A Cmos Image Sensor Module Applied For A Digital Still Camera Utilizing The Tab On Glass Tog Bonding Method

• doi: 10.1109/6040.763187
• title: A CMOS image sensor module applied for a digital still camera utilizing the TAB on glass (TOG) bonding method
• publisher: IEEE
• isbn:
• issn: 1557-9980
• rank: 600
• access_type: LOCKED
• content_type: Journals
• abstract: The world's smallest (105/spl times/55/spl times/20 mm) and lightest (130 g) digital still camera has been developed, in which a 330 K pixel complementary metal-oxide-semiconductor (CMOS) image sensor chip is used as an image sensor. The authors have developed a new thinner and smaller image sensor module, called tape automated bonding (TAB) on glass (TOG) module, using the anisotropic conductive paste (ACP) interconnection method. The TOG production process was established by obtaining optimum bonding conditions for both optical glass bonding and CMOS chip bonding to the TAB tape. The bonding conditions including sufficient bonding margins, were mainly studied. The TOG module obtained good imaging properties, It also has a high reliability such as thermal cycle test (-40 to +110/spl deg/C/30 min, 2000 cycles) and the high temperature storage test (60/spl deg/C, 90% RH, 3000 h). The stable production process was confirmed by fabricating an automatic bonding machine.
• article_number: 763187
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=763187
• html_url: https://ieeexplore.ieee.org/document/763187/
• abstract_url: https://ieeexplore.ieee.org/document/763187/
• publication_title: IEEE Transactions on Advanced Packaging
• conference_location:
• conference_dates:
• publication_number: 6040
• is_number: 16535
• publication_year: 1999
• publication_date: May 1999
• start_page: 160
• end_page: 165
• citing_paper_count: 3
• citing_patent_count: 1
• download_count: 202
• insert_date: 20020806
• index_terms:
  • ieee_terms:
    • CMOS image sensors
    • Digital cameras
    • Bonding
    • Image sensors
    • Glass
    • Production
    • Testing
    • Image storage
    • Pixel
    • Anisotropic magnetoresistance
  • dynamic_index_terms:
    • Digital Camera
    • Image Sensor
    • Camera Sensor
    • Complementary Metal–oxide–semiconductor Image
    • Complementary Metal Oxide Semiconductor Image
    • High Temperature
    • Production Process
    • High Reliability
    • High Dependence
    • High Storage
    • Thermal Test
    • Optical Glass
    • High-temperature Storage
    • Electrode
    • Optimal Conditions
    • Reliability Test
    • Bond Strength
    • Bond Energy
    • Thermal Stress
    • Heat Load
    • Curing Time
    • Setting Time
    • Power Distribution
    • Spectral Power
    • Radiation Power
    • Radiative Flux
    • Irradiation Power
    • Peel Strength
    • Microlenses
    • Micro Lens
    • High-temperature Test
    • Electrical Contact
    • Conductive Particles
    • UV Curing
    • Ultraviolet Curing
    • Cavity Structure
    • Ultraviolet Irradiation
    • UV Light Irradiation
    • Ultraviolet Rays
• authors:
  • Author Name: M. Segawa
    Affiliation: Toshiba Corporation, Yokohama, Japan
    Author URL: https://ieeexplore.ieee.org/author/37351950800
    ID: 37351950800
    Order: 1
    Author Affiliations:
    • Toshiba Corporation, Yokohama, Japan
  • Author Name: M. Ono
    Affiliation: Toshiba Corporation, Yokohama, Japan
    Author URL: https://ieeexplore.ieee.org/author/37268992500
    ID: 37268992500
    Order: 2
    Author Affiliations:
    • Toshiba Corporation, Yokohama, Japan
  • Author Name: S. Musha
    Affiliation: Toshiba Corporation, Yokohama, Japan
    Author URL: https://ieeexplore.ieee.org/author/37370901700
    ID: 37370901700
    Order: 3
    Author Affiliations:
    • Toshiba Corporation, Yokohama, Japan
  • Author Name: Y. Kishimoto
    Affiliation: Chemical Materials Technical Department, Toshiba Chemical Corporation, Kawasaki, Japan
    Author URL: https://ieeexplore.ieee.org/author/37363721500
    ID: 37363721500
    Order: 4
    Author Affiliations:
    • Chemical Materials Technical Department, Toshiba Chemical Corporation, Kawasaki, Japan
  • Author Name: A. Ohashi
    Affiliation: Fukaya Works, Toshiba Corporation, Fukaya, Saitama, Japan
    Author URL: https://ieeexplore.ieee.org/author/37369353400
    ID: 37369353400
    Order: 5
    Author Affiliations:
    • Fukaya Works, Toshiba Corporation, Fukaya, Saitama, Japan

Image Sensor

• sensor_type: CMOS
• resolution: 480x640
• dynamic_range: Not specified
• pixel_size: Not specified
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: Utilized in digital still cameras
• benefits: Lightweight and compact design, suitable for consumer electronics.

Supporting Organizations

• supported_by: Toshiba Corporation, Toshiba Chemical Corp.

Manuscript Details

• publication_date: May 1999

Relevancy Score

• score: 8
• missing_fields:
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_d8c41387-2a31-4199-8afd-81c0ecb72347-a_cmos_image_sensor_module_applied_for_a_digital_still_camera_utilizing_the_tab_on_glass_tog_bonding_method.json