Analysis Of Roomtemperature Bonded Compliant Bump With Ultrasonic Bonding

• doi: 10.1109/ECTC.2014.6897627
• title: Analysis of room-temperature bonded compliant bump with ultrasonic bonding
• publisher: IEEE
• isbn: 978-1-4799-2407-3
• issn: 2377-5726
• rank: 1643
• access_type: LOCKED
• content_type: Conferences
• abstract: Room temperature microjoining of Au or Cu bumps in the air ambient has been achieved by bonding cone-shaped microbumps with ultrasonic application. This technology has been applied to fabrication of near infrared (NIR) image sensor of q-VGA (quarter video graphic array) resolution, where InGaAs/InP photosensor array is joined with CMOS read out in the pixel level and, therefore, low temperature bonding is strongly required to address problems caused by mismatch in thermal expansion of the two materials. In this work, we investigate bonding mechanism of the cone shaped microbump using bumps made of Au. Die shear tests shows that shear strength of the bonded chips is proportional to the bonded contact area of the bump and that room temperature bonding gives sufficient bonding strength for applications while bonding at elevated temperature results in higher bonding strength. Analysis of change in bump height shows that “softening” of Au bump takes place under the application of ultrasonic vibration. Transmission electron microscopy shows that crystal grains at the bonded interface transform to small crystallites.
• article_number: 6897627
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6897627
• html_url: https://ieeexplore.ieee.org/document/6897627/
• abstract_url: https://ieeexplore.ieee.org/document/6897627/
• publication_title: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
• conference_location: Orlando, FL, USA
• conference_dates: 27-30 May 2014
• publication_number: 6884273
• is_number: 6897249
• publication_year: 2014
• publication_date: 27-30 May 2014
• start_page: 2303
• end_page: 2307
• citing_paper_count: 5
• citing_patent_count: 0
• download_count: 189
• insert_date: 20140915
• index_terms:
  • ieee_terms:
    • Bonding
    • Acoustics
    • Gold
    • Vibrations
    • Scanning electron microscopy
    • Heating
    • Image coding
  • dynamic_index_terms:
    • Softening
    • Bond Strength
    • Bond Energy
    • Thermal Expansion
    • Coefficient Of Thermal Expansion
    • Near-infrared
    • Image Sensor
    • Camera Sensor
    • Changes In Height
    • Ultrasonic Vibration
    • Crystal Grains
    • Flip-chip
    • Microbumps
    • Thermal Expansion Mismatch
    • Scanning Electron Microscopy
    • Scanning Electron Microscopy Images
    • Contact Angle
    • Counter Electrode
    • Auxiliary Electrode
    • Photolithography
    • Optical Lithography
    • Photoresist
    • Scanning Electron Microscopy Observations
    • Vibration Amplitude
    • Near-infrared Imaging
    • Metal Bond
    • Crystal Texture
    • Crystalline Texture
• isbn_formats:
  • format: Electronic ISBN, value: 978-1-4799-2407-3, isbnType: New-2005
• authors:
  • Author Name: Keiichiro Iwanabe
    Affiliation: Graduate School of Information Science and Electrical Engineering, Kyushu University, Nishi-ku, Fukuoka, Japan
    Author URL: https://ieeexplore.ieee.org/author/38261212600
    ID: 38261212600
    Order: 1
    Author Affiliations:
    • Graduate School of Information Science and Electrical Engineering, Kyushu University, Nishi-ku, Fukuoka, Japan
  • Author Name: Takanori Shuto
    Affiliation: Graduate School of Information Science and Electrical Engineering, Kyushu University, Nishi-ku, Fukuoka, Japan
    Author URL: https://ieeexplore.ieee.org/author/38029937600
    ID: 38029937600
    Order: 2
    Author Affiliations:
    • Graduate School of Information Science and Electrical Engineering, Kyushu University, Nishi-ku, Fukuoka, Japan
  • Author Name: Tanemasa Asano
    Affiliation: Graduate School of Information Science and Electrical Engineering, Kyushu University, Nishi-ku, Fukuoka, Japan
    Author URL: https://ieeexplore.ieee.org/author/37277985700
    ID: 37277985700
    Order: 3
    Author Affiliations:
    • Graduate School of Information Science and Electrical Engineering, Kyushu University, Nishi-ku, Fukuoka, Japan

Image Sensor

• sensor_type: CMOS
• resolution: 320 x 256 (q-VGA)
• dynamic_range: Not specified
• pixel_size: Not specified
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: Near infrared (NIR) image sensors are used for various applications, including security and medical imaging.
• benefits: Room temperature bonding allows for integration of heterogeneous materials, enhancing imaging capabilities without thermal stress.

Supporting Organizations

• supported_by: JST Adaptable and Seamless Technology transfer Program, METI Japan

Manuscript Details

• publication_date: 27-30 May 2014

Relevancy Score

• score: 10
• missing_fields:
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_27f32e9f-d709-465b-a4a9-c741a4c08bf0-analysis_of_roomtemperature_bonded_compliant_bump_with_ultrasonic_bonding.json