3D Stacking Process Technologies For Advanced Cmos Image Sensors

• doi: 10.1109/VLSITSA60681.2024.10546446
• title: 3D Stacking Process Technologies for Advanced CMOS Image Sensors
• publisher: IEEE
• isbn: 979-8-3503-6035-6
• issn:
• rank: 80
• access_type: LOCKED
• content_type: Conferences
• abstract: Recently, in the field of CMOS Image Sensor (CIS), there has been high demand for new functions that can respond to various photo-taking scenes. To meet the market needs, we have started the mass-production of Back-Illuminated-CIS (BI-CIS) and stacked BI-CIS in 2008 and 2012 respectively[1] [2]. Those CISs have effectively improved the sensitivity and functionality compared with the conventional Front-Illuminated-CIS. In the early type of stacked BI-CIS the Through-Silicon-Via(TSV) technology was used to electrically connect upper CIS chip and lower logic chip[2]. In 2015, to fabricate high-performance and highly productive stacked BI-CISs, we have developed a novel 3D stacking technology called Cu-Cu hybrid bonding [3]. The fine-pitch Cu-Cu hybrid bonding has achieved the wide dynamic range and high-speed processing[4]. In 2019, we also have announced a role out of back-illuminated InGaAs image sensor with 1280×1040 pixels at 5-um pitch by using Cu-Cu hybridization connecting different materials, a III-V InGaAs/InP of photodiode array (PDA), and a silicon readout integrated circuit (ROIC)[5]. This sensor has achieved low dark current and high sensitivity for wavelengths ranging from visible to short-wavelength infrared (SWIR). In 2020, we also have successfully attached the unique logic circuits with edge processing functionality enabling high-speed edge AI processing. Such new intelligent vision sensor is worthy of a special mention as an example of functional expansion[6]. In 2022, by using both CuCu hybrid bonding and TSV technologies, the three-layer stacked device has been proposed [7] [8]. In 2023, we also have announced the over-400mm2-large chip-on-wafer Cu-Cu hybrid bonding process[9]. Such multi-layer stacked CISs have been expected to append the various functions. As shown in figure, our 3D stacking process technologies have successfully evolved the CISs from viewpoint of performance improvement, performance expansion and functional expansion. In the very near future, our cutting-edge devices will be key not only for mobile gadgets, surveillance, factory automation, autonomous driving, medical imaging but also for robotics and AI system. We are convinced that our CISs will help realize a safer and more convenient society.
• article_number: 10546446
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10546446
• html_url: https://ieeexplore.ieee.org/document/10546446/
• abstract_url: https://ieeexplore.ieee.org/document/10546446/
• publication_title: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)
• conference_location: HsinChu, Taiwan
• conference_dates: 22-25 April 2024
• publication_number: 10546337
• is_number: 10546338
• publication_year: 2024
• publication_date: 22-25 April 2024
• start_page: 1
• end_page: 1
• citing_paper_count: 0
• citing_patent_count: 0
• download_count: 1104
• insert_date: 20240610
• index_terms:
  • ieee_terms:
    • Performance evaluation
    • Three-dimensional displays
    • Sensitivity
    • Stacking
    • Very large scale integration
    • CMOS image sensors
    • Vision sensors
  • author_terms:
    • CMOS image sensor
    • Cu-Cu hybrid bonding
    • heterogeneous integration
    • wafer-to-wafer bonding
    • chip-to-wafer bonding
    • 3 layers stacking
  • dynamic_index_terms:
    • Image Sensor
    • Camera Sensor
    • Photodiode Array
    • High-speed Processing
    • High Processing Speed
    • AI Systems
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 979-8-3503-6035-6, isbnType: New-2005
  • format: Electronic ISBN, value: 979-8-3503-6034-9, isbnType: New-2005
• authors:
  • Author Name: Yoshihisa Kagawa
    Affiliation: Sony Semiconductor Solutions Corporation, Kanagawa, Japan
    Author URL: https://ieeexplore.ieee.org/author/37295736500
    ID: 37295736500
    Order: 1
    Author Affiliations:
    • Sony Semiconductor Solutions Corporation, Kanagawa, Japan
  • Author Name: Shuji Manda
    Affiliation: Sony Semiconductor Solutions Corporation, Kanagawa, Japan
    Author URL: https://ieeexplore.ieee.org/author/798392997492334
    ID: 798392997492334
    Order: 2
    Author Affiliations:
    • Sony Semiconductor Solutions Corporation, Kanagawa, Japan
  • Author Name: Yukako Ikegami
    Affiliation: Sony Semiconductor Solutions Corporation, Kanagawa, Japan
    Author URL: https://ieeexplore.ieee.org/author/353897547973425
    ID: 353897547973425
    Order: 3
    Author Affiliations:
    • Sony Semiconductor Solutions Corporation, Kanagawa, Japan
  • Author Name: Takahiro Kamei
    Affiliation: Sony Semiconductor Solutions Corporation, Kanagawa, Japan
    Author URL: https://ieeexplore.ieee.org/author/37089980207
    ID: 37089980207
    Order: 4
    Author Affiliations:
    • Sony Semiconductor Solutions Corporation, Kanagawa, Japan
  • Author Name: Kan Shimizu
    Affiliation: Sony Semiconductor Solutions Corporation, Kanagawa, Japan
    Author URL: https://ieeexplore.ieee.org/author/37086951411
    ID: 37086951411
    Order: 5
    Author Affiliations:
    • Sony Semiconductor Solutions Corporation, Kanagawa, Japan
  • Author Name: Hayato Iwamoto
    Affiliation: Sony Semiconductor Solutions Corporation, Kanagawa, Japan
    Author URL: https://ieeexplore.ieee.org/author/37297571400
    ID: 37297571400
    Order: 6
    Author Affiliations:
    • Sony Semiconductor Solutions Corporation, Kanagawa, Japan

Image Sensor

• sensor_type: CMOS
• resolution: 1280x1040
• dynamic_range: Wide dynamic range
• pixel_size: 5 um
• dark_current: Low dark current

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

• sensitivity: High sensitivity for wavelengths ranging from visible to SWIR

Applications & Benefits

• cell_imaging: Applications in mobile gadgets, surveillance, factory automation, autonomous driving, medical imaging, robotics, and AI systems.
• benefits: Improves sensitivity and functionality for various photo-taking scenes.

Supporting Organizations

• supported_by: New Energy and Industrial Technology Development Organization (NEDO)

Manuscript Details

• publication_date: 22-25 April 2024

Relevancy Score

• score: 9
• missing_fields:
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

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