Aggressive Pitch Scaling Sub05 M Of W2w Hybrid Bonding Through Process Innovations

• doi: 10.1109/ECTC51909.2023.00010
• title: Aggressive Pitch Scaling (sub-0.5 μm) of W2W Hybrid Bonding Through Process Innovations
• publisher: IEEE
• isbn: 979-8-3503-3499-9
• issn: 0569-5503
• rank: 1422
• access_type: LOCKED
• content_type: Conferences
• abstract: 3D integration of dissimilar wafers through metal interconnect hybrid bonding has become common practice in industry from CMOS image sensors to 3D NAND memory at $> \mathbf{1}\boldsymbol{\mu} \mathbf{m}$ pitches. Advanced 3D integration nodes requiring pitch scaling to $\mathbf{sub}-\mathbf{0.5}\boldsymbol{\mu} \mathbf{m}$ face significant challenges in process control and material limitations. In this paper, through the use of advanced 300mm toolsets and process innovations we study the importance layout design, bonding dielectric, copper CMP recess control, and bonding overlay control to produce a high-quality bond interface at sub-500nm pitches. We also examined at which copper design density the material system begins to fail.
• article_number: 10195528
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10195528
• html_url: https://ieeexplore.ieee.org/document/10195528/
• abstract_url: https://ieeexplore.ieee.org/document/10195528/
• publication_title: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
• conference_location: Orlando, FL, USA
• conference_dates: 30 May-2 June 2023
• publication_number: 10195193
• is_number: 10195244
• publication_year: 2023
• publication_date: 30 May-2 June 2023
• start_page: 13
• end_page: 18
• citing_paper_count: 14
• citing_patent_count: 0
• download_count: 1243
• insert_date: 20230803
• index_terms:
  • ieee_terms:
    • Technological innovation
    • Three-dimensional displays
    • Process control
    • Packaging
    • Dielectrics
    • Copper
    • Transistors
  • author_terms:
    • Hybrid bonding
    • pitch scaling
    • 3D packaging
    • CMP
    • recess control
    • bond overlay
    • bond interface
  • dynamic_index_terms:
    • Innovation Process
    • Aggression Scale
    • Material Systems
    • Flash Memory
    • Flash Storage
    • Common Practice In Industry
    • Common Industrial Practice
    • 3D Integration
    • Higher Density
    • Atomic Force Microscopy
    • Bond Strength
    • Bond Energy
    • Range Of Densities
    • Tetraethyl Orthosilicate
    • Tetraethoxysilane
    • TEOS
    • Queuing Time
    • Bond Quality
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 979-8-3503-3499-9, isbnType: New-2005
  • format: Electronic ISBN, value: 979-8-3503-3498-2, isbnType: New-2005
• authors:
  • Author Name: Tyler Sherwood
    Affiliation: Applied Materials, Albany, NY, USA
    Author URL: https://ieeexplore.ieee.org/author/37089420924
    ID: 37089420924
    Order: 1
    Author Affiliations:
    • Applied Materials, Albany, NY, USA
  • Author Name: Raghuveer Patlolla
    Affiliation: Applied Materials, Albany, NY, USA
    Author URL: https://ieeexplore.ieee.org/author/37085593005
    ID: 37085593005
    Order: 2
    Author Affiliations:
    • Applied Materials, Albany, NY, USA
  • Author Name: Joe Salfelder
    Affiliation: Applied Materials, Albany, NY, USA
    Author URL: https://ieeexplore.ieee.org/author/37088603724
    ID: 37088603724
    Order: 3
    Author Affiliations:
    • Applied Materials, Albany, NY, USA
  • Author Name: Thomas Kasbauer
    Affiliation: EV Group, St. Florian am Inn, Austria
    Author URL: https://ieeexplore.ieee.org/author/37089970394
    ID: 37089970394
    Order: 4
    Author Affiliations:
    • EV Group, St. Florian am Inn, Austria
  • Author Name: Raghav Sreenivasan
    Affiliation: Applied Materials, Santa Clara, CA, USA
    Author URL: https://ieeexplore.ieee.org/author/37089692968
    ID: 37089692968
    Order: 5
    Author Affiliations:
    • Applied Materials, Santa Clara, CA, USA
  • Author Name: Kun Li
    Affiliation: Applied Materials, Albany, NY, USA
    Author URL: https://ieeexplore.ieee.org/author/37089981702
    ID: 37089981702
    Order: 6
    Author Affiliations:
    • Applied Materials, Albany, NY, USA
  • Author Name: Ryan Ley
    Affiliation: Applied Materials, Santa Clara, CA, USA
    Author URL: https://ieeexplore.ieee.org/author/37089980368
    ID: 37089980368
    Order: 7
    Author Affiliations:
    • Applied Materials, Santa Clara, CA, USA
  • Author Name: Gernot Probst
    Affiliation: EV Group, St. Florian am Inn, Austria
    Author URL: https://ieeexplore.ieee.org/author/37089947010
    ID: 37089947010
    Order: 8
    Author Affiliations:
    • EV Group, St. Florian am Inn, Austria
  • Author Name: Jason Appell
    Affiliation: Applied Materials, Albany, NY, USA
    Author URL: https://ieeexplore.ieee.org/author/37089984848
    ID: 37089984848
    Order: 9
    Author Affiliations:
    • Applied Materials, Albany, NY, USA
  • Author Name: Ki Cheol Ahn
    Affiliation: Applied Materials, Albany, NY, USA
    Author URL: https://ieeexplore.ieee.org/author/37089979088
    ID: 37089979088
    Order: 10
    Author Affiliations:
    • Applied Materials, Albany, NY, USA
  • Author Name: Masha Gorchichko
    Affiliation: Applied Materials, Santa Clara, CA, USA
    Author URL: https://ieeexplore.ieee.org/author/37089988115
    ID: 37089988115
    Order: 11
    Author Affiliations:
    • Applied Materials, Santa Clara, CA, USA
  • Author Name: Thomas Uhrmann
    Affiliation: EV Group, St. Florian am Inn, Austria
    Author URL: https://ieeexplore.ieee.org/author/37394992300
    ID: 37394992300
    Order: 12
    Author Affiliations:
    • EV Group, St. Florian am Inn, Austria

Image Sensor

• sensor_type: CMOS
• resolution: not specified
• dynamic_range: not specified
• pixel_size: not specified
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

Applications & Benefits

• cell_imaging: CMOS image sensors are used in various applications including smartphones and medical devices.
• benefits: Enables digital imaging in a variety of applications.

Supporting Organizations

• supported_by: Applied Materials, EV Group

Manuscript Details

• publication_date: 30 May-2 June 2023

Relevancy Score

• score: 8
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_75561324-2c78-4184-b50c-347105bfc10b-aggressive_pitch_scaling_sub05_m_of_w2w_hybrid_bonding_through_process_innovations.json