Analysis And Optimization Of The Packaging Process For Supper Largesize Cmos Image Sensor

• doi: 10.1109/ICEPT56209.2022.9873369
• title: Analysis and Optimization of the Packaging Process for Supper Large-size CMOS Image Sensor
• publisher: IEEE
• isbn: 978-1-6654-9906-4
• issn:
• rank: 1621
• access_type: LOCKED
• content_type: Conferences
• abstract: The large-size CMOS image sensing chip has problems such as chip warpage and poor bond strength in the chip bonding process of the COB packaging scheme so the final package cannot meet the reliability requirements. In this paper, the package structure of a 63mm CMOS image sensor is optimized, the glue material and process parameters are further studied, and the chip warpage problem is solved, so that the chip warpage is finally within 5μm. According to the optimization result of chip warpage within 5μm, the final thickness of the glue was selected to be 0.02mm, and four different glue patterns are designed on the basis of the final thickness of the glue of 0.02mm, which are double rectangle, cross shape, star shape, and new star shape. These glue patterns were analyzed using fluid-structure interaction simulation so that the final void rate of the glue was less than 7%. It meets the technical requirements and reliability requirements of the image sensor for the package.
• article_number: 9873369
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9873369
• html_url: https://ieeexplore.ieee.org/document/9873369/
• abstract_url: https://ieeexplore.ieee.org/document/9873369/
• publication_title: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
• conference_location: Dalian, China
• conference_dates: 10-13 Aug. 2022
• publication_number: 9872527
• is_number: 9872536
• publication_year: 2022
• publication_date: 10-13 Aug. 2022
• start_page: 1
• end_page: 5
• citing_paper_count: 0
• citing_patent_count: 0
• download_count: 174
• insert_date: 20220909
• index_terms:
  • ieee_terms:
    • Technical requirements
    • Thermal expansion
    • Shape
    • Stars
    • Packaging
    • Rubber
    • Reliability
  • author_terms:
    • CMOS image sensor
    • analysis and optimization
    • glue pattern
  • dynamic_index_terms:
    • Image Sensor
    • Camera Sensor
    • Packaging Process
    • Bond Strength
    • Bond Energy
    • Material Parameters
    • Star-shaped
    • Fluid-structure Interaction
    • Fluid Structure Interaction
    • Double Cross
    • Final Package
    • Young’s Modulus
    • Elastic Modulus
    • Tensile Modulus
    • Finite Element
    • Finite-element
    • Thermal Expansion
    • Coefficient Of Thermal Expansion
    • Expansion Coefficient
    • Influence Of Properties
    • Influence Of Attributes
    • Influence Of Dimensions
    • Orthogonal Test
    • Processor Chip
    • Large Chip
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 978-1-6654-9906-4, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-6654-9905-7, isbnType: New-2005
• authors:
  • Author Name: Dan Zheng
    Affiliation: School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
    Author URL: https://ieeexplore.ieee.org/author/37089031112
    ID: 37089031112
    Order: 1
    Author Affiliations:
    • School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
  • Author Name: Daoguo Yang
    Affiliation: School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
    Author URL: https://ieeexplore.ieee.org/author/37281508700
    ID: 37281508700
    Order: 2
    Author Affiliations:
    • School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
  • Author Name: Kun Chen
    Affiliation: School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
    Author URL: https://ieeexplore.ieee.org/author/37089521341
    ID: 37089521341
    Order: 3
    Author Affiliations:
    • School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
  • Author Name: Xindon Chen
    Affiliation: School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
    Author URL: https://ieeexplore.ieee.org/author/37089519554
    ID: 37089519554
    Order: 4
    Author Affiliations:
    • School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
  • Author Name: Yuhang Zhang
    Affiliation: School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
    Author URL: https://ieeexplore.ieee.org/author/37089519026
    ID: 37089519026
    Order: 5
    Author Affiliations:
    • School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
  • Author Name: Xiaojun Li
    Affiliation: School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
    Author URL: https://ieeexplore.ieee.org/author/37089520987
    ID: 37089520987
    Order: 6
    Author Affiliations:
    • School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China

Image Sensor

• sensor_type: CMOS
• resolution: 63mm
• dynamic_range: Not specified
• pixel_size: Not specified
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: Used in camera products.
• benefits: Improved image quality due to better photosensitivity and lower signal-to-noise ratio with larger sensors.

Supporting Organizations

• supported_by: Key R & D Plan Project of Guangxi Province (grant No. GuiKe AB20159038)

Manuscript Details

• publication_date: 10-13 Aug. 2022

Relevancy Score

• score: 8
• missing_fields:
  • fill factor
  • quantum efficiency
  • readout speed
  • noise sources
  • analog-to-digital conversion techniques
  • microlenses
  • on-chip colour filters
  • global or rolling shutters
  • backside illumination

Processed JSON Filename

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