Advanced 3D Design And Technologies For 3Layer Smart Imager

• doi: 10.1109/VLSI-TSA54299.2022.9771026
• title: Advanced 3d Design and Technologies for 3-Layer Smart Imager
• publisher: IEEE
• isbn: 978-1-6654-0924-7
• issn: 1930-8868
• rank: 1409
• access_type: LOCKED
• content_type: Conferences
• abstract: CMOS Imagers have adopted 3D integration using Back-Side Illumination (BSI) technology, with 2 CMOS layers assembled using Wafer-to-Wafer and advanced Hybrid Bonding technology. Targeting innovative AI and Machine Learning application, for offering AI processing at the edge within the image sensor itself, this paper presents some new 3D design and technology solutions in order to build a 3-layer Smart Imager. The hybrid bonding technology for assembly of multi wafers with a capability below 1 µm pitch is shown as well as Through Silicon Via (TSV) of 2 µm pitch compatible with hybrid bonding. To offer Design Technology Co-Optimization (DTCO) capabilities, a Place & Route methodology is proposed with the associated PDKIT to benefit of fine pitch interconnects.
• article_number: 9771026
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9771026
• html_url: https://ieeexplore.ieee.org/document/9771026/
• abstract_url: https://ieeexplore.ieee.org/document/9771026/
• publication_title: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)
• conference_location: Hsinchu, Taiwan
• conference_dates: 18-21 April 2022
• publication_number: 9770952
• is_number: 9770961
• publication_year: 2022
• publication_date: 18-21 April 2022
• start_page: 1
• end_page: 2
• citing_paper_count: 4
• citing_patent_count: 0
• download_count: 508
• insert_date: 20220510
• index_terms:
  • ieee_terms:
    • Image sensors
    • Three-dimensional displays
    • Lighting
    • Machine learning
    • Very large scale integration
    • CMOS technology
    • Silicon
  • dynamic_index_terms:
    • 3D Technology
    • 3D Design
    • Advanced 3D
    • Machine Learning Applications
    • Image Sensor
    • Camera Sensor
    • Solution In Order
    • Μm Pitch
    • Bottom Layer
    • Design Methodology
    • Metal Layer
    • Metallic Layer
    • Back-end-of-line
    • Back End Of Line
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 978-1-6654-0924-7, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-6654-0923-0, isbnType: New-2005
• authors:
  • Author Name: Pascal Vivet
    Affiliation: CEA, List, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37298711200
    ID: 37298711200
    Order: 1
    Author Affiliations:
    • CEA, List, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Lucile Arnaud
    Affiliation: CEA, List, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37265352700
    ID: 37265352700
    Order: 2
    Author Affiliations:
    • CEA, List, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Stéphan Borel
    Affiliation: CEA, List, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37296726000
    ID: 37296726000
    Order: 3
    Author Affiliations:
    • CEA, List, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Nicolas Bresson
    Affiliation: CEA, List, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37283050000
    ID: 37283050000
    Order: 4
    Author Affiliations:
    • CEA, List, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Myriam Assous
    Affiliation: CEA, List, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37265369400
    ID: 37265369400
    Order: 5
    Author Affiliations:
    • CEA, List, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Stéphane Nicolas
    Affiliation: CEA, List, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37076327200
    ID: 37076327200
    Order: 6
    Author Affiliations:
    • CEA, List, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Gaëlle Mauguen
    Affiliation: CEA, List, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37086349053
    ID: 37086349053
    Order: 7
    Author Affiliations:
    • CEA, List, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Stéphane Moreau
    Affiliation: CEA, List, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37604277500
    ID: 37604277500
    Order: 8
    Author Affiliations:
    • CEA, List, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Mauricio Altieri
    Affiliation: CEA, List, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37946011600
    ID: 37946011600
    Order: 9
    Author Affiliations:
    • CEA, List, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Olivier Billoint
    Affiliation: CEA, List, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37397198400
    ID: 37397198400
    Order: 10
    Author Affiliations:
    • CEA, List, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Sébastien Thuriès
    Affiliation: CEA, List, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37085429531
    ID: 37085429531
    Order: 11
    Author Affiliations:
    • CEA, List, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Eric Ollier
    Affiliation: CEA, List, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37295887000
    ID: 37295887000
    Order: 12
    Author Affiliations:
    • CEA, List, Univ. Grenoble Alpes, Grenoble, France

Image Sensor

• sensor_type: CMOS
• resolution: not specified
• dynamic_range: 132dB
• pixel_size: not specified
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

• noise: 800mΩ to 1Ω per TSV (related to electrical yield on structures)

Applications & Benefits

• cell_imaging: AI processing at the edge within the image sensor.
• benefits: Reduced system latency, increased user privacy, increased energy efficiency.

Supporting Organizations

• supported_by: Programme d’Investissements d’Avenir, IRT Nanoelec

Manuscript Details

• publication_date: 18-21 April 2022

Relevancy Score

• score: 10
• missing_fields:
  • resolution
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_10d46b58-1a5d-46c1-b1cf-f4c72a643010-advanced_3d_design_and_technologies_for_3layer_smart_imager.json