A 11 Mu Textm 33Mpixel 240Fps 3Dstacked Cmos Image Sensor With Threestage Cycliccyclicsar Analogtodigital Converters

• doi: 10.1109/TED.2017.2766297
• title: A 1.1- $\mu \text{m}$ 33-Mpixel 240-fps 3-D-Stacked CMOS Image Sensor With Three-Stage Cyclic-Cyclic-SAR Analog-to-Digital Converters
• publisher: IEEE
• isbn:
• issn: 1557-9646
• rank: 195
• access_type: OPEN_ACCESS
• content_type: Journals
• abstract: In this paper, a 1.1-μm-pitch 33-Mpixel 240-fps backside-illuminated 3-D-stacked CMOS image sensor with three-stage cyclic-cyclic-successive-approximation-register (SAR) analog-to-digital converters (ADCs) is developed. The narrow-pitch interconnection technology that connects the pixels and arrayed ADCs inside the pixel area is described. The 3-D-stacked architecture, constructed using the interconnection technology, makes it possible to place a 1932 (H) × 4 (V) correlated-double-sampling/ADC array underneath the pixel area. Furthermore, the pipelined and parallel operation of the three-stage cyclic-cyclic-SAR ADC architecture effectively reduces the conversion time period and power consumption and achieves 12-b precision within one horizontal scan time of 0.92 μs. As a result, the interconnection technology and ADC architecture achieved a high frame rate of 240 fps in 33 Mpixels. Random noise of 3.6 e- and low power consumption of 3.0 W were attained at an extremely high pixel rate of 7.96 Gpixel/s. A good figure of merit is achieved compared with recently developed image sensors.
• article_number: 8098612
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8098612
• html_url: https://ieeexplore.ieee.org/document/8098612/
• abstract_url: https://ieeexplore.ieee.org/document/8098612/
• publication_title: IEEE Transactions on Electron Devices
• conference_location:
• conference_dates:
• publication_number: 16
• is_number: 8103302
• publication_year: 2017
• publication_date: Dec. 2017
• start_page: 4992
• end_page: 5000
• citing_paper_count: 16
• citing_patent_count: 0
• download_count: 4385
• insert_date: 20171109
• index_terms:
  • ieee_terms:
    • CMOS image sensors
    • Capacitors
    • Integrated circuit interconnections
    • Optical sensors
    • Power demand
  • author_terms:
    • 240 fps
    • 33 Mpixels
    • 3-D-stacked
    • 8K Super Hi-Vision (SHV)
    • cyclic-cyclic-successive-approximation-register (SAR) analog-to-digital converter (ADC)
    • interconnections
  • dynamic_index_terms:
    • Analog-to-digital Converter
    • Analog-to-digital
    • Digital-to-analog Converter
    • Image Sensor
    • Camera Sensor
    • Power Consumption
    • Random Noise
    • Channel Noise
    • Figure Of Merit
    • Low Power Consumption
    • Output Signal
    • Low Noise
    • Supply Voltage
    • Least Significant Bit
    • Low Bit
    • Most Significant Bit
    • High Bit
    • Highest Bit
    • Digital Circuits
    • Digital Circuitry
    • Amplification Phase
    • Pixel Units
    • Feedback Phase
    • Ultra-high-definition
    • Ultra HD
    • Camera Head
    • SPICE Simulations
    • Switching Transistors
• authors:
  • Author Name: Toshiki Arai
    Affiliation: NHK Science and Technology Research Laboratories, Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/38067835200
    ID: 38067835200
    Order: 1
    Author Affiliations:
    • NHK Science and Technology Research Laboratories, Tokyo, Japan
  • Author Name: Toshio Yasue
    Affiliation: NHK Science and Technology Research Laboratories, Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/37085645432
    ID: 37085645432
    Order: 2
    Author Affiliations:
    • NHK Science and Technology Research Laboratories, Tokyo, Japan
  • Author Name: Kazuya Kitamura
    Affiliation: NHK Science and Technology Research Laboratories, Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/38238243500
    ID: 38238243500
    Order: 3
    Author Affiliations:
    • NHK Science and Technology Research Laboratories, Tokyo, Japan
  • Author Name: Hiroshi Shimamoto
    Affiliation: NHK Science and Technology Research Laboratories, Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/38031226700
    ID: 38031226700
    Order: 4
    Author Affiliations:
    • NHK Science and Technology Research Laboratories, Tokyo, Japan
  • Author Name: Tomohiko Kosugi
    Affiliation: Brookman Technology, Inc., Hamamatsu, Japan
    Author URL: https://ieeexplore.ieee.org/author/38236166000
    ID: 38236166000
    Order: 5
    Author Affiliations:
    • Brookman Technology, Inc., Hamamatsu, Japan
  • Author Name: Sung-Wook Jun
    Affiliation: Brookman Technology, Inc., Hamamatsu, Japan
    Author URL: https://ieeexplore.ieee.org/author/37085640405
    ID: 37085640405
    Order: 6
    Author Affiliations:
    • Brookman Technology, Inc., Hamamatsu, Japan
  • Author Name: Satoshi Aoyama
    Affiliation: Brookman Technology, Inc., Hamamatsu, Japan
    Author URL: https://ieeexplore.ieee.org/author/37408090900
    ID: 37408090900
    Order: 7
    Author Affiliations:
    • Brookman Technology, Inc., Hamamatsu, Japan
  • Author Name: Ming-Chieh Hsu
    Affiliation: TSMC, Ltd., Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37085649394
    ID: 37085649394
    Order: 8
    Author Affiliations:
    • TSMC, Ltd., Hsinchu, Taiwan
  • Author Name: Yuichiro Yamashita
    Affiliation: TSMC, Ltd., Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37085635006
    ID: 37085635006
    Order: 9
    Author Affiliations:
    • TSMC, Ltd., Hsinchu, Taiwan
  • Author Name: Hirofumi Sumi
    Affiliation: University of Tokyo, Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/37275548900
    ID: 37275548900
    Order: 10
    Author Affiliations:
    • University of Tokyo, Tokyo, Japan
  • Author Name: Shoji Kawahito
    Affiliation: Brookman Technology, Inc., Hamamatsu, Japan
    Author URL: https://ieeexplore.ieee.org/author/37300195700
    ID: 37300195700
    Order: 11
    Author Affiliations:
    • Brookman Technology, Inc., Hamamatsu, Japan
    • Research Institute of Electronics, Shizuoka University, Hamamatsu, Japan

Image Sensor

• sensor_type: CMOS
• resolution: 33 Mpixels (7728(H) × 4368(V))
• dynamic_range: 12-b
• pixel_size: 1.1 µm
• dark_current: 3.6 e- (input-referred random noise at analog gain of 4.0)

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

• frame_rate: 240 fps
• sensitivity: 0.55 V/lux·s
• power_consumption: 3.0 W
• noise: random noise of 3.6 e- rms

Applications & Benefits

• cell_imaging: 8K Super Hi-Vision (SHV) systems for next-generation ultra-high definition TV broadcasting.
• benefits: High sensitivity for small pixels, high frame rate, and compact design.

Supporting Organizations

• supported_by: NHK Science and Technology Research Laboratories, Brookman Technology, Inc., TSMC Ltd.

Manuscript Details

• publication_date: Dec. 2017

Relevancy Score

• score: 10

Processed JSON Filename

request_3386fa6f-2f9f-47ff-be05-53d0bfa7c4ae-a_11_mu_textm_33mpixel_240fps_3dstacked_cmos_image_sensor_with_threestage_cycliccyclicsar_analogtodigital_converters.json