A Digitalintensive 1Tx2rx Ieee 8021544Zcompliant Jointradarcommunicationlocation Transceiver Soc

• doi: 10.1109/JSSC.2024.3451654
• title: A Digital-Intensive 1TX/2RX IEEE 802.15.4/4z-Compliant Joint-Radar-Communication-Location Transceiver SoC
• publisher: IEEE
• isbn:
• issn: 1558-173X
• rank: 693
• access_type: LOCKED
• content_type: Journals
• abstract: This article introduces a digital-intensive 6–11 GHz 1TX/2RX IEEE 802.15.4/4z-Compliant joint-Radar-Communication-Location transceiver (TRX) SoC for indoor multi-sensor data fusion. The proposed transceiver utilizes the environment detection and awareness capabilities of the frequency-modulated continuous wave (FMCW) radar to complement the shortcomings of ultra-wideband (UWB) systems in indoor positioning applications. Additionally, the communication capability of the UWB can be used to fuse FMCW radar signals from various sources to model complex, large indoor scenes, enhancing the practicality of the FMCW and UWB fused system. The proposed joint-radar-communication-location transceiver SoC is designed and implemented in 28 nm CMOS technology, supporting UWB and FMCW radar modes. The UWB mode is compatible with IEEE 802.15.4/4z, providing accurate distance measurement, location information, and communication capabilities. The FMCW radar mode actively detects and models indoor environments. The transceiver covers an RF range of 6–11 GHz, supporting various communication data rates of 0.85/6.81/27.24 Mb/s. The measured ranging accuracy is ±2 cm, and the measured angle accuracy is ±4°. In the FMCW radar mode, the measured chirp bandwidth exceeds 2 GHz, the received SNR within 10 m is greater than 20 dB, and the measured distance resolution is better than 10 cm. Additionally, the transceiver SoC incorporates a UWB communication-enabled FMCW radar imaging algorithm for the system-level demonstration.
• article_number: 10670512
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10670512
• html_url: https://ieeexplore.ieee.org/document/10670512/
• abstract_url: https://ieeexplore.ieee.org/document/10670512/
• publication_title: IEEE Journal of Solid-State Circuits
• conference_location:
• conference_dates:
• publication_number: 4
• is_number: 10903209
• publication_year: 2025
• publication_date: March 2025
• start_page: 1014
• end_page: 1029
• citing_paper_count: 0
• citing_patent_count: 0
• download_count: 1009
• insert_date: 20240910
• index_terms:
  • ieee_terms:
    • Transceivers
    • Baseband
    • IEEE 802.15 Standard
    • Accuracy
    • Ultra wideband radar
    • Clocks
    • Radar
  • author_terms:
    • Frequency-modulated continuous wave (FMCW)
    • location
    • radar
    • transceiver (TRX)
    • ultra-wideband (UWB)
  • dynamic_index_terms:
    • Distancing Measures
    • Indoor Environments
    • Data Fusion
    • Range Resolution
    • Radar Images
    • Radar Imagery
    • Indoor Localization
    • Indoor Positioning
    • Frequency Modulated Continuous Wave
    • Frequency-modulated Continuous-wave Radar
    • Sampling Rate
    • Series Data
    • Power Consumption
    • Internet Of Things
    • Angle Measurements
    • Position Information
    • Lookup Table
    • Sidelobe
    • Side Lobes
    • Front End
    • Radar Data
    • Pulse Shape
    • Phase Noise
    • Chirp Signal
    • Noise Figure
    • RF Front-end
    • Radio Frequency Front End
    • Flexible Switching
    • Orthogonal Structure
    • Static Power Consumption
    • Inter-symbol Interference
    • Pulse Repetition Frequency
    • Dynamic Range
    • Power Amplifier
• authors:
  • Author Name: Bufan Zhu
    Affiliation: School of Integrated Circuits, Tsinghua University, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37089834349
    ID: 37089834349
    Order: 1
    Author Affiliations:
    • School of Integrated Circuits, Tsinghua University, Beijing, China
  • Author Name: Wei Deng
    Affiliation: School of Integrated Circuits, Tsinghua University, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37714500300
    ID: 37714500300
    Order: 2
    Author Affiliations:
    • School of Integrated Circuits, Tsinghua University, Beijing, China
  • Author Name: Ziying Huang
    Affiliation: School of Integrated Circuits, Tsinghua University, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37089835511
    ID: 37089835511
    Order: 3
    Author Affiliations:
    • School of Integrated Circuits, Tsinghua University, Beijing, China
  • Author Name: Haikun Jia
    Affiliation: School of Integrated Circuits, Tsinghua University, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37072383800
    ID: 37072383800
    Order: 4
    Author Affiliations:
    • School of Integrated Circuits, Tsinghua University, Beijing, China
  • Author Name: Haiyang Jia
    Affiliation: School of Integrated Circuits, Tsinghua University, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37089834711
    ID: 37089834711
    Order: 5
    Author Affiliations:
    • School of Integrated Circuits, Tsinghua University, Beijing, China
  • Author Name: Angxiao Yan
    Affiliation: School of Integrated Circuits, Tsinghua University, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37089342137
    ID: 37089342137
    Order: 6
    Author Affiliations:
    • School of Integrated Circuits, Tsinghua University, Beijing, China
  • Author Name: Yumeng Yang
    Affiliation: School of Integrated Circuits, Tsinghua University, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37089770933
    ID: 37089770933
    Order: 7
    Author Affiliations:
    • School of Integrated Circuits, Tsinghua University, Beijing, China
  • Author Name: Junfeng Liu
    Affiliation: School of Integrated Circuits, Tsinghua University, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37089834347
    ID: 37089834347
    Order: 8
    Author Affiliations:
    • School of Integrated Circuits, Tsinghua University, Beijing, China
  • Author Name: Yu Fu
    Affiliation: School of Integrated Circuits, Tsinghua University, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37089834836
    ID: 37089834836
    Order: 9
    Author Affiliations:
    • School of Integrated Circuits, Tsinghua University, Beijing, China
  • Author Name: Shiyan Sun
    Affiliation: School of Integrated Circuits, Tsinghua University, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37087410365
    ID: 37087410365
    Order: 10
    Author Affiliations:
    • School of Integrated Circuits, Tsinghua University, Beijing, China
  • Author Name: Chao Tang
    Affiliation: School of Integrated Circuits, Tsinghua University, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37089834598
    ID: 37089834598
    Order: 11
    Author Affiliations:
    • School of Integrated Circuits, Tsinghua University, Beijing, China
  • Author Name: Lixue Kuang
    Affiliation: BriRadio Technology Company Ltd., Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/38550330100
    ID: 38550330100
    Order: 12
    Author Affiliations:
    • BriRadio Technology Company Ltd., Beijing, China
  • Author Name: Lilan Yu
    Affiliation: BriRadio Technology Company Ltd., Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37085725445
    ID: 37085725445
    Order: 13
    Author Affiliations:
    • BriRadio Technology Company Ltd., Beijing, China
  • Author Name: Yue Liu
    Affiliation: BriRadio Technology Company Ltd., Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/693001047730835
    ID: 693001047730835
    Order: 14
    Author Affiliations:
    • BriRadio Technology Company Ltd., Beijing, China
  • Author Name: Xin Liang
    Affiliation: BriRadio Technology Company Ltd., Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37090066726
    ID: 37090066726
    Order: 15
    Author Affiliations:
    • BriRadio Technology Company Ltd., Beijing, China
  • Author Name: Zhihua Wang
    Affiliation: School of Integrated Circuits, Tsinghua University, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37279252700
    ID: 37279252700
    Order: 16
    Author Affiliations:
    • School of Integrated Circuits, Tsinghua University, Beijing, China
  • Author Name: Baoyong Chi
    Affiliation: School of Integrated Circuits, Tsinghua University, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37337830200
    ID: 37337830200
    Order: 17
    Author Affiliations:
    • School of Integrated Circuits, Tsinghua University, Beijing, China

Image Sensor

• sensor_type: CMOS
• resolution: NA
• dynamic_range: NA
• pixel_size: NA
• dark_current: NA

Optical Data

• focal_length: NA
• aperture: NA
• field_of_view: NA
• distortion: NA

Performance Metrics

• frame_rate: NA
• signal_to_noise_ratio: NA
• sensitivity: NA
• shutter_speed: NA
• power_consumption: NA
• noise: NA

Applications & Benefits

• cell_imaging: CMOS image sensors are utilized in medical devices for imaging cells and tissues.
• benefits: Enable digital imaging in various applications such as smartphones, medical devices, and automotive systems.

Supporting Organizations

• supported_by: NA

Manuscript Details

• publication_date: March 2025

Relevancy Score

• score: 2
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_6012bae0-a609-41f0-af0e-038796edce0c-a_digitalintensive_1tx2rx_ieee_8021544zcompliant_jointradarcommunicationlocation_transceiver_soc.json