Aurichsnbi Interconnection In Chiponmodule Package

• doi: 10.1109/ECTC.2019.00018
• title: Au-Rich/Sn-Bi Interconnection in Chip-on-Module Package
• publisher: IEEE
• isbn: 978-1-7281-1500-9
• issn: 0569-5503
• rank: 1687
• access_type: LOCKED
• content_type: Conferences
• abstract: A new package structure for CMOS image sensor (CIS) is proposed as COM (Chip on Module), based on a novel soldering wire bonding technique whose second bond point is achieved by soldering with the help of eutectic Sn-57Bi solder paste, forming the Au-rich/Sn-Bi interconnection which is the focus of this paper. The reliability of the interconnection has been confirmed by functional tests, pull tests and interfacial observation after high temperature and humidity storage (THS) reliability tests at 85°C/85%RH for 120h, 240h, 480h and 1000h. All COM packaged samples have passed the camera functional tests after aging. The tensile strengths of the gold wires, which have finished soldering wire bonding, always maintain above 9 grams during aging, which is higher than the standard strength in conventional wire bonding (8 grams). Furthermore, as for the interfacial structures in Au/Sn-Bi couple, AuSn and AuSn2 are found at the interface, whose thickness can be described as a parabolic relationship with the annealing time, suggesting a bulk diffusion controlling mechanism. Besides, the effects of 0.3%~0.35% Ag addition, in Sn-57Bi solder, on the reliability of the interconnection have also been investigated. Owing to the barrier effects of Ag and Ag3Sn on the diffusion of Au atoms into Sn-contained solder, a more reliable joint has been obtained during aging, with a higher tensile strength (above 19 grams), thinner IMC thickness (20%~30% thinner) and unobvious Kirkendall voids at the interface.
• article_number: 8811179
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8811179
• html_url: https://ieeexplore.ieee.org/document/8811179/
• abstract_url: https://ieeexplore.ieee.org/document/8811179/
• publication_title: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
• conference_location: Las Vegas, NV, USA
• conference_dates: 28-31 May 2019
• publication_number: 8795274
• is_number: 8811008
• publication_year: 2019
• publication_date: 28-31 May 2019
• start_page: 69
• end_page: 75
• citing_paper_count: 1
• citing_patent_count: 0
• download_count: 232
• insert_date: 20190826
• index_terms:
  • ieee_terms:
    • Wires
    • Reliability
    • Gold
    • Soldering
    • Bonding
    • Aging
    • Temperature measurement
  • author_terms:
    • Chip on Module package
    • soldering wire bonding
    • Au-rich/Sn-Bi interconnection
    • tensile strengths
    • IMC
  • dynamic_index_terms:
    • Function Tests
    • Tensile Strength
    • Reliability Test
    • High Humidity
    • Image Sensor
    • Camera Sensor
    • High Storage
    • Diffusion Controlled
    • Diffusion Of Atoms
    • Gold Wire
    • High-temperature Storage
    • Parabolic Relationship
    • High-temperature Test
    • Scanning Electron Microscopy
    • Straight Line
    • Grain Boundaries
    • Aging Time
    • Age Time
    • Matrix Material
    • Optical Performance
    • Refiner
    • Solder Joints
    • Bi Content
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 978-1-7281-1500-9, isbnType: New-2005
  • format: USB ISBN, value: 978-1-7281-1498-9, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-7281-1499-6, isbnType: New-2005
• authors:
  • Author Name: Jin Wang
    Affiliation: Department of Microelectronics and Nanoelectronics, Tsinghua University, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37086471047
    ID: 37086471047
    Order: 1
    Author Affiliations:
    • Department of Microelectronics and Nanoelectronics, Tsinghua University, Beijing, China
  • Author Name: Qian Wang
    Affiliation: Department of Microelectronics and Nanoelectronics, Tsinghua University, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37291370900
    ID: 37291370900
    Order: 2
    Author Affiliations:
    • Department of Microelectronics and Nanoelectronics, Tsinghua University, Beijing, China
  • Author Name: Xinnan Hou
    Affiliation: GalaxyCore Inc., Shanghai, China
    Author URL: https://ieeexplore.ieee.org/author/37086471666
    ID: 37086471666
    Order: 3
    Author Affiliations:
    • GalaxyCore Inc., Shanghai, China
  • Author Name: Ke Du
    Affiliation: GalaxyCore Inc., Shanghai, China
    Author URL: https://ieeexplore.ieee.org/author/37086470601
    ID: 37086470601
    Order: 4
    Author Affiliations:
    • GalaxyCore Inc., Shanghai, China
  • Author Name: Lixin Zhao
    Affiliation: GalaxyCore Inc., Shanghai, China
    Author URL: https://ieeexplore.ieee.org/author/37086953634
    ID: 37086953634
    Order: 5
    Author Affiliations:
    • GalaxyCore Inc., Shanghai, China
  • Author Name: Jian Cai
    Affiliation: Department of Microelectronics and Nanoelectronics, Tsinghua University, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37291518200
    ID: 37291518200
    Order: 6
    Author Affiliations:
    • Department of Microelectronics and Nanoelectronics, Tsinghua University, Beijing, China

Image Sensor

• sensor_type: CMOS
• resolution: not specified
• dynamic_range: not specified
• pixel_size: not specified
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

Applications & Benefits

• cell_imaging: Wide use of CMOS image sensors in consumer products like digital cameras and smartphones.
• benefits: Benefits include improved optical performance and decreased module size.

Supporting Organizations

• supported_by: Tsinghua University, GalaxyCore Inc.

Manuscript Details

• publication_date: 28-31 May 2019

Relevancy Score

• score: 10
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_acffd6f1-ed42-4d90-aef5-0fc8fd8a45ed-aurichsnbi_interconnection_in_chiponmodule_package.json