3D Measurement Workflow For Packaging Development And Production Control Using Highresolution 3D Xray Microscope

• doi: 10.1109/EPTC.2018.8654390
• title: 3D Measurement Workflow for Packaging Development and Production Control Using High-Resolution 3D X-ray Microscope
• publisher: IEEE
• isbn: 978-1-5386-7669-1
• issn:
• rank: 75
• access_type: LOCKED
• content_type: Conferences
• abstract: Existing technologies have become less effective for structural inspection and metrology for highly complex 3D semiconductor packages. It is virtually impossible to measure embedded structures of a semiconductor package without physically opening it. In this paper, we propose a new workflow to enable 3D structural measurements without physically altering or destroying a sample. Based on a high-resolution 3D X-ray tomography technique, we have developed a semi-automated metrology workflow to extract critical geometric information from intact packages. In the first case study, the test sample was a commercial DRAM package with a 4-die stack. We utilized the measurement workflow to have successfully extracted bond line thickness, solder volume and solder shape information. In the second case study, several smartphone camera modules were used to further validate this metrology workflow. The measurement was focused on two major components of the camera module: CMOS imaging sensor (CIS) package and lens optics assembly. After the samples were imaged with XRM at high resolution, a measurement workflow followed to measure Au bump height, volume, surface area, and other critical dimensions in the CIS package. In the case of lens optics measurement, lens gap, lens thickness, lens tilt and decentricity were measured from 3D tomographic images using the similar workflow. The workflow was scripted to test multiple repetitive parts for high repeatability and reproducibility.
• article_number: 8654390
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8654390
• html_url: https://ieeexplore.ieee.org/document/8654390/
• abstract_url: https://ieeexplore.ieee.org/document/8654390/
• publication_title: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)
• conference_location: Singapore
• conference_dates: 4-7 Dec. 2018
• publication_number: 8643649
• is_number: 8654260
• publication_year: 2018
• publication_date: 4-7 Dec. 2018
• start_page: 206
• end_page: 210
• citing_paper_count: 2
• citing_patent_count: 0
• download_count: 162
• insert_date: 20190228
• index_terms:
  • ieee_terms:
    • Three-dimensional displays
    • Semiconductor device measurement
    • Gold
    • Volume measurement
    • Image resolution
    • Random access memory
    • Tomography
  • dynamic_index_terms:
    • High-resolution
    • 3D Measurements
    • X-ray Microscopy
    • 3D X-ray
    • 3D X-ray Microscope
    • High-resolution 3D X-ray
    • Part Of Package
    • Software Part
    • Optical Lens
    • Optical Lenses
    • Lens Thickness
    • Camera Module
    • Field Of View
    • Field-of-view
    • High-resolution Images
    • Optical Axis
    • Fiber Axis
    • Beam Axis
    • 3D Data
    • Intermetallic
    • Metal Compounds
    • Intermetallic Compounds
    • Local Algorithm
    • Meat Processing
    • Packaging Industry
    • Physical Techniques
    • Camera Lens
    • Camera Lenses
    • Electronic Packaging
    • Voxel Resolution
    • Failure Analysis
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 978-1-5386-7669-1, isbnType: New-2005
  • format: USB ISBN, value: 978-1-5386-7667-7, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-5386-7668-4, isbnType: New-2005
• authors:
  • Author Name: Allen Gu
    Affiliation: Process Control Solutions, ZEISS Semiconductor Manufacturing Technology, Pleasanton,, 4385 Hopyard Road, Suite 100,, CA
    Author URL: https://ieeexplore.ieee.org/author/38467656100
    ID: 38467656100
    Order: 1
    Author Affiliations:
    • Process Control Solutions, ZEISS Semiconductor Manufacturing Technology, Pleasanton,, 4385 Hopyard Road, Suite 100,, CA
  • Author Name: John Auyoong
    Affiliation: Process Control Solutions, ZEISS Semiconductor Manufacturing Technology, Pleasanton,, 4385 Hopyard Road, Suite 100,, CA
    Author URL: https://ieeexplore.ieee.org/author/37086696619
    ID: 37086696619
    Order: 2
    Author Affiliations:
    • Process Control Solutions, ZEISS Semiconductor Manufacturing Technology, Pleasanton,, 4385 Hopyard Road, Suite 100,, CA

Image Sensor

• sensor_type: CMOS
• resolution: Not specified in text
• dynamic_range: Not specified in text
• pixel_size: Not specified in text
• dark_current: Not specified in text

Optical Data

• focal_length: Not specified in text
• aperture: Not specified in text
• field_of_view: Not specified in text
• distortion: Not specified in text

Performance Metrics

• frame_rate: Not specified in text
• signal_to_noise_ratio: Not specified in text
• sensitivity: Not specified in text
• shutter_speed: Not specified in text
• power_consumption: Not specified in text
• noise: Not specified in text

Applications & Benefits

• cell_imaging: Not specified in text
• benefits: Not specified in text

Supporting Organizations

• supported_by: ZEISS Semiconductor Manufacturing Technology

Manuscript Details

• publication_date: 4-7 Dec. 2018

Relevancy Score

• score: 8
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise
  • cell_imaging
  • benefits

Processed JSON Filename

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