Adhesive Solutions For Closed Cavity Packaging

• doi: 10.23919/EMPC55870.2023.10418291
• title: Adhesive Solutions for Closed Cavity Packaging
• publisher: IEEE
• isbn: 978-1-6654-8736-8
• issn:
• rank: 1406
• access_type: LOCKED
• content_type: Conferences
• abstract: The trend towards autonomous driving demands continuously increasing safety requirements and hence reliable components such as CMOS image sensors or communication devices. To provide such components, manufactures are facing ever greater challenges as the sensor packages need to be airtight sealed over their whole lifetime. Typical defects that can be observed when using conventional lid attach materials for closed cavity packages in tests at automotive level (e.g., according to AEC Q100) are pop-up effects and delamination. To avoid these defects and to meet the increasing reliability requirements of the semiconductor industry, DELO Industrial Adhesives has developed special adhesives that not only ensure reliable bonding while keeping narrow and high bondlines, but also improve process stability. Features such as light/heat B-stage or light fixation help to keep the attached lid in place during heat curing and other subsequent steps like temperature cycling, humidity storage and even reflow.
• article_number: 10418291
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10418291
• html_url: https://ieeexplore.ieee.org/document/10418291/
• abstract_url: https://ieeexplore.ieee.org/document/10418291/
• publication_title: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
• conference_location: Cambridge, United Kingdom
• conference_dates: 11-14 Sept. 2023
• publication_number: 10418252
• is_number: 10418244
• publication_year: 2023
• publication_date: 11-14 Sept. 2023
• start_page: 1
• end_page: 3
• citing_paper_count: 0
• citing_patent_count: 0
• download_count: 58
• insert_date: 20240209
• index_terms:
  • ieee_terms:
    • Temperature sensors
    • Temperature distribution
    • Young's modulus
    • Chemistry
    • Humidity
    • Reliability
    • Bonding
  • author_terms:
    • CMOS
    • image sensor
    • autonomous driving
    • DMS
    • LIDAR
    • ADAS
    • automotive
    • adhesive
    • bonding
    • MSL
    • closed cavity
    • airtight
    • sealed
    • AEC Q100
    • dual cure
    • B-Stage
    • reflow
  • dynamic_index_terms:
    • Airtight
    • Hermetically Sealed
    • Delamination
    • Image Sensor
    • Camera Sensor
    • Temperature Cycles
    • Temperature Changes
    • Young’s Modulus
    • Elastic Modulus
    • Tensile Modulus
    • Reliability Test
    • Complete Test
    • Curing Process
    • Hard Process
    • Solidification Process
    • Dynamic Mechanical Analysis
    • Adhesive Layer
    • Glass Filter
    • Thermomechanical Analysis
    • Development Of Adhesives
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 978-1-6654-8736-8, isbnType: New-2005
  • format: Electronic ISBN, value: 978-0-9568086-9-1, isbnType: New-2005
• authors:
  • Author Name: Patrick Schirmer
    Affiliation: Product Managernent DELO Industrial Adhesives, Windach, Germany
    Author URL: https://ieeexplore.ieee.org/author/277806431905538
    ID: 277806431905538
    Order: 1
    Author Affiliations:
    • Product Managernent DELO Industrial Adhesives, Windach, Germany
  • Author Name: Severin Ringelstetter
    Affiliation: Engineering DELO Industrial Adhesives, Windach, Germany
    Author URL: https://ieeexplore.ieee.org/author/342761127905912
    ID: 342761127905912
    Order: 2
    Author Affiliations:
    • Engineering DELO Industrial Adhesives, Windach, Germany

Image Sensor

• sensor_type: CMOS
• resolution: not specified
• dynamic_range: not specified
• pixel_size: not specified
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

Applications & Benefits

• cell_imaging: not specified
• benefits: not specified

Supporting Organizations

• supported_by: not specified

Manuscript Details

• publication_date: 11-14 Sept. 2023

Relevancy Score

• score: 9
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise
  • cell_imaging
  • benefits
  • supported_by

Processed JSON Filename

request_f1f8f337-d61a-44cb-9c27-0804257a97b3-adhesive_solutions_for_closed_cavity_packaging.json