Bist Of Interconnection Lines In The Pixel Matrix Of Cmos Imagers

• doi: 10.1109/IWASI.2013.6576068
• title: BIST of interconnection lines in the pixel matrix of CMOS imagers
• publisher: IEEE
• isbn: 978-1-4799-0039-8
• issn:
• rank: 1699
• access_type: LOCKED
• content_type: Conferences
• abstract: Interconnection lines in the sensors of CMOS imagers are used for pixel bias, addressing and readout. Catastrophic faults in these lines can cause parts of the pixel matrix to operate incorrectly and produce image defects like residual stripes and bands in images. These kinds of image defects are often difficult to remove by the image processing correction algorithm, and they are clearly visible as a sort of noise pattern. Among the defects in the pixel array, these catastrophic faults have most important influence on yield. In addition, partially degraded metal lines cannot be detected on todays' standard industrial testers for image sensors. These defects can evolve into catastrophic faults and they are the main cause of customer returns for many products. This paper proposes two built-in self-test (BIST) solutions to catch these defects in the pixel array, taking into account the industrial test constraints, namely increase of fault coverage, decrease of test time and test cost minimization.
• article_number: 6576068
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6576068
• html_url: https://ieeexplore.ieee.org/document/6576068/
• abstract_url: https://ieeexplore.ieee.org/document/6576068/
• publication_title: 5th IEEE International Workshop on Advances in Sensors and Interfaces IWASI
• conference_location: Bari, Italy
• conference_dates: 13-14 June 2013
• publication_number: 6573223
• is_number: 6576045
• publication_year: 2013
• publication_date: 13-14 June 2013
• start_page: 174
• end_page: 177
• citing_paper_count: 1
• citing_patent_count: 3
• download_count: 107
• insert_date: 20130808
• index_terms:
  • ieee_terms:
    • Delays
    • Circuit faults
    • Voltage measurement
    • Photodiodes
    • Electrical resistance measurement
    • System-on-chip
    • Table lookup
  • author_terms:
    • CMOS image sensors
    • industrial test
    • HFPN
  • dynamic_index_terms:
    • Pixel Matrix
    • Pixel Matrices
    • Interconnection Lines
    • Built-in Self-test
    • Built-in Test
    • Image Processing
    • Image Sensor
    • Camera Sensor
    • Pixel Array
    • Metal Lines
    • Current Source
    • Current Regulations
    • Short-circuit
    • Cause Of Failure
    • Voltage Drop
    • Potential Drop
    • IR Drop
    • Analog-to-digital Converter
    • Analog-to-digital
    • Digital-to-analog Converter
    • Resistance Measurements
    • Open Circuit
    • Image Capture
    • Pulse Generator
    • Pulse Propagation
    • Reference Line
    • Capacitive Coupling
    • AC-coupled
    • Electrostatic Coupling
    • Propagation Delay
    • System-on-chip
    • Pulse Detection
    • Failure Analysis
    • PIN Photodiode
• isbn_formats:
  • format: Print ISBN, value: 978-1-4799-0039-8, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-4799-0041-1, isbnType: New-2005
• authors:
  • Author Name: Richun Fei
    Affiliation: STMicroelectronics, Crolles, FR
    Author URL: https://ieeexplore.ieee.org/author/37073019700
    ID: 37073019700
    Order: 1
    Author Affiliations:
    • STMicroelectronics, Crolles, FR
  • Author Name: Jocelyn Moreau
    Affiliation: STMicroelectronics, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37662780300
    ID: 37662780300
    Order: 2
    Author Affiliations:
    • STMicroelectronics, Grenoble, France
  • Author Name: Salvador Mir
    Affiliation: TIMA Laboratory (CNRS, Grenoble INP), UJF, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37273490100
    ID: 37273490100
    Order: 3
    Author Affiliations:
    • TIMA Laboratory (CNRS, Grenoble INP), UJF, Grenoble, France

Image Sensor

• sensor_type: CMOS
• resolution: not specified
• dynamic_range: not specified
• pixel_size: not specified
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

Applications & Benefits

• cell_imaging: used in applications such as smartphones, medical devices, and automotive systems.
• benefits: enable digital imaging.

Supporting Organizations

• supported_by: STMicroelectronics, TIMA Laboratory (CNRS/Grenoble INP/UJF)

Manuscript Details

• publication_date: 13-14 June 2013

Relevancy Score

• score: 9
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_3783a46a-7f96-4779-8f13-fc2dec31e89b-bist_of_interconnection_lines_in_the_pixel_matrix_of_cmos_imagers.json