A Lowcost Through Via Interconnection For Ism Wlp

• doi: 10.1109/DTIP.2008.4752964
• title: A low-cost through via interconnection for ISM WLP
• publisher: IEEE
• isbn: 978-2-35500-006-5
• issn:
• partnum: 08EX2209
• rank: 1146
• access_type: LOCKED
• content_type: Conferences
• abstract: WLP (Wafer level packaging) for image sensor device has the advantage of small size, high performance and low cost. In WLP technology, in order to establish electrical interconnection from image sensor contact pad to the backside of the wafer, several structures have been developed, such as T-contact and TSV (Through Silicon Via). In this paper, a wafer level package of image sensor with new type TSV electrical interconnection for image sensor pad is presented. The target of this development is to reduce process cost and difficulty, and to increase yield of image sensor packaging. Key fabrication processes include glass protecting wafer bonding, device wafer thinning, backside through via etching, via passivation layer deposition, pad oxide opening, via filling and backside re-routing layer formation, etc. Compared to large opening area of tapered via on the backside of CMOS image sensor wafer, only small opening area is needed for making via interconnection with vertical sidewall presented in this paper. A fillet structure at bottom corner of via holes can help to reduce sequent process difficulty, so that low-cost and simplified unit processes are successfully adopted in the fabrication process for through via formation. The through via interconnection shows good electrical connection performance, and high-quality photo images are obtained by packaged image sensor device.
• article_number: 4752964
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=4752964
• html_url: https://ieeexplore.ieee.org/document/4752964/
• abstract_url: https://ieeexplore.ieee.org/document/4752964/
• publication_title: 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
• conference_location: Nice
• conference_dates: 9-11 April 2008
• publication_number: 4731228
• is_number: 4752931
• publication_year: 2008
• publication_date: 9-11 April 2008
• start_page: 115
• end_page: 118
• citing_paper_count: 1
• citing_patent_count: 1
• download_count: 280
• insert_date: 20090119
• index_terms:
  • ieee_terms:
    • Image sensors
    • Wafer scale integration
    • Packaging
    • Costs
    • Through-silicon vias
    • Fabrication
    • Contacts
    • Silicon
    • Glass
    • Protection
  • dynamic_index_terms:
    • Wafer-level Packaging
    • Low Cost
    • Etching
    • Fabrication Process
    • Open Areas
    • Layer Deposition
    • Image Sensor
    • Camera Sensor
    • Passivation Layer
    • Surface Passivation
    • Advantages Of Low Cost
    • Electrical Performance
    • Small Cost
    • Advantages Of Size
    • Sequent
    • Advantages Of Small Size
    • Electrical Interconnection
    • Mobile Devices
    • Portable Devices
    • Bottom Layer
    • Deposition Process
    • Sedimentary Processes
    • Dielectric Layer
    • Insulation Layer
    • Electroplating
    • Electrochemical Deposition
    • Etching Process
    • Low-temperature Process
    • Scallop
    • Dry Etching
    • Dry Etching Process
    • Drying Process
    • Dielectric Process
• isbn_formats:
  • format: Print ISBN, value: 978-2-35500-006-5, isbnType: New-2005
• authors:
  • Author Name: Jingli Yuan
    Affiliation: PKG Team, Corporate R&D Institute, Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37087826981
    ID: 37087826981
    Order: 1
    Author Affiliations:
    • PKG Team, Corporate R&D Institute, Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
  • Author Name: Won-Kyu Jeung
    Affiliation: PKG Team, Corporate R&D Institute, Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37087828168
    ID: 37087828168
    Order: 2
    Author Affiliations:
    • PKG Team, Corporate R&D Institute, Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
  • Author Name: Chang-Hyun Lim
    Affiliation: PKG Team, Corporate R&D Institute, Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37087528481
    ID: 37087528481
    Order: 3
    Author Affiliations:
    • PKG Team, Corporate R&D Institute, Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
  • Author Name: Seung-Wook Park
    Affiliation: PKG Team, Corporate R&D Institute, Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37657117600
    ID: 37657117600
    Order: 4
    Author Affiliations:
    • PKG Team, Corporate R&D Institute, Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
  • Author Name: Young-Do Kweon
    Affiliation: PKG Team, Corporate R&D Institute, Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37087512156
    ID: 37087512156
    Order: 5
    Author Affiliations:
    • PKG Team, Corporate R&D Institute, Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
  • Author Name: Sung Yi
    Affiliation: PKG Team, Corporate R&D Institute, Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37087255019
    ID: 37087255019
    Order: 6
    Author Affiliations:
    • PKG Team, Corporate R&D Institute, Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea

Image Sensor

• sensor_type: CMOS
• resolution: Not specified
• dynamic_range: Not specified
• pixel_size: Not specified
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: Used in mobile digital devices and applications such as smartphones, medical devices, and automotive systems.
• benefits: Advantages include small size, high performance, low cost, and the capability for high-resolution imaging.

Supporting Organizations

• supported_by: Samsung Electro-Mechanics Co.,LTD.

Manuscript Details

• publication_date: 9-11 April 2008

Relevancy Score

• score: 8
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_bec4e588-4d9f-4de4-83e4-05e7e2207a95-a_lowcost_through_via_interconnection_for_ism_wlp.json