2D And 3D Integrated Image Sensor With A Bussharing Mechanism
- doi: 10.1109/MWSCAS.2012.6291976
-
title: 2D and 3D integrated image sensor with a
bus-sharing mechanism
- publisher: IEEE
- isbn: 978-1-4673-2525-7
- issn: 1548-3746
- partnum: 12CH39005
- rank: 54
- access_type: LOCKED
- content_type: Conferences
-
abstract: This work develops a 2D/3D integrated image
sensor that includes photodiodes, pixel circuits, correlated double
sampling circuits, sense amplifiers, a multi-channel Time-to-Digital
Converter (TDC), a column decoder, a row decoder, a controller and
readout circuits. The photodiode of P-diffusion_N-well_P-substrate is
used to sense photos at 2D and 3D modes under different biased voltages.
At 2D and 3D modes, a charge supply mechanism and a feedback pull-down
mechanism in a pixel circuit are adopted to delay the saturation and
accelerate the response, respectively. As well as a multi-channel TDC,
rapid parallel reading at a 3D mode is accomplished by using a
bus-sharing mechanism. Based on the TSMC 0.35μm 2P4M CMOS technology, a
352×288-pixel 2D and 88×72-pixel 3D integrated image sensor was
implemented to have a die size of 12mm×12mm. The dynamic range at a 2D
mode can reach 110dB and the depth resolution can be around 4cm at a 3D
mode. Therefore, the proposed integrated image sensor can effectively
switch between 2D and 3D sensing operations for various multimedia
capturing applications.
- article_number: 6291976
-
pdf_url:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6291976
-
html_url:
https://ieeexplore.ieee.org/document/6291976/
-
abstract_url:
https://ieeexplore.ieee.org/document/6291976/
-
publication_title: 2012 IEEE 55th International Midwest
Symposium on Circuits and Systems (MWSCAS)
- conference_location: Boise, ID, USA
- conference_dates: 5-8 Aug. 2012
- publication_number: 6276898
- is_number: 6291930
- publication_year: 2012
- publication_date: 5-8 Aug. 2012
- start_page: 138
- end_page: 141
- citing_paper_count: 1
- citing_patent_count: 0
- download_count: 219
- insert_date: 20120903
-
index_terms:
-
ieee_terms:
- Photodiodes
- Image sensors
- Arrays
- CMOS integrated circuits
- Dynamic range
- Image resolution
- Hardware
-
dynamic_index_terms:
- Image Sensor
- Camera Sensor
- Dynamic Range
- Photodiode
- 3D Mode
- Readout Circuit
- Time-to-digital Converter
- 2D Mode
- Sense Amplifier
- Low Cost
- Light Source
- 3D Images
- Travel Time
- 2D Images
- Transmission Line
- Inverter
- Hardware Cost
- Bus Lines
- Object Depth
- Trigger Pulse
-
isbn_formats:
-
format: Online ISBN,
value: 978-1-4673-2525-7,
isbnType: New-2005
-
format: Print ISBN,
value: 978-1-4673-2526-4,
isbnType: New-2005
-
format: Electronic ISBN,
value: 978-1-4673-2527-1,
isbnType: New-2005
-
authors:
-
Author Name: Oscal T.-C. Chen
Affiliation: Department of Electronic Engineering
and Advanced Institute of Manufacturing with High-tech Innovations,
National Chung Cheng University, Chiayi, Taiwan
Author URL:
https://ieeexplore.ieee.org/author/37271445000
ID: 37271445000
Order: 1
Author Affiliations:
-
Department of Electronic Engineering and Advanced Institute of
Manufacturing with High-tech Innovations, National Chung Cheng
University, Chiayi, Taiwan
-
Author Name: Kuan-Hsien Lin
Affiliation: Department of Electronic Engineering
and Advanced Institute of Manufacturing with High-tech Innovations,
National Chung Cheng University, Chiayi, Taiwan
Author URL:
https://ieeexplore.ieee.org/author/38469656900
ID: 38469656900
Order: 2
Author Affiliations:
-
Department of Electronic Engineering and Advanced Institute of
Manufacturing with High-tech Innovations, National Chung Cheng
University, Chiayi, Taiwan
-
Author Name: Zhe Ming Liu
Affiliation: Department of Electronic Engineering
and Advanced Institute of Manufacturing with High-tech Innovations,
National Chung Cheng University, Chiayi, Taiwan
Author URL:
https://ieeexplore.ieee.org/author/38237780400
ID: 38237780400
Order: 3
Author Affiliations:
-
Department of Electronic Engineering and Advanced Institute of
Manufacturing with High-tech Innovations, National Chung Cheng
University, Chiayi, Taiwan
-
Author Name: Shu Chun Wang
Affiliation: Department of Electronic Engineering
and Advanced Institute of Manufacturing with High-tech Innovations,
National Chung Cheng University, Chiayi, Taiwan
Author URL:
https://ieeexplore.ieee.org/author/38469437800
ID: 38469437800
Order: 4
Author Affiliations:
-
Department of Electronic Engineering and Advanced Institute of
Manufacturing with High-tech Innovations, National Chung Cheng
University, Chiayi, Taiwan
-
Author Name: Meng-Lin Hsia
Affiliation: Department of Electronic Engineering
and Advanced Institute of Manufacturing with High-tech Innovations,
National Chung Cheng University, Chiayi, Taiwan
Author URL:
https://ieeexplore.ieee.org/author/37271444900
ID: 37271444900
Order: 5
Author Affiliations:
-
Department of Electronic Engineering and Advanced Institute of
Manufacturing with High-tech Innovations, National Chung Cheng
University, Chiayi, Taiwan
Image Sensor
- sensor_type: CMOS
- resolution: 352×288 (2D), 88×72 (3D)
- dynamic_range: 110 dB
- pixel_size: 10 µm × 10 µm
- dark_current: Not Specified
Optical Data
- focal_length: Not Specified
- aperture: Not Specified
- field_of_view: Not Specified
- distortion: Not Specified
Performance Metrics
- frame_rate: Not Specified
- signal_to_noise_ratio: Not Specified
- sensitivity: Not Specified
- shutter_speed: Not Specified
- power_consumption: 580 mW
- noise: Not Specified
Applications & Benefits
- cell_imaging: Not Specified
-
benefits: The proposed integrated image sensor can
effectively switch between 2D and 3D sensing operations for various
multimedia capturing applications.
Supporting Organizations
-
supported_by: National Science Council, Taiwan;
Ministry of Education, Taiwan, Republic of China.
Manuscript Details
- publication_date: 5-8 Aug. 2012
Relevancy Score
- score: 9
-
missing_fields:
- focal_length
- aperture
- field_of_view
- distortion
- frame_rate
- signal_to_noise_ratio
- sensitivity
- shutter_speed
- dark_current
- noise
Processed JSON Filename
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