: 5
    Author Affiliations:
    • Tohoku Daigaku, Sendai, Miyagi, JP
  • Author Name: S. Watanabe
    Affiliation: Association of Super-Advanced Electronics Technologies, Japan
    Author URL: https://ieeexplore.ieee.org/author/37088138170
    ID: 37088138170
    Order: 6
    Author Affiliations:
    • Association of Super-Advanced Electronics Technologies, Japan
  • Author Name: A. Yabata
    Affiliation: Association of Super-Advanced Electronics Technologies, Japan
    Author URL: https://ieeexplore.ieee.org/author/38132463100
    ID: 38132463100
    Order: 7
    Author Affiliations:
    • Association of Super-Advanced Electronics Technologies, Japan
  • Author Name: T. Kamada
    Affiliation: Association of Super-Advanced Electronics Technologies, Japan
    Author URL: https://ieeexplore.ieee.org/author/38468919700
    ID: 38468919700
    Order: 8
    Author Affiliations:
    • Association of Super-Advanced Electronics Technologies, Japan
  • Author Name: J-C Bea
    Affiliation: New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37393017200
    ID: 37393017200
    Order: 9
    Author Affiliations:
    • New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan
  • Author Name: H. Hashimoto
    Affiliation: New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/38569020700
    ID: 38569020700
    Order: 10
    Author Affiliations:
    • New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan
  • Author Name: M. Murugesan
    Affiliation: New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37322536300
    ID: 37322536300
    Order: 11
    Author Affiliations:
    • New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan
  • Author Name: T. Fukushima
    Affiliation: New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37396820300
    ID: 37396820300
    Order: 12
    Author Affiliations:
    • New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan
  • Author Name: T. Tanaka
    Affiliation: Graduate School of Biomedical Engineering, Tohoku University, Japan
    Author URL: https://ieeexplore.ieee.org/author/37403329200
    ID: 37403329200
    Order: 13
    Author Affiliations:
    • Graduate School of Biomedical Engineering, Tohoku University, Japan
  • Author Name: M. Koyanagi
    Affiliation: New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37283392400
    ID: 37283392400
    Order: 14
    Author Affiliations:
    • New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan

Image Sensor

• sensor_type: CMOS
• resolution: 320x240
• dynamic_range:
• pixel_size: 10µm x 10µm
• dark_current:

Optical Data

• focal_length:
• aperture:
• field_of_view:
• distortion:

Performance Metrics

• frame_rate: 10000 fps
• signal_to_noise_ratio:
• sensitivity:
• shutter_speed:
• power_consumption:
• noise:

Applications & Benefits

• cell_imaging: High-speed image processing for digital pixel sensor (DPS) applications
• benefits: Combines high pixel resolution with small chip size to achieve high frame rates.

Supporting Organizations

• supported_by: New Energy and Industrial Organization, Development of Functionally Innovative 3D-Integrated Circuit project.

Manuscript Details

• publication_date: 10-13 Dec. 2012

Relevancy Score

• score: 10
• missing_fields:
  • fill factor
  • quantum efficiency
  • noise sources
  • readout speed
  • analog-to-digital conversion techniques
  • microlenses
  • on-chip colour filters
  • global or rolling shutters
  • backside illumination

Processed JSON Filename

request_4894383e-7026-4af9-b709-547469863bf7-characterization_of_chiplevel_heterointegration_technology_for_highspeed_highly_parallel_3dstacked_image_processing_system.json