A 3D Integrated Featureextracting Image Sensor
- doi: 10.1109/ISCAS.2007.378668
-
title: A 3D Integrated Feature-Extracting Image Sensor
- publisher: IEEE
- isbn: 1-4244-0921-7
- issn: 2158-1525
- partnum: 07CH37868
- rank: 432
- access_type: LOCKED
- content_type: Conferences
-
abstract: In this paper we present a feature-extracting
image sensor targeted to wireless image sensor networks. The image
sensor was designed and fabricated on a 3D integrated 0.18μm
silicon-on-insulator CMOS process. The image sensor can simultaneously
capture an intensity image and extract image features, which include
temporal illumination differentiations and contours. By taking advantage
of massively parallel, vertical connectivity, the image sensor can
perform more analog computations at higher speed and higher
communication efficiency. The top layer is covered by photodiodes and
the pixel fill factor is 95%.
- article_number: 4253550
-
pdf_url:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=4253550
-
html_url:
https://ieeexplore.ieee.org/document/4253550/
-
abstract_url:
https://ieeexplore.ieee.org/document/4253550/
-
publication_title: 2007 IEEE International Symposium on
Circuits and Systems (ISCAS)
- conference_location: New Orleans, LA, USA
- conference_dates: 27-30 May 2007
- publication_number: 4252534
- is_number: 4252535
- publication_year: 2007
- publication_date: 27-30 May 2007
- start_page: 3964
- end_page: 3967
- citing_paper_count: 2
- citing_patent_count: 0
- download_count: 135
- insert_date: 20070625
-
index_terms:
-
ieee_terms:
- Image sensors
- Wireless sensor networks
- Silicon on insulator technology
- CMOS process
- Feature extraction
- Lighting
- Analog computers
- Concurrent computing
- High performance computing
- Photodiodes
-
dynamic_index_terms:
- Image Sensor
- Camera Sensor
- High Speed
- Image Intensity
- Sensor Networks
- Fill Factor
- CMOS Process
- Analog Computing
- Analogous Calculations
- Vertical Connections
- Power Consumption
- Operation Mode
- Quantum Efficiency
- Current Voltage
- Integrated Circuit
- Wireless Sensor Networks
- Mode Switching
- Signal Path
- Object Contour
- Output Buffer
- Output Switching
-
isbn_formats:
-
format: CD, value: 1-4244-0921-7,
isbnType: Historical
-
format: Print ISBN,
value: 1-4244-0920-9,
isbnType: Historical
-
authors:
-
Author Name: Zhengming Fu
Affiliation: Electrical Engineering Department,
Yale University, New Heaven, CT, USA
Author URL:
https://ieeexplore.ieee.org/author/37688736600
ID: 37688736600
Order: 1
Author Affiliations:
-
Electrical Engineering Department, Yale University, New Heaven,
CT, USA
-
Author Name: Eugenio Culurciello
Affiliation: Electrical Engineering Department,
Yale University, New Heaven, CT, USA
Author URL:
https://ieeexplore.ieee.org/author/37268496400
ID: 37268496400
Order: 2
Author Affiliations:
-
Electrical Engineering Department, Yale University, New Heaven,
CT, USA
Image Sensor
- sensor_type: CMOS
- resolution: 97x297 pixels
- dynamic_range: Not specified
- pixel_size: 15μm x 16μm
- dark_current: 1.8 fA
Optical Data
- focal_length: Not specified
- aperture: Not specified
- field_of_view: Not specified
- distortion: Not specified
Performance Metrics
- frame_rate: 30 fps
- power_consumption: 1.04 mW (active pixel)
Applications & Benefits
-
cell_imaging: Targeted to wireless image sensor
networks, enabling recognition and detection with reduced data
transmission.
-
benefits: Faster analog computations, higher
communication efficiency, and ability to extract features at the sensor
level.
Supporting Organizations
-
supported_by: DARPA, MIT Lincoln Laboratory (MIT LL)
Manuscript Details
- publication_date: 27-30 May 2007
Relevancy Score
- score: 10
-
missing_fields:
- dynamic_range
- focal_length
- aperture
- field_of_view
- distortion
- signal_to_noise_ratio
- sensitivity
- shutter_speed
- noise
Processed JSON Filename
request_52abea89-e020-4e52-bfa6-2512533f7a54-a_3d_integrated_featureextracting_image_sensor.json