Advanced Overlay Metrology For Cis Bonding Applications

• doi: 10.1109/ECTC51909.2023.00278
• title: Advanced overlay metrology for CIS bonding applications
• publisher: IEEE
• isbn: 979-8-3503-3499-9
• issn: 0569-5503
• rank: 1415
• access_type: LOCKED
• content_type: Conferences
• abstract: On-product overlay (OPO) control is becoming more and more critical to successful 3D heterogeneous process integration which includes wafer-to-wafer (W2W) bonding. In this work, we will present novel overlay (OVL) methods and experimental metrology results on an advanced CMOS Image Sensor (CIS) W2W process. We will discuss metrology challenges such as thick wafer measurement, target design, precision, and accuracy. Different target designs will be presented and evaluated with the irArcher® 007 from KLA. We will demonstrate Total Measurement Uncertainty (TMU) of 1 nm on production wafers, with Tool-Induced Shift (TIS) values comparable to the current best-in-class metrology tool for single wafer OVL measurement and suitable throughput for High-Volume Manufacturing (HVM). We will highlight the importance of such precise OVL metrology tools to address the sub-50 nm OVL challenge in sub-micron pitch, wafer-to-wafer bonding applications. Inter-field and intra-field terms will be presented. Unexpected intra-field signatures will be discussed. Finally, the impact of bonding OVL on back-side lithography steps will be introduced opening interest for Advanced Process Control (APC) loops.
• article_number: 10195808
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10195808
• html_url: https://ieeexplore.ieee.org/document/10195808/
• abstract_url: https://ieeexplore.ieee.org/document/10195808/
• publication_title: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
• conference_location: Orlando, FL, USA
• conference_dates: 30 May-2 June 2023
• publication_number: 10195193
• is_number: 10195244
• publication_year: 2023
• publication_date: 30 May-2 June 2023
• start_page: 1638
• end_page: 1643
• citing_paper_count: 1
• citing_patent_count: 0
• download_count: 701
• insert_date: 20230803
• index_terms:
  • ieee_terms:
    • Three-dimensional displays
    • Current measurement
    • Measurement uncertainty
    • Lithography
    • Process control
    • Metrology
    • Throughput
  • author_terms:
    • metrology
    • overlay (OVL)
    • bonding
    • On Product Overlay (OPO)
    • 3D Heterogeneous Integration
    • Wafer to Wafer (W2W)
    • CMOS Image Sensor (CIS)
    • More than Moore (MtM)
    • Total Measurement Uncertainty (TMU)
    • inter-field overlay
    • intra-field overlay
  • dynamic_index_terms:
    • Throughput
    • Heterogeneous Integration
    • Multichip Module
    • Lithography Step
    • Direct Dependence
    • Composite Field
    • Magnitude Of Terms
    • Magnitude Of Each Term
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 979-8-3503-3499-9, isbnType: New-2005
  • format: Electronic ISBN, value: 979-8-3503-3498-2, isbnType: New-2005
• authors:
  • Author Name: Florent Dettoni
    Affiliation: STMicroelectronics, Crolles, France
    Author URL: https://ieeexplore.ieee.org/author/37089992071
    ID: 37089992071
    Order: 1
    Author Affiliations:
    • STMicroelectronics, Crolles, France
  • Author Name: Emilie Deloffre
    Affiliation: STMicroelectronics, Crolles, France
    Author URL: https://ieeexplore.ieee.org/author/37688097800
    ID: 37688097800
    Order: 2
    Author Affiliations:
    • STMicroelectronics, Crolles, France
  • Author Name: Yoav Grauer
    Affiliation: KLA, Migdal HaEmek, Israel
    Author URL: https://ieeexplore.ieee.org/author/37089834782
    ID: 37089834782
    Order: 3
    Author Affiliations:
    • KLA, Migdal HaEmek, Israel
  • Author Name: Shlomo Eisenbach
    Affiliation: KLA, Migdal HaEmek, Israel
    Author URL: https://ieeexplore.ieee.org/author/37089995570
    ID: 37089995570
    Order: 4
    Author Affiliations:
    • KLA, Migdal HaEmek, Israel
  • Author Name: Motti Penia
    Affiliation: KLA, Migdal HaEmek, Israel
    Author URL: https://ieeexplore.ieee.org/author/37089995196
    ID: 37089995196
    Order: 5
    Author Affiliations:
    • KLA, Migdal HaEmek, Israel
  • Author Name: Arkady Simkin
    Affiliation: KLA, Migdal HaEmek, Israel
    Author URL: https://ieeexplore.ieee.org/author/37089995325
    ID: 37089995325
    Order: 6
    Author Affiliations:
    • KLA, Migdal HaEmek, Israel
  • Author Name: Dror Elka
    Affiliation: KLA, Migdal HaEmek, Israel
    Author URL: https://ieeexplore.ieee.org/author/37089992613
    ID: 37089992613
    Order: 7
    Author Affiliations:
    • KLA, Migdal HaEmek, Israel
  • Author Name: Avner Safrani
    Affiliation: KLA, Migdal HaEmek, Israel
    Author URL: https://ieeexplore.ieee.org/author/37089995344
    ID: 37089995344
    Order: 8
    Author Affiliations:
    • KLA, Migdal HaEmek, Israel
  • Author Name: Marco Polli
    Affiliation: KLA, Concorrezzo, Italy
    Author URL: https://ieeexplore.ieee.org/author/37070820600
    ID: 37070820600
    Order: 9
    Author Affiliations:
    • KLA, Concorrezzo, Italy
  • Author Name: Francesco De Paola
    Affiliation: KLA, Concorrezzo, Italy
    Author URL: https://ieeexplore.ieee.org/author/37283007200
    ID: 37283007200
    Order: 10
    Author Affiliations:
    • KLA, Concorrezzo, Italy

Image Sensor

• sensor_type: CMOS
• resolution: not specified
• dynamic_range: not specified
• pixel_size: not specified
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

Applications & Benefits

• cell_imaging: not specified
• benefits: not specified

Supporting Organizations

• supported_by: STMicroelectronics, KLA

Manuscript Details

• publication_date: 30 May-2 June 2023

Relevancy Score

• score: 8
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise
  • cell_imaging
  • benefits

Processed JSON Filename

request_96877fe6-8d9b-4547-8fb9-17132f19c82e-advanced_overlay_metrology_for_cis_bonding_applications.json