3D Integration Applications And Market Trends

• doi: 10.1109/3DIC.2015.7334567
• title: 3D integration: Applications and market trends
• publisher: IEEE
• isbn: 978-1-4673-9384-3
• issn:
• rank: 83
• access_type: LOCKED
• content_type: Conferences
• abstract: 3D integration using through-silicon-via (TSV) technology can bring several advantages over traditional integration techniques, such as System-on-Chip (SOC): shorter connections, increased interconnect density and bandwidth, lower power consumption and enhanced integration flexibility. Such advantages have already been shown for various products, from CMOS Image Sensors and MEMS devices in the consumer market, to FPGAs and more recently, memories for high-end applications. This paper will provide an overview of the different applications of 3D integration using TSV technology, including product announcements, reverse engineering and worldwide patent activities, highlighting the most active players and their activities.
• article_number: 7334567
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7334567
• html_url: https://ieeexplore.ieee.org/document/7334567/
• abstract_url: https://ieeexplore.ieee.org/document/7334567/
• publication_title: 2015 International 3D Systems Integration Conference (3DIC)
• conference_location: Sendai, Japan
• conference_dates: 31 Aug.-2 Sept. 2015
• publication_number: 7328029
• is_number: 7334459
• publication_year: 2015
• publication_date: 31 Aug.-2 Sept. 2015
• start_page: TS5.1.1
• end_page: TS5.1.7
• citing_paper_count: 29
• citing_patent_count: 0
• download_count: 1303
• insert_date: 20151123
• index_terms:
  • ieee_terms:
    • CMOS integrated circuits
    • Three-dimensional displays
    • CMOS technology
    • Radio frequency
    • Field programmable gate arrays
    • Bandwidth
  • author_terms:
    • 3D Integration
    • 3D Packaging
    • TSV
    • 3D-IC
    • 2.5D Interposer
    • IP
    • Applications
    • Forecasts
  • dynamic_index_terms:
    • Market Trends
    • Price Inflation
    • Price Trends
    • 3D Integration
    • Low Consumption
    • Power Consumption
    • Low Power Consumption
    • Reverse Engineering
    • Consumer Market
    • Silicon
    • Form Factor
    • Graphics Processing Unit
    • GPUs
    • High-performance Computing
    • Supercomputer
    • Previous Generations
    • Vertical Integration
    • Supplier Integration
    • Market Segmentation
    • Alternative Technologies
    • Advanced Software
    • Advanced Packaging
    • 3D Stacks
    • Flash Memory
    • Flash Storage
    • Traditional Platforms
    • Technology Node
    • Packaging Technology
    • Moore’s Law
    • Traditional Packaging
    • Flip-chip
    • Microbumps
    • Graphics Applications
    • Computer Graphics Applications
    • Memory Bandwidth
    • Pitch Size
    • Wireless
    • Wireless Communication
    • Cost Reduction
• isbn_formats:
  • format: USB ISBN, value: 978-1-4673-9384-3, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-4673-9385-0, isbnType: New-2005
• authors:
  • Author Name: Rozalia Beica
    Affiliation: Advanced Packaging Business Unit Yole Developpement, Villeurbanne, France
    Author URL: https://ieeexplore.ieee.org/author/37284429700
    ID: 37284429700
    Order: 1
    Author Affiliations:
    • Advanced Packaging Business Unit Yole Developpement, Villeurbanne, France

Image Sensor

• sensor_type: CMOS
• resolution: 8 Megapixel
• dynamic_range: not specified
• pixel_size: 1.5µm
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

Applications & Benefits

• cell_imaging: First application which entered production was for CMOS image sensors, where performance and miniaturization were the main drivers.
• benefits: Sony was able to achieve a more efficient utilization of the silicon space by occupying 90% of it with the pixel area.

Supporting Organizations

• supported_by: Sony, Apple

Manuscript Details

• publication_date: 31 Aug.-2 Sept. 2015

Relevancy Score

• score: 10

Processed JSON Filename

request_c1b87b66-b37b-411f-82ea-fabdb791d1b4-3d_integration_applications_and_market_trends.json