A Lowpower Indirect Timeofflight Cmos Image Sensor With Fixed Depth Noise Compensation And Dualmode Imaging For Depth Dynamic Range Enhancement

• doi: 10.1109/TCSI.2022.3188045
• title: A Low-Power Indirect Time-of-Flight CMOS Image Sensor With Fixed Depth Noise Compensation and Dual-Mode Imaging for Depth Dynamic Range Enhancement
• publisher: IEEE
• isbn:
• issn: 1558-0806
• rank: 810
• access_type: LOCKED
• content_type: Journals
• abstract: We present a low-power indirect time-of-flight (iTOF) image sensor with fixed depth noise compensation and dual-mode imaging for depth dynamic range (DDR) enhancement. To reduce the power consumption from high-frequency pixel modulation, a TX driver with a single-sided clock chain is employed in the sensor. The inherent phase delay of the clock chain and the delay of the row bus are measured using row-parallel and column-parallel time-to-digital converters (TDCs) to compensate for the column and row fixed depth noise (FDN). To achieve a wide depth dynamic range (WDDR), the reconfigurable pixels and column circuits support dual-mode: short-range (SR) and long-range (LR) modes. A WDDR image is generated in a single frame through the mixed reconfiguration of the pixel array and interpolation. In addition, the temporal noise is suppressed without a significant time budget through a fast multiple sampling (FMS) scheme with 10b successive approximation register (SAR) analog-to-digital (ADCs). A prototype iTOF image sensor was fabricated using a 110 nm frontside illumination (FSI) CMOS image sensor (CIS) process and fully characterized. The sensor achieved a DDR of 4 m (0.7 to 4.7 m) with less than 1.7% nonlinearity and 0.9% depth noise. The FDN was suppressed to less than 2.1 cm at a low power consumption below 70 mW through the proposed compensation scheme using row and column TDCs. The temporal noise was only 0.48 mV $_{\mathbf {rms}}$ owing to the FMS.
• article_number: 9822989
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9822989
• html_url: https://ieeexplore.ieee.org/document/9822989/
• abstract_url: https://ieeexplore.ieee.org/document/9822989/
• publication_title: IEEE Transactions on Circuits and Systems I: Regular Papers
• conference_location:
• conference_dates:
• publication_number: 8919
• is_number: 9904939
• publication_year: 2022
• publication_date: Oct. 2022
• start_page: 3989
• end_page: 3999
• citing_paper_count: 3
• citing_patent_count: 0
• download_count: 1311
• insert_date: 20220708
• index_terms:
  • ieee_terms:
    • Delays
    • Clocks
    • Modulation
    • Power demand
    • Frequency modulation
    • Dynamic range
    • Phase measurement
  • author_terms:
    • CMOS image sensor (CIS)
    • column-parallel analog-to-digital converter (ADC)
    • depth dynamic range (DDR)
    • fixed depth noise (FDN)
    • time-of-flight (TOF) image sensor
    • time-to-digital converter (TDC)
  • dynamic_index_terms:
    • Image Sensor
    • Camera Sensor
    • Dual-modality Imaging
    • Depth Noise
    • Dynamic Range Enhancement
    • Dynamic-range Enhancement
    • Interpolation
    • Power Consumption
    • Multiple Samples
    • Short Range
    • Single Frame
    • Low Power Consumption
    • Phase Delay
    • Pixel Array
    • Time-to-digital Converter
    • Temporal Noise
    • Pulse Width
    • Pulsewidth Modulation
    • Pulsewidth
    • Pulse Width Modulation
    • Wearable Devices
    • Wearable Technology
    • Peak Current
    • Inverter
    • Reference Signal
    • Conventional Scheme
    • Differential Amplifier
    • Single-photon Avalanche Diode
    • Single Photon Avalanche Diode
    • Digital Code
    • Total Power Consumption
    • Pixel Units
    • Double Sampling
    • Input Pulse
    • Large Pixel
    • Additional Driver
    • Square Of The Distance
• authors:
  • Author Name: Canxing Piao
    Affiliation: Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37088368352
    ID: 37088368352
    Order: 1
    Author Affiliations:
    • Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, South Korea
  • Author Name: Yeonsoo Ahn
    Affiliation: College of Information and Communication Engineering, Sungkyunkwan University, Suwon, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37088368777
    ID: 37088368777
    Order: 2
    Author Affiliations:
    • College of Information and Communication Engineering, Sungkyunkwan University, Suwon, South Korea
    • Samsung Electronics, Hwaseong, South Korea
  • Author Name: Donguk Kim
    Affiliation: Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37088368739
    ID: 37088368739
    Order: 3
    Author Affiliations:
    • Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, South Korea
  • Author Name: Jihoon Park
    Affiliation: Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37088368276
    ID: 37088368276
    Order: 4
    Author Affiliations:
    • Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, South Korea
    • SolidVue, Suwon, South Korea
  • Author Name: Jubin Kang
    Affiliation: Department of Electrical Engineering, Ulsan National Institute of Science and Technology, Ulsan, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37089186120
    ID: 37089186120
    Order: 5
    Author Affiliations:
    • Department of Electrical Engineering, Ulsan National Institute of Science and Technology, Ulsan, South Korea
  • Author Name: Seong-Jin Kim
    Affiliation: Department of Electrical Engineering, Ulsan National Institute of Science and Technology, Ulsan, South Korea
    Author URL: https://ieeexplore.ieee.org/author/38183923800
    ID: 38183923800
    Order: 6
    Author Affiliations:
    • Department of Electrical Engineering, Ulsan National Institute of Science and Technology, Ulsan, South Korea
    • SolidVue, Suwon, South Korea
  • Author Name: Jung-Hoon Chun
    Affiliation: Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37272877300
    ID: 37272877300
    Order: 7
    Author Affiliations:
    • Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, South Korea
    • SolidVue, Suwon, South Korea
  • Author Name: Jaehyuk Choi
    Affiliation: Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37066872300
    ID: 37066872300
    Order: 8
    Author Affiliations:
    • Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, South Korea
    • SolidVue, Suwon, South Korea

Image Sensor

• sensor_type: CMOS
• resolution: 192x192
• dynamic_range: 4 m (0.7 to 4.7 m)
• pixel_size: 14.4 μm
• dark_current: not specified

Optical Data

• focal_length: 8 mm
• aperture: f/1.3
• field_of_view: not specified
• distortion: not specified

Performance Metrics

• frame_rate: 30 fps
• signal_to_noise_ratio: not directly specified, but depth noise of 0.9% and temporal noise of 0.48 mV rms achieved
• power_consumption: less than 70 mW
• noise: 0.9% depth noise, 0.48 mV rms temporal noise

Applications & Benefits

• cell_imaging: not specified
• benefits: Low power consumption, wide depth dynamic range, noise suppression, capable of being integrated into mobile and wearable devices.

Supporting Organizations

• supported_by: SK Hynix, National Research Foundation of Korea, Ministry of Trade, Industry and Energy

Manuscript Details

• publication_date: Oct. 2022

Relevancy Score

• score: 10

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