Alice Its3 Technology Qualification Results On Prototype Sensor Structures Of Novel Bent Wafer Scale 65Nm Cmos Sensors

• doi: 10.1109/NSSMICRTSD49126.2023.10338255
• title: ALICE ITS3: Technology Qualification Results on Prototype Sensor Structures of Novel Bent Wafer Scale 65nm CMOS Sensors
• publisher: IEEE
• isbn: 979-8-3503-3867-6
• issn: 1082-3654
• rank: 1360
• access_type: LOCKED
• content_type: Conferences
• abstract: The ALICE collaboration is currently developing a new vertex detector ("ITS3"), which is planned to be installed in 2026 - 2028 during LHC long shutdown 3 to replace the three innermost layers (Inner Barrel) of the current Inner Tracking System as from Run 4 onwards. ITS3 is based on a truly innovative concept, comprising the use of ultra-thin (50 micrometers) silicon wafers and stitching technologies in 65nm CMOS imaging process to produce large area (10cm x 26cm) Monolithic Active Pixels Sensors sensors which can be bent to half-cylindrical shapes of 18, 24 and 30 mm bending radii for layer 0, 1 and 2 respectively. The ITS3 will thus be built of six stitched sensors kept in place using slices of carbon foam. Together with a very low power consumption of about 20mV/cm2 allowing for air cooling, no further mechanical and electrical support structures are required, resulting in an extermely low material budget of less than 0.05\% of a radiation length per layer, providing extremely good tracking and vertexing capabilities.Within the comprehensive R\&D program for the ITS3 different analogue and digital test structures with various pixel pitch sizes, matrices and readout circuits have been produced and extensively tested in various particle beams before and after irradiation with TID and NIEL to validate the ITS3 technology approachIn this contribution we present an overview on the various prototypes and selected results on the detection performancve measurements in the laboratory and in test beams using various chip settings.
• article_number: 10338255
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10338255
• html_url: https://ieeexplore.ieee.org/document/10338255/
• abstract_url: https://ieeexplore.ieee.org/document/10338255/
• publication_title: 2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD)
• conference_location: Vancouver, BC, Canada
• conference_dates: 4-11 Nov. 2023
• publication_number: 10337770
• is_number: 10337807
• publication_year: 2023
• publication_date: 4-11 Nov. 2023
• start_page: 1
• end_page: 1
• citing_paper_count: 0
• citing_patent_count: 0
• download_count: 27
• insert_date: 20231213
• index_terms:
  • ieee_terms:
    • Particle beams
    • Semiconductor device measurement
    • Particle beam measurements
    • Shape
    • Semiconductor detectors
    • Prototypes
    • CMOS image sensors
  • dynamic_index_terms:
    • 65-nm CMOS
    • Tracking System
    • Tracking Devices
    • Silicon Wafer
    • Bending Radius
    • Bending Radii
    • Beam Test
    • Readout Circuit
    • Radiation Length
    • Irradiated Length
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 979-8-3503-3867-6, isbnType: New-2005
  • format: Electronic ISBN, value: 979-8-3503-3866-9, isbnType: New-2005
• authors:
  • Author Name: H. Hillemanns
    Affiliation: CERN, Geneva, Switzerland
    Author URL: https://ieeexplore.ieee.org/author/37296091500
    ID: 37296091500
    Order: 1
    Author Affiliations:
    • CERN, Geneva, Switzerland

Image Sensor

• sensor_type: CMOS
• resolution: 10cm x 26cm
• dynamic_range: not specified
• pixel_size: not specified
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

• power_consumption: 20mV/cm²

Applications & Benefits

• cell_imaging: not specified
• benefits: Extremely low material budget of less than 0.05% of a radiation length per layer, providing extremely good tracking and vertexing capabilities.

Supporting Organizations

• supported_by: CERN, Geneva, Switzerland

Manuscript Details

• publication_date: 4-11 Nov. 2023

Relevancy Score

• score: 8
• missing_fields:
  • fill factor
  • quantum efficiency
  • readout speed
  • noise sources
  • analog-to-digital conversion techniques
  • design considerations

Processed JSON Filename

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