A Novel Cmos Image Sensor Package Cover Glass White Stain Material Identification Metrology By Tofsims

• doi: 10.1109/IPFA53173.2021.9617289
• title: A Novel CMOS Image Sensor Package Cover Glass White Stain Material Identification Metrology by TOF-SIMS
• publisher: IEEE
• isbn: 978-1-6654-3989-3
• issn: 1946-1542
• rank: 862
• access_type: LOCKED
• content_type: Conferences
• abstract: The demand of CMOS Image Sensor (CIS) in consumer electronics and automotive industries is increasing from day to day in the era of Internet of Things (IoT). The search for lower production cost, shorter production lead time, higher yield of CIS package has becoming more and more challenging. Quality assurance and failure analysis play an important role to ensure high yield production. Typical CIS package failure modes are non-stick on pad (NSOP), lifted CIS die, foreign material on micro lenses, epoxy under cured and stain on cover glass. Most of these failure modes are commonly found in other packages, in this work we highlight on cover glass stain issue which may alter the incoming light intensity and refract its direction and hence producing wrong output signal which is critical when safety of user come into picture especially for automotive industry. The stain observed on cover glass is in white colour with small size, thin layer, low concentration which it difficult to be detected by most of the conventional analysis tools such as Energy Dispersive X-ray (EDX) and Fourier Transform Infrared (FTIR). Top surface analysis tools, X-ray Photoelectron Spectroscopy (XPS) and Time of Flight Secondary Ion Mass Spectrometry (TOF-SIMS) were used for the white stain failure analysis. XPS analysis was performed to analyse what is the additional elements present on the white stain as compared to a reference sample, higher Carbon (C) and Oxygen (O) were detected implying that the white stain is likely an organic based material. TOF-SIMS analysis was performed to examine the molecular information of the white stain, fatty acid compound was detected based on 267.3u, 283.3u and 285.3u fragments. Fatty acid is commonly used in die attach epoxy, the white stain on cover glass is likely formed during epoxy process that causes outgassing of volatile fragments.
• article_number: 9617289
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9617289
• html_url: https://ieeexplore.ieee.org/document/9617289/
• abstract_url: https://ieeexplore.ieee.org/document/9617289/
• publication_title: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
• conference_location: Singapore, Singapore
• conference_dates: 15 Sept.-15 Oct. 2021
• publication_number: 9617229
• is_number: 9617230
• publication_year: 2021
• publication_date: 15 Sept.-15 Oct. 2021
• start_page: 1
• end_page: 3
• citing_paper_count: 1
• citing_patent_count: 0
• download_count: 233
• insert_date: 20211129
• index_terms:
  • ieee_terms:
    • Industries
    • Failure analysis
    • Glass
    • Production
    • Tools
    • CMOS image sensors
    • Internet of Things
  • author_terms:
    • Failure Analysis
    • TOF-SIMS
    • XPS
    • CMOS image sensors
    • thin stain
  • dynamic_index_terms:
    • Glass Slides
    • Microscope Slides
    • Cover Glass
    • Image Sensor
    • Camera Sensor
    • Fatty Acids
    • Fourier Transform Infrared
    • Fourier-transform Infrared
    • X-ray Photoelectron Spectroscopy
    • X-ray Photoelectron
    • Energy Dispersive X-ray
    • Internet Of Things
    • Internet-of-Things
    • Top Surface
    • Surface Analysis
    • Failure Modes
    • Automotive Industry
    • Foreign Material
    • Secondary Ion Mass Spectrometry
    • Failure Analysis
    • Microlenses
    • Micro Lens
    • Micro-lens
    • Typical Failure Modes
    • Fatty Acid Compounds
    • Fracture
    • Organic Matter
    • Reference Area
    • Fourier Transform Infrared Analysis
    • Fourier-transform Infrared Analysis
    • Thermal Expansion
    • Coefficient Of Thermal Expansion
    • Optical Inspection
    • Differential Scanning Calorimetry
    • Differential Scanning Calorimeter
    • Positive Mode
    • White Reference
    • Image Quality
    • White Areas
    • Power Consumption
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 978-1-6654-3989-3, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-6654-3988-6, isbnType: New-2005
• authors:
  • Author Name: Yeh Yee Kee
    Affiliation: Surface & Chemical Analysis Division, WinTech Nano-Technology Services Pte. Ltd., Singapore
    Author URL: https://ieeexplore.ieee.org/author/37086495622
    ID: 37086495622
    Order: 1
    Author Affiliations:
    • Surface & Chemical Analysis Division, WinTech Nano-Technology Services Pte. Ltd., Singapore
  • Author Name: Kei Lin Sek
    Affiliation: Surface & Chemical Analysis Division, WinTech Nano-Technology Services Pte. Ltd., Singapore
    Author URL: https://ieeexplore.ieee.org/author/37089166934
    ID: 37089166934
    Order: 2
    Author Affiliations:
    • Surface & Chemical Analysis Division, WinTech Nano-Technology Services Pte. Ltd., Singapore
  • Author Name: Lei Zhu
    Affiliation: Surface & Chemical Analysis Division, WinTech Nano-Technology Services Pte. Ltd., Singapore
    Author URL: https://ieeexplore.ieee.org/author/37074146400
    ID: 37074146400
    Order: 3
    Author Affiliations:
    • Surface & Chemical Analysis Division, WinTech Nano-Technology Services Pte. Ltd., Singapore
  • Author Name: Younan Hua
    Affiliation: Surface & Chemical Analysis Division, WinTech Nano-Technology Services Pte. Ltd., Singapore
    Author URL: https://ieeexplore.ieee.org/author/37365289400
    ID: 37365289400
    Order: 4
    Author Affiliations:
    • Surface & Chemical Analysis Division, WinTech Nano-Technology Services Pte. Ltd., Singapore
  • Author Name: Xiaomin Li
    Affiliation: Surface & Chemical Analysis Division, WinTech Nano-Technology Services Pte. Ltd., Singapore
    Author URL: https://ieeexplore.ieee.org/author/37085668202
    ID: 37085668202
    Order: 5
    Author Affiliations:
    • Surface & Chemical Analysis Division, WinTech Nano-Technology Services Pte. Ltd., Singapore

Image Sensor

• sensor_type: CMOS
• resolution: Not specified
• dynamic_range: Not specified
• pixel_size: Not specified
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: Used in CMOS image sensors for medical devices, mobile phones, and automotive systems.
• benefits: Enables digital imaging, provides lower production costs, shorter lead times, and improved image quality.

Supporting Organizations

• supported_by: WinTech Nano-Technology Services Pte. Ltd.

Manuscript Details

• publication_date: 15 Sept.-15 Oct. 2021

Relevancy Score

• score: 10
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_3079654a-71f9-4f95-aba0-0af1057d2e5c-a_novel_cmos_image_sensor_package_cover_glass_white_stain_material_identification_metrology_by_tofsims.json