3D Ultrasonic Fingerprint Sensoronachip

• doi: 10.1109/JSSC.2016.2604291
• title: 3-D Ultrasonic Fingerprint Sensor-on-a-Chip
• publisher: IEEE
• isbn:
• issn: 1558-173X
• rank: 59
• access_type: LOCKED
• content_type: Journals
• abstract: A fully integrated 3-D ultrasonic fingerprint sensor-on-a-chip is presented. The device consists of a 110× 56 piezoelectric micromachined ultrasonic transducer (PMUT) array bonded at the wafer level to custom readout electronics fabricated in a 180-nm CMOS process with a HV (24 V) transistor option. With the 24 V driving signal strength, the sensor consumes 280 μJ to image a 4.73 mm × 3.24 mm section of a fingerprint at a rate of 380 fps. A wakeup mode that detects the presence of a finger at 4 fps and dissipates 10 μW allows the proposed sensor to double as a power switch. The sensor is capable of imaging both the surface epidermal and subsurface dermal fingerprints and is insensitive to contaminations, including perspiration or oil. The 3-D imaging capability combined with the sensor's sensitivity to the acoustic properties of the tissue translates into excellent robustness against spoofing attacks.
• article_number: 7579196
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7579196
• html_url: https://ieeexplore.ieee.org/document/7579196/
• abstract_url: https://ieeexplore.ieee.org/document/7579196/
• publication_title: IEEE Journal of Solid-State Circuits
• conference_location:
• conference_dates:
• publication_number: 4
• is_number: 7637051
• publication_year: 2016
• publication_date: Nov. 2016
• start_page: 2522
• end_page: 2533
• citing_paper_count: 108
• citing_patent_count: 0
• download_count: 6280
• insert_date: 20160928
• index_terms:
  • ieee_terms:
    • Acoustics
    • Ultrasonic transducers
    • Imaging
    • Impedance
    • Fingerprint recognition
    • Epidermis
    • Transducers
  • author_terms:
    • Fingerprint sensor
    • high voltage
    • piezoelectric micromachined ultrasonic transducer (PMUT)
    • sensor-on-a-chip
    • ultrasonic
    • wafer bonding
  • dynamic_index_terms:
    • Epidermal
    • Cuticular
    • Cuticle
    • 3D Images
    • Array Transducer
    • CMOS Process
    • Spoofing Attacks
    • Parasite
    • Smartphone
    • Optical Tomography
    • Optical Imaging
    • Image Quality
    • Total Reflection
    • Total Internal Reflection
    • Inner Layer
    • Polydimethylsiloxane
    • Acoustic Waves
    • Sound Waves
    • Optical Sensors
    • Incident Wave
    • Speed Of Sound
    • Sound Velocity
    • Stratum Corneum
    • Top Electrode
    • Parasitic Capacitance
    • Ultrasonic Sensors
    • Ultrasonic Detection
    • Capacitive Sensor
    • Acoustic Impedance
    • Commercial Sensors
    • Dermal Papilla
    • Adjacent Columns
    • Phantom Surface
    • Square Wave
    • Replica
    • Digital Circuits
    • Digital Circuitry
• authors:
  • Author Name: Hao-Yen Tang
    Affiliation: Department of Electrical Engineering and Computer Science, University of California at Berkeley, Berkeley, CA, USA
    Author URL: https://ieeexplore.ieee.org/author/37085442217
    ID: 37085442217
    Order: 1
    Author Affiliations:
    • Department of Electrical Engineering and Computer Science, University of California at Berkeley, Berkeley, CA, USA
  • Author Name: Yipeng Lu
    Affiliation: Qualcomm Inc., Santa Clara, CA, USA
    Author URL: https://ieeexplore.ieee.org/author/37085445079
    ID: 37085445079
    Order: 2
    Author Affiliations:
    • Qualcomm Inc., Santa Clara, CA, USA
  • Author Name: Xiaoyue Jiang
    Affiliation: Department of Electrical Engineering and Computer Science, University of California at Berkeley, Berkeley, CA, USA
    Author URL: https://ieeexplore.ieee.org/author/37085699649
    ID: 37085699649
    Order: 3
    Author Affiliations:
    • Department of Electrical Engineering and Computer Science, University of California at Berkeley, Berkeley, CA, USA
  • Author Name: Eldwin J. Ng
    Affiliation: InvenSense Inc., San Jose, CA, USA
    Author URL: https://ieeexplore.ieee.org/author/37711201400
    ID: 37711201400
    Order: 4
    Author Affiliations:
    • InvenSense Inc., San Jose, CA, USA
  • Author Name: Julius M. Tsai
    Affiliation: InvenSense Inc., San Jose, CA, USA
    Author URL: https://ieeexplore.ieee.org/author/37085530599
    ID: 37085530599
    Order: 5
    Author Affiliations:
    • InvenSense Inc., San Jose, CA, USA
  • Author Name: David A. Horsley
    Affiliation: Department of Mechanical and Aerospace Engineering, University of California at Davis, Davis, CA, USA
    Author URL: https://ieeexplore.ieee.org/author/37372231100
    ID: 37372231100
    Order: 6
    Author Affiliations:
    • Department of Mechanical and Aerospace Engineering, University of California at Davis, Davis, CA, USA
  • Author Name: Bernhard E. Boser
    Affiliation: Department of Electrical Engineering and Computer Science, University of California at Berkeley, Berkeley, CA, USA
    Author URL: https://ieeexplore.ieee.org/author/37282431400
    ID: 37282431400
    Order: 7
    Author Affiliations:
    • Department of Electrical Engineering and Computer Science, University of California at Berkeley, Berkeley, CA, USA

Image Sensor

• sensor_type: CMOS
• resolution: 110 × 56 pixels (582 and 431 dpi)
• dynamic_range: Not explicitly stated in the text
• pixel_size: Approximately 460 μm²
• dark_current: Not provided in the text

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

• frame_rate: 380 fps (maximum output rate)
• signal_to_noise_ratio: Not explicitly reported but the input-referred integrated noise is σ=46 μV, 18 dB smaller than the smallest expected signal.
• sensitivity: Not provided
• shutter_speed: Not explicitly mentioned; operates in continuous imaging.
• power_consumption: 280 μJ per complete image; 10 μW in low-power mode.
• noise: Input-referred integrated noise is σ=46 μV.

Applications & Benefits

• cell_imaging: The sensor can image both the epidermal and dermal fingerprints, enhancing security against spoofer attacks.
• benefits: The sensor is resilient to humidity and capable of generating a 3-D volumetric image, making it difficult to deceive with phantoms.

Supporting Organizations

• supported_by: InvenSense Inc. and University of California at Berkeley.

Manuscript Details

• publication_date: Nov. 2016

Relevancy Score

• score: 8
• missing_fields:
  • fill factor
  • quantum efficiency
  • specific dynamic range
  • specific dark current
  • specific readout speed
  • specific noise sources
  • analog-to-digital conversion techniques
  • microlenses
  • on-chip colour filters
  • global or rolling shutters
  • backside illumination

Processed JSON Filename

request_6495205a-e52c-46f4-86d9-f92103705ce2-3d_ultrasonic_fingerprint_sensoronachip.json