A Cmoscompatible Photonic Demodulator With Lowpower Consumption For Timeofflight Image Sensor

• doi: 10.1109/TED.2022.3207708
• title: A CMOS-Compatible Photonic Demodulator With Low-Power Consumption for Time-of-Flight Image Sensor
• publisher: IEEE
• isbn:
• issn: 1557-9646
• rank: 651
• access_type: LOCKED
• content_type: Journals
• abstract: This article presents a CMOS-compatible low-power photonic demodulator for time-of-flight (ToF) CMOS image sensor. The proposed device called the junction-assisted photonic demodulator (JAPD) uses electric field applied through two guide electrodes to facilitate the collection of optically generated minority carriers but using a p-n junction to prevent direct majority carrier current. A prototype of the JAPD has been fabricated in a 0.18- $\mu \text{m}$ standard CMOS foundry process. Experimental results show that it can achieve a low-power consumption of 29 fW per pixel and a high modulation contrast (MC) of 98%. Through process optimization, it is shown that the optical window can be fully depleted during the demodulation process. In TCAD simulation, the frequency response can be significantly improved by ensuring full depletion of the optical window.
• article_number: 9906005
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9906005
• html_url: https://ieeexplore.ieee.org/document/9906005/
• abstract_url: https://ieeexplore.ieee.org/document/9906005/
• publication_title: IEEE Transactions on Electron Devices
• conference_location:
• conference_dates:
• publication_number: 16
• is_number: 9926983
• publication_year: 2022
• publication_date: Nov. 2022
• start_page: 6178
• end_page: 6183
• citing_paper_count: 1
• citing_patent_count: 0
• download_count: 438
• insert_date: 20220929
• index_terms:
  • ieee_terms:
    • Optical device fabrication
    • Electron optics
    • Leakage currents
    • Voltage measurement
    • Optical imaging
    • Demodulation
    • Photonics
  • author_terms:
    • Low-power consumption
    • multiple junctions
    • photonic demodulator
    • time-of-flight (ToF)
  • dynamic_index_terms:
    • Image Sensor
    • Camera Sensor
    • Low Power Consumption
    • P-n Junction
    • Major Carrier
    • Optical Window
    • Standard CMOS
    • TCAD Simulation
    • CCD Camera
    • Charge-coupled Device
    • Charge Coupled Device
    • 3D Images
    • Power Consumption
    • Modulation Frequency
    • Optical Sensors
    • Current Increases
    • Optical Signal
    • Field Region
    • Doping Concentration
    • Barrier Height
    • Network Bandwidth
    • Data Bandwidth
    • Modulation Bandwidth
    • Internet Bandwidth
    • Dark Current
    • Probe Station
    • Leakage Current Increases
    • PIN Photodiode
    • Optimal Device
    • Leakage Path
• authors:
  • Author Name: Shun-Qi Dai
    Affiliation: Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
    Author URL: https://ieeexplore.ieee.org/author/37089174584
    ID: 37089174584
    Order: 1
    Author Affiliations:
    • Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
    • ACCESS–AI Chip Center for Emerging Smart Systems, InnoHK Centers, Hong Kong Science Park, Hong Kong, China
  • Author Name: Cristine Jin Estrada
    Affiliation: Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
    Author URL: https://ieeexplore.ieee.org/author/37087469021
    ID: 37087469021
    Order: 2
    Author Affiliations:
    • Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
    • ACCESS–AI Chip Center for Emerging Smart Systems, InnoHK Centers, Hong Kong Science Park, Hong Kong, China
  • Author Name: An-Nan Xiong
    Affiliation: Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
    Author URL: https://ieeexplore.ieee.org/author/37089174345
    ID: 37089174345
    Order: 3
    Author Affiliations:
    • Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
    • ACCESS–AI Chip Center for Emerging Smart Systems, InnoHK Centers, Hong Kong Science Park, Hong Kong, China
  • Author Name: Chen Xu
    Affiliation: SmartSens Technology, San Jose, CA, USA
    Author URL: https://ieeexplore.ieee.org/author/37087468196
    ID: 37087468196
    Order: 4
    Author Affiliations:
    • SmartSens Technology, San Jose, CA, USA
  • Author Name: Jie George Yuan
    Affiliation: Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
    Author URL: https://ieeexplore.ieee.org/author/37089168988
    ID: 37089168988
    Order: 5
    Author Affiliations:
    • Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
    • ACCESS–AI Chip Center for Emerging Smart Systems, InnoHK Centers, Hong Kong Science Park, Hong Kong, China
  • Author Name: Mansun Chan
    Affiliation: Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
    Author URL: https://ieeexplore.ieee.org/author/37275216900
    ID: 37275216900
    Order: 6
    Author Affiliations:
    • Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
    • ACCESS–AI Chip Center for Emerging Smart Systems, InnoHK Centers, Hong Kong Science Park, Hong Kong, China

Image Sensor

• sensor_type: CMOS
• resolution: 10x10 µm pixel
• dynamic_range: not specified
• pixel_size: 10x10 µm
• dark_current: 10 fA

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

• power_consumption: 29 fW per pixel

Applications & Benefits

• cell_imaging: 3-D imaging technologies applicable in virtual/augmented reality, autonomous navigation, robotics vision, and gesture control.
• benefits: Low power consumption (29 fW per pixel), high modulation contrast (MC of 98%), compatibility with standard CMOS processes.

Supporting Organizations

• supported_by: ACCESS–AI Chip Center for Emerging Smart Systems, through InnoHK Funding, Hong Kong, SAR.

Manuscript Details

• publication_date: Nov. 2022

Relevancy Score

• score: 9

Processed JSON Filename

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