3Layer Fine Pitch Cucu Hybrid Bonding Demonstrator With High Density Tsv For Advanced Cmos Image Sensor Applications

• doi: 10.1109/ECTC51529.2024.00057
• title: 3-layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator With High Density TSV For Advanced CMOS Image Sensor Applications
• publisher: IEEE
• isbn: 979-8-3503-7599-2
• issn: 0569-5503
• rank: 64
• access_type: PROMOTIONAL
• content_type: Conferences
• abstract: After having successfully demonstrating a 2-layer face-to-back (F2B) test vehicle (TV), we reached the next level of integration by achieving a 3-layer TV with fine-pitch Cu-Cu hybrid bonding (HB) technology and high-density (HD) Through Silicon Via (TSV). Different Cu damascene levels that simulate back-end-of-line (BEOL) layers are used on 300mm wafers to fabricate the 3-layer TV. After having bonded the first two wafers (tier 1 and tier 2) within a face-to-face (F2F) hybrid bonding configuration, the backside of tier 2 is thinned down to 9 μm. 1x10μm TSVs are then fabricated to connect tier 2 to tier 3 via a face-to-back (F2B) hybrid bonding step. After the TV fabrication, we performed morphological characterizations (FIB-SEM cross-sections) to verify the entire 3D stacked structure. We reported advanced 3D cross-sections showing the good metal connection at the HB and TSV interfaces. For electrical characterization, different types of Kelvin and Daisy Chain (DC) structures (up to 6500 half links) are tested. Our test structures are designed with either standard or fine pitch configurations (Pitch: 6 μm and 4 μm respectively) with HB pad dimensions of 3x3 μm2 and 2x2 μm2 respectively. The results for the Kelvin structures show a median resistance of a few ohms with high yield (over 80%). These results are confirmed by electrical measurements on DC structures. After demonstrating 3-layer TV functionality, the next step will be to implement this 3D technology in a functional advanced CMOS image sensor (CIS) in the next coming years.
• article_number: 10565164
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10565164
• html_url: https://ieeexplore.ieee.org/document/10565164/
• abstract_url: https://ieeexplore.ieee.org/document/10565164/
• publication_title: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
• conference_location: Denver, CO, USA
• conference_dates: 28-31 May 2024
• publication_number: 10564841
• is_number: 10564831
• publication_year: 2024
• publication_date: 28-31 May 2024
• start_page: 305
• end_page: 311
• citing_paper_count: 3
• citing_patent_count: 0
• download_count: 1130
• insert_date: 20240626
• index_terms:
  • ieee_terms:
    • Resistance
    • Fabrication
    • TV
    • Three-dimensional displays
    • Kelvin
    • Metals
    • CMOS image sensors
  • author_terms:
    • 3D Integration
    • Hybrid Bonding
    • Fine pitch
    • High Density TSV
    • Wafer Level Packaging
    • Test Vehicle
  • dynamic_index_terms:
    • Image Sensor
    • Camera Sensor
    • Through Silicon Via
    • Hybrid Bonding
    • Electrical Measurements
    • 3D Technology
    • Advanced Sensors
    • Stacking Structure
    • Test Vehicle
    • Process Flow
    • Stacked Layers
    • Levels Of Metals
    • Μm In Height
    • Percentage Of Resistance
    • Metal Lines
    • 3D Integration
    • Μm Pitch
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 979-8-3503-7599-2, isbnType: New-2005
  • format: Electronic ISBN, value: 979-8-3503-7598-5, isbnType: New-2005
• authors:
  • Author Name: Stéphane Nicolas
    Affiliation: CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37076327200
    ID: 37076327200
    Order: 1
    Author Affiliations:
    • CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Jerzy-Javier Suarez-Berru
    Affiliation: CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37089987576
    ID: 37089987576
    Order: 2
    Author Affiliations:
    • CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Nicolas Bresson
    Affiliation: CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37283050000
    ID: 37283050000
    Order: 3
    Author Affiliations:
    • CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Carole Socquet-Clerc
    Affiliation: CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/814847761695867
    ID: 814847761695867
    Order: 4
    Author Affiliations:
    • CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Myriam Assous
    Affiliation: CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37265369400
    ID: 37265369400
    Order: 5
    Author Affiliations:
    • CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Stéphan Borel
    Affiliation: CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/808791615825121
    ID: 808791615825121
    Order: 6
    Author Affiliations:
    • CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Rémi Vélard
    Affiliation: CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/38244864000
    ID: 38244864000
    Order: 7
    Author Affiliations:
    • CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Jérôme Dechamp
    Affiliation: CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/242902564152392
    ID: 242902564152392
    Order: 8
    Author Affiliations:
    • CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Renan Bouis
    Affiliation: CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37089593583
    ID: 37089593583
    Order: 9
    Author Affiliations:
    • CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Antonio Roman
    Affiliation: CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/956562693655025
    ID: 956562693655025
    Order: 10
    Author Affiliations:
    • CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Karine Abadie
    Affiliation: CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/646678861306440
    ID: 646678861306440
    Order: 11
    Author Affiliations:
    • CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Damien Hebras
    Affiliation: CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/569407006958820
    ID: 569407006958820
    Order: 12
    Author Affiliations:
    • CEA, LETI, Grenoble, Univ. Grenoble Alpes, Grenoble, France

Image Sensor

• sensor_type: CMOS
• resolution: Not specified in the text
• dynamic_range: Not specified in the text
• pixel_size: Not specified in the text
• dark_current: Not specified in the text

Optical Data

• focal_length: Not specified in the text
• aperture: Not specified in the text
• field_of_view: Not specified in the text
• distortion: Not specified in the text

Performance Metrics

• frame_rate: Not specified in the text
• signal_to_noise_ratio: Not specified in the text
• sensitivity: Not specified in the text
• shutter_speed: Not specified in the text
• power_consumption: Not specified in the text
• noise: Not specified in the text

Applications & Benefits

• cell_imaging: Not specified in the text
• benefits: Not specified in the text

Supporting Organizations

• supported_by: French National Research Agency (ANR) under the "Investissements d’avenir" programs: ANR 10-AIRT-0005 (IRT NANO-ELEC).

Manuscript Details

• publication_date: 28-31 May 2024

Relevancy Score

• score: 8
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise
  • cell_imaging
  • benefits

Processed JSON Filename

request_87884a6d-5d82-4875-b1c9-f659a98bd6a4-3layer_fine_pitch_cucu_hybrid_bonding_demonstrator_with_high_density_tsv_for_advanced_cmos_image_sensor_applications.json