A Cmos Mems Capacitive Ultrasonic Sensor Array For Threedimensional Photoacoustic Imaging

• doi: 10.1109/MEMSYS.2013.6474316
• title: A CMOS MEMS capacitive ultrasonic sensor array for three-dimensional photoacoustic imaging
• publisher: IEEE
• isbn: 978-1-4673-5654-1
• issn: 1084-6999
• partnum: 13CH39061
• rank: 568
• access_type: LOCKED
• content_type: Conferences
• abstract: Three dimensional (3-D) photoacoustic imaging is demonstrated in this study by using a 4 × 4 CMOS (complementary metal oxide semiconductor) micromachined capacitive ultrasonic sensor array. The sensing membranes are fabricated by a post-CMOS metal etch and sealed by parylene with a measured resonant frequency between 3 to 5.1 MHz. The area of a single detection unit is 280 × 280 μm2. A large 2-D aperture was emulated by 2-D mechanical scanning of the array with a scanning step of 1.12 mm. The measured -6-dB spatial resolutions were 381 μm in axial and 1.3 mm in lateral, respectively, at a depth of ~2.1 cm. The 3-D photoacoustic image of a hair phantom was successfully produced.
• article_number: 6474316
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6474316
• html_url: https://ieeexplore.ieee.org/document/6474316/
• abstract_url: https://ieeexplore.ieee.org/document/6474316/
• publication_title: 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS)
• conference_location: Taipei, Taiwan
• conference_dates: 20-24 Jan. 2013
• publication_number: 6471302
• is_number: 6474158
• publication_year: 2013
• publication_date: 20-24 Jan. 2013
• start_page: 613
• end_page: 616
• citing_paper_count: 1
• citing_patent_count: 0
• download_count: 423
• insert_date: 20130307
• index_terms:
  • ieee_terms:
    • Arrays
    • Sensors
    • Acoustics
    • Imaging
    • Hair
    • CMOS integrated circuits
    • Heating
  • dynamic_index_terms:
    • Sensor Array
    • Photoacoustic Imaging
    • Optoacoustic
    • Photoacoustic Tomography
    • Ultrasonic Sensors
    • Ultrasonic Detection
    • Resonance Frequency
    • Capacitive Sensor
    • Parylene
    • Electrode
    • Temperature Changes
    • Thermal Conductivity
    • Heat Conduction
    • Heat Capacity
    • Specific Heat
    • Optical Absorption
    • Time Derivative
    • Acoustic Waves
    • Sound Waves
    • Constant Volume
    • Short Pulse
    • Sound Pressure
    • Acoustic Pressure
    • Speed Of Sound
    • Sound Velocity
    • Optic Radiation
    • Meyer’s Loop
• isbn_formats:
  • format: Print ISBN, value: 978-1-4673-5654-1, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-4673-5655-8, isbnType: New-2005
• authors:
  • Author Name: Pei-Liang Liao
    Affiliation: Institute of NanoEngineering and MicroSystems, National Tsinghua University, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37971866500
    ID: 37971866500
    Order: 1
    Author Affiliations:
    • Institute of NanoEngineering and MicroSystems, National Tsinghua University, Hsinchu, Taiwan
  • Author Name: Po-Hsun Wang
    Affiliation: Department of Electrical Engineering, National Tsinghua University, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37965004500
    ID: 37965004500
    Order: 2
    Author Affiliations:
    • Department of Electrical Engineering, National Tsinghua University, Hsinchu, Taiwan
  • Author Name: Meng-Lin Li
    Affiliation: Department of Electrical Engineering, National Tsinghua University, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37278837300
    ID: 37278837300
    Order: 3
    Author Affiliations:
    • Department of Electrical Engineering, National Tsinghua University, Hsinchu, Taiwan
  • Author Name: Michael S.-C. Lu
    Affiliation: Institute of NanoEngineering and MicroSystems, Department of Electrical Engineering, Institute of Electronics Engineering, National Tsinghua University, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37276887400
    ID: 37276887400
    Order: 4
    Author Affiliations:
    • Institute of NanoEngineering and MicroSystems, Department of Electrical Engineering, Institute of Electronics Engineering, National Tsinghua University, Hsinchu, Taiwan

Image Sensor

• sensor_type: CMOS
• resolution: 4x4 sensor array
• dynamic_range: Not specified
• pixel_size: Not specified
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

• signal_to_noise_ratio: 146 mV pp/MPa/V (±10% variation)

Applications & Benefits

• cell_imaging: Used in photoacoustic imaging to study microvascular structures.
• benefits: Capacitive transducers can provide higher imaging quality for 3-D photoacoustic imaging.

Supporting Organizations

• supported_by: National Science Council, Taiwan, National Chip Implementation Center, National Center for High-Performance Computing

Manuscript Details

• publication_date: 20-24 Jan. 2013

Relevancy Score

• score: 4
• missing_fields:
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_21b6f055-384a-41ae-bdfa-4f99699cb71f-a_cmos_mems_capacitive_ultrasonic_sensor_array_for_threedimensional_photoacoustic_imaging.json