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Adam Quinn, Manuel B. Valentin, Thomas Zimmerman, Davide Braga, Seda
Memik, Farah Fahim, “A Cryogenic Readout IC with 100 KSPS in-Pixel ADC for
Skipper CCD-in-CMOS Sensors,”
2023 IEEE International Symposium on Circuits and Systems (ISCAS), 2023, pp. 1–5, Art. no. 10182087, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10182087
Marina E. Plissiti, Christoforos Papaioannou, Yiorgos Sfikas, Georgios
Papatheodorou, Simon-Ilias Poulis, Aristides Efthymiou, Yiorgos
Tsiatouhas, “An efficient adaptive thresholding scheme for signal decoding
in NLOS VLC systems,”
2021 IEEE International Mediterranean Conference on Communications and
Networking (MeditCom), 2021, pp. 378–382, Art. no. 9647560, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9647560
Gines Domenech-Asensi, Ramón Ruiz-Merino, Juan Zapata-Perez, José A.
Díaz-Madrid, “A 12T SRAM in-Memory Computing differential current
architecture for CNN implementations,”
2023 IEEE International Symposium on Circuits and Systems (ISCAS), 2023, pp. 1–5, Art. no. 10181992, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10181992
Pai-Hsiang Hsu, Yueh-Ru Lee, Chia-Hung Chen, Chung-Chih Hung, “A Low-Noise
Area-Efficient Column-Parallel ADC With an Input Triplet for a 120-dB High
Dynamic Range CMOS Image Sensor,”
IEEE Transactions on Very Large Scale Integration (VLSI) Systems,
2023, pp. 1939–1949, Art. no. 10287277, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10287277
Jing Gao, Yuchen Gong, Zhiyuan Gao, Kaiming Nie, Jiangtao Xu, “Analytical
Modeling of Exposure Process in Pinned Photodiode CMOS Image Sensors,”
IEEE Journal of the Electron Devices Society, 2020, pp.
1063–1071, Art. no. 9205305, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9205305
Abhinav Bhattacharya, Tusha Tanya, Mukul Sarkar, Boyd Fowler, “RTS Noise
Reduction in CMOS Image Sensors Using Correlated Extrema Cancellation,”
IEEE Transactions on Electron Devices, 2024, pp. 3050–3055, Art.
no. 10466729, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10466729
Don Barber, Murali Tummala, John McEachen, “Daylight Noise Baseline for
Outdoor Visible Light Communication with CMOS Sensors,”
2024 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR), 2024, pp. 1–2, Art. no. 10676443, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10676443
Frank Julca-Aguilar, Jason Taylor, Mario Bijelic, Fahim Mannan, Ethan
Tseng, Felix Heide, “Gated3D: Monocular 3D Object Detection From Temporal
Illumination Cues,”
2021 IEEE/CVF International Conference on Computer Vision (ICCV),
2021, pp. 2918–2928, Art. no. 9710811, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9710811
Minghao Li, Atal A. S. Gill, Anne Vanhoestenberghe, Sara S.
Ghoreishizadeh, “An Integrated Circuit for Galvanostatic Electrodeposition
of on-chip Electrochemical Sensors,”
2022 29th IEEE International Conference on Electronics, Circuits and
Systems (ICECS), 2022, pp. 1–4, Art. no. 9970881, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9970881
Min Liu, Ziteng Cai, Shaohua Zhou, Man-Kay Law, Jian Liu, Jianguo Ma,
Nanjian Wu, Liyuan Liu, “A 16.4kPixel 3.08-to-3.86THz Digital Real-Time
CMOS Image Sensor with 73dB Dynamic Range,”
2023 IEEE International Solid-State Circuits Conference (ISSCC),
2023, pp. 4–6, Art. no. 10067620, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10067620
Jinchen Wang, Mohamed I. Ibrahim, Isaac B. Harris, Nathan M. Monroe,
Muhammad Ibrahim Wasiq Khan, Xiang Yi, Dirk R. Englund, Ruonan Han, “34.1
THz Cryo-CMOS Backscatter Transceiver: A Contactless 4 Kelvin-300 Kelvin
Data Interface,”
2023 IEEE International Solid-State Circuits Conference (ISSCC),
2023, pp. 504–506, Art. no. 10067445, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10067445
Amandeep Kaur, Deepak Mishra, K. M. Amogh, Mukul Sarkar, “On-Array
Compressive Acquisition in CMOS Image Sensors Using Accumulated Spatial
Gradients,”
IEEE Transactions on Circuits and Systems for Video Technology,
2021, pp. 523–532, Art. no. 9075293, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9075293
Karthik Vinod, K Lakshmi, Greeshma Girish, Aswathi Krishnan, G Shekar,
“Implementation of Intermediate Image Processing for Video from Closed
Circuit Television Cameras,”
2020 International Conference on Communication and Signal Processing
(ICCSP), 2020, pp. 1208–1211, Art. no. 9182107, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9182107
Alexandre Le Roch, Cédric Virmontois, Philippe Paillet, Jean-Marc Belloir,
Serena Rizzolo, Olivier Marcelot, Hugo Dewitte, Marco Van Uffelen, Laura
Mont Casellas, Pierre Magnan, Vincent Goiffon, “Phosphorus Versus Arsenic:
Role of the Photodiode Doping Element in CMOS Image Sensor
Radiation-Induced Dark Current and Random Telegraph Signal,”
IEEE Transactions on Nuclear Science, 2020, pp. 1241–1250, Art.
no. 9120078, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9120078
Taichi Yoshida, Yusuke Matsushita, Naoki Sakaguchi, Yong-Joon Choi,
Kazuhiro Takahashi, Kotaro Takayama, Kazuaki Sawada, Toshihiko Noda,
“Development of Plant Growth Monitoring Sensor to Visualize Ion Dynamics
in Plants and its Functional Validation in Long-Term Measurements,”
2023 22nd International Conference on Solid-State Sensors, Actuators
and Microsystems (Transducers), 2023, pp. 725–728, Art. no. 10516897, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10516897
H. Dewitte, S. Rizzolo, P. Paillet, P. Magnan, A. Le Roch, F. Corbière, R.
Molina, S. Girard, T. Allanche, C. Muller, H. Desjonqueres, J. -R. Macé,
J. -P. Baudu, A. Saravia Flores, V. Goiffon, “Annealing Effects on
Radiation-Hardened CMOS Image Sensors Exposed to Ultrahigh Total Ionizing
Doses,” IEEE Transactions on Nuclear Science, 2020, pp.
1284–1292, Art. no. 9115076, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9115076
Chun Ho Fan, Hoi Ping Ng, Siu Cheung So, Ngai Tat Man, Chi Yung Lee, Ming
Li, Thomas Uhrmann, Jürgen Burggraf, Mariana Pires, “Direct Die to Wafer
Cu Hybrid Bonding for Volume Production,”
2023 IEEE 73rd Electronic Components and Technology Conference
(ECTC), 2023, pp. 91–96, Art. no. 10195328, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10195328
G. Pignataro, P. Cepparulo, O. Cuomo, A. Cusano, R. Rao, M. Ruvo, F.
Palma, “Use of CMOS Image Sensor for early detection of ischemic and
haemorrhagic stroke,”
2021 Joint International EUROSOI Workshop and International Conference
on Ultimate Integration on Silicon (EuroSOI-ULIS), 2021, pp. 1–4, Art. no. 9560702, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9560702
Takaaki E. Murakami, Yasuyuki Shimoi, Tsutomu Kobayashi, Yoshihiro Sato,
“Evaluation of the Impacts of Vth Variation and Leakage Current on the
Signal-to-Noise Ratio of a Single-Shot HDR Image Sensor with a Lateral
Overflow Transistor,”
2024 IEEE International Meeting for Future of Electron Devices, Kansai
(IMFEDK), 2024, pp. 1–2, Art. no. 10814182, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10814182
Young-Gil Cha, Hyun-Kyung Kim, Jae-Myeong Kwon, Ki-Hun Jeong,
“Microaperture Modulated Ultrathin Array Camera for High Dynamic Range
(HDR) Imaging,”
2023 22nd International Conference on Solid-State Sensors, Actuators
and Microsystems (Transducers), 2023, pp. 1433–1436, Art. no. 10517123, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10517123
Olivier Weppe, Jérôme Chossat, Thibaut Marty, Jean-Christophe Prévotet,
Maxime Pelcat, “Streamlined Models of CMOS Image Sensors Carbon Impacts,”
2024 27th Euromicro Conference on Digital System Design (DSD),
2024, pp. 250–257, Art. no. 10741688, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10741688
Truong Nguyen Pham, Patrice Marchand, Christian Finck, Frederic Boisson,
David Brasse, Patrice Laquerriere, “18F autoradiography With the
Mimosa-28: Characterization and Application,”
IEEE Transactions on Radiation and Plasma Medical Sciences, 2020,
pp. 630–636, Art. no. 9099203, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9099203
Minkyo Shim, Woonghee Lee, Yunhee Lee, Kwanseo Park, Deog-Kyoon Jeong, “A
12-Gbps, 0.24-pJ/b/dB PAM-4 Receiver With Dead-Zone Free SS-MMSE PD for
CIS Link,” IEEE Access, 2023, pp. 46513–46521, Art. no. 10122941,
IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10122941
R. Dolenec, M.-L. Wu, C. Bruschini, E. Charbon, D. Consuegra Rodríguez, F.
Gramuglia, P. Križan, A. Seljak, R. Pestotnik, S. Korpar, “Neutron
radiation hardness of single-photon avalanche diodes for future RICH
detectors,”
2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and
International Symposium on Room-Temperature Semiconductor Detectors (NSS
MIC RTSD), 2023, pp. 1–1, Art. no. 10337871, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10337871
Aroutin Khachaturian, Reza Fatemi, Ali Hajimiri, “IQ Photonic Receiver for
Coherent Imaging With a Scalable Aperture,”
IEEE Open Journal of the Solid-State Circuits Society, 2021, pp.
263–270, Art. no. 9540747, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9540747
Antoine Salih Alj, Pierre Touron, François Roy, Arnaud Tournier, Julien
Michelot, Stéphane Demiguel, Cédric Virmontois, Valérian Lalucaa, Pierre
Magnan, Vincent Goiffon, “Dark Current and Clock-Induced Charges in a
Fully Depleted Charge Domain CDTI-Based CCD-on-CMOS Image Sensor,”
IEEE Sensors Journal, 2024, pp. 25652–25661, Art. no. 10600100,
IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10600100
Amr M. Maghraby, Ibrahim Bozyel, Islam T. Abougindia, Suat U. Ay, “Review
of In-Pixel Gain Amplifiers and Readout Circuits for Low-Light CMOS Image
Sensors,” IEEE Sensors Reviews, 2025, pp. 1–18, Art. no.
10964845, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10964845
Taimur Rabuske, Mário Silva, Diogo Brito, João Silva, Hanna Iva Busse, Ana
V. Silva, Sofia Abrunhosa, Pedro Ribeiro, Susana Cardoso, “A Biomedical
Imaging System Based on an Integrated Array of Magnetoresistive Sensors,”
2021 19th IEEE International New Circuits and Systems Conference
(NEWCAS), 2021, pp. 1–4, Art. no. 9462751, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9462751
Margot Faure, Christophe Dubarry, Pablo Renaud, Floriane Baudin, Sebastien
Dominguez, Karine Abadie, Christophe Morales, Constantin Matei, Frank
Fournel, “Ultra Low Temperature Hybrid Bonding: Morphological and
Electrical Characterizations,”
2024 IEEE 10th Electronics System-Integration Technology Conference
(ESTC), 2024, pp. 1–6, Art. no. 10712151, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10712151
Kaiming Nie, Wanbin Zha, Xiaolin Shi, Jiawen Li, Jiangtao Xu, Jianguo Ma,
“A Single Slope ADC With Row-Wise Noise Reduction Technique for CMOS Image
Sensor,”
IEEE Transactions on Circuits and Systems I: Regular Papers,
2020, pp. 2873–2882, Art. no. 9036882, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9036882
Patrick Schirmer, Severin Ringelstetter, “Adhesive Solutions for Closed
Cavity Packaging,”
2023 24th European Microelectronics and Packaging Conference &
Exhibition (EMPC), 2023, pp. 1–3, Art. no. 10418291, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10418291
C. Leyris, J-c. Vildeuil, F. Roy, F. Martinez, M. Valenza, A. Hoffmann,
“Response of Correlated Double Sampling CMOS Imager Circuit to Random
Telegraph Signal Noise,”
2006 International Caribbean Conference on Devices, Circuits and
Systems, 2006, pp. 109–114, Art. no. 4016874, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=4016874
Su-Hyun Han, Seonghyeok Park, Jung-Hoon Chun, Jaehyuk Choi, Seong-Jin Kim,
“A 3.1- $\mu$ W Analog-Assisted Zoom Histogramming TDC in 35- $\mu$ m
Pixel Pitch for Flash LiDAR Sensor,”
IEEE Journal of Solid-State Circuits, 2024, pp. 1–12, Art. no.
10737650, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10737650
Damián Leonel Corzi, José Lipovetzky, Martín Pérez, Silvina Gabriela
Gutierrez, Miguel Sofo Haro, Fabricio Alcalde Bessia, Mariano Gomez
Berisso, “Simulating Charge Collection Efficiency in a CMOS Pixel Array
for X-ray detection,”
2022 Argentine Conference on Electronics (CAE), 2022, pp. 26–30,
Art. no. 9762498, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9762498
Paolo Andreini, Simone Bonechi, Alessandro Mecocci, Veronica Lucia Rossi,
Giuseppe Ferorelli, Giorgio Chini, Antonio Sanesi, “Enhancing Fluorescence
Image Analysis through Deep Learning,”
2023 IEEE International Conference on Metrology for eXtended Reality,
Artificial Intelligence and Neural Engineering (MetroXRAINE), 2023, pp. 212–217, Art. no. 10405797, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10405797
Jae-Hyeok Hwang, Yunkyung Kim, “High Sensitive Pixel with Covered
Microlens for Quad Color Filter Array,”
2022 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR), 2022, pp. 1–2, Art. no. 10432685, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10432685
Ziwei Li, Han Xu, Li Luo, Qi Wei, Fei Qiao, “A 5.9μW Ultra-Low-Power
Dual-Resolution CIS Chip of Sensing-with-Computing for Always-on
Intelligent Visual Devices,”
2021 IEEE International Symposium on Circuits and Systems (ISCAS), 2021, pp. 1–5, Art. no. 9401338, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9401338
Martín Pérez, Miguel Sofo Haro, Juan Jerónimo Blostein, Andres Cicutin,
Maria Liz Crespo, Fabricio Alcalde Bessia, Ivan Sidelnik, Mariano Gómez
Berisso, José Lipovetzky, “X-ray spectroscopy up to 17.6 keV using a
Commercial Off The Shelf CMOS Image Sensor,”
2020 Argentine Conference on Electronics (CAE), 2020, pp. 69–72,
Art. no. 9046365, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9046365
Jingxuan Shen, Lilei Hu, Yichen Zhang, Zhu Chen, Liying Liu, Yang Liu,
Yuqian Ma, Chang Chen, “Ultra-Fast On-Chip Sensing for PCR Detection with
Machine Learning-Based Image Processing Algorithm,”
2022 China Semiconductor Technology International Conference
(CSTIC), 2022, pp. 1–4, Art. no. 9856872, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9856872
Chunshan Zhao, Bai Kang, Wuzhi Zhang, Yamin Cao, Wei Zhou, “Reduction of
random telegraph signal noise by optimizing deep trench isolation process
for backside illuminated CMOS image sensor,”
2021 China Semiconductor Technology International Conference
(CSTIC), 2021, pp. 1–3, Art. no. 9461499, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9461499
Quanze Li, Junkai Zhang, Zunkai Huang, Li Tian, Yongxin Zhu, Hui Wang,
Songlin Feng, Xiaogang Li, “Analysis and Modeling of a Novel Drift Field
Implementation Method for Large-Area Photodiodes,”
2022 IEEE 16th International Conference on Solid-State & Integrated
Circuit Technology (ICSICT), 2022, pp. 1–3, Art. no. 9963243, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9963243
C. R. Grace, E. Fong, D. Gnani, T. Stezelberger, P. Denes, “A 24-Channel
Digitizer With a JESD204B-Compliant Serial Interface for High-Speed
Detectors,” IEEE Transactions on Nuclear Science, 2021, pp.
426–433, Art. no. 9369385, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9369385
S. Abdallah, B. Saleh, A.K. Aboulsoud, “A general overview of solid state
imaging sensors types,”
Third Workshop on Photonics and its Application at Egyptian Engineering
Faculties and Institutes (Cat. No.02EX509), 2002, pp. 1–10, Art. no. 995076, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=995076
Reza Mohammadi, Peter M. Levine, Karim S. Karim, “Experimental
Demonstration of the Small Pixel Effect in an Amorphous Photoconductor
using a Monolithic Spectral Single Photon Counting Capable CMOS-Integrated
Amorphous-Selenium Sensor,”
2022 International Electron Devices Meeting (IEDM), 2022, pp.
467–470, Art. no. 10019531, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10019531
Francis Vasquez-Aza, Hongyi Sun, Chuanyu Lian, Yi-Siou Huang, Steven A.
Vitale, Ichiro Takeuchi, Juejun Hu, Nathan Youngblood, Carlos A. Ríos
Ocampo, Georges Pavlidis, “Maximizing the Thermal Performance of
Microheaters for Non-Volatile Phase Change Photonics: A Comparative Study
of Pulse Width Parameter Effects,”
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical
Phenomena in Electronic Systems (ITherm), 2024, pp. 1–6, Art. no. 10709548, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10709548
Shuping Tao, Qinping Feng, Zongxuan Li, Han Liu, Wei Dou, Xuyan Zhang,
Haocheng Du, Xiaopeng Zhang, “A Lightweight and High-Resolution Digital
Integrated LVF Spectral Imaging System,”
IEEE Transactions on Geoscience and Remote Sensing, 2024, pp.
1–9, Art. no. 10556739, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10556739
Mao Junxia, “A Study on Pixel Performance of DCG CMOS Image Sensor Through
Optimizing Implant Condition,”
2021 China Semiconductor Technology International Conference
(CSTIC), 2021, pp. 1–2, Art. no. 9461549, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9461549
Zhuo Yin, Jianjun Li, Xinruo Su, Dejing Ma, Hanming Wu, Xing Zhang, “Study
on Low Power Back-Side Deep Trench Isolation Etching on Stack-BSI CMOS
Image Sensor,”
2021 China Semiconductor Technology International Conference
(CSTIC), 2021, pp. 1–3, Art. no. 9461581, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9461581
Sergio Moreno, Victor Moro, Angel Dieguez, “A 72-bin in-pixel mixed-signal
TDC for SPAD-based fluorescence lifetime measurements,”
2022 37th Conference on Design of Circuits and Integrated Circuits
(DCIS), 2022, pp. 01–05, Art. no. 9970121, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9970121
Huihui Yue, Jichang Guo, Xiangjun Yin, Yi Zhang, Bihan Wen, Chongyi Li,
“Salient Object Detection Toward Single-Pixel Imaging,”
IEEE Transactions on Circuits and Systems for Video Technology,
2024, pp. 235–247, Art. no. 10145417, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10145417
Benjamín Lobos Soto, Cesar A. Azurdia-Meza, David Zabala-Blanco, Ismael
Soto, Pablo Palacios Játiva, Roberto Ahumada-García, “Analysis of a
Visible Light Positioning Database in Extreme Learning Machines
Applications,”
2024 14th International Symposium on Communication Systems, Networks
and Digital Signal Processing (CSNDSP), 2024, pp. 330–335, Art. no. 10636616, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10636616
Ji-Yong Jeong, Junbo Shim, Seong-Kwan Hong, Oh-Kyong Kwon, “A High-Speed
and Energy-Efficient Multi-Bit Cyclic ADC Using Single-Slope Quantizer for
CMOS Image Sensors,”
IEEE Transactions on Circuits and Systems II: Express Briefs,
2021, pp. 2322–2326, Art. no. 9363326, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9363326
Ritsuki Hamagami, Tadashi Ebihara, Naoto Wakatsuki, Koichi Mizutani,
“Underwater Visible Light Communication Using Phase-Shift Keying and
Rolling-shutter Effect,”
2020 IEEE 9th Global Conference on Consumer Electronics (GCCE),
2020, pp. 842–843, Art. no. 9291709, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9291709
Congyi Lyu, Yunhui Liu, Weiguo Zhou, Jianqing Peng, Shanshan Yang, Huijun
Zhang, Linsen Yang, “High-speed target tracking base on FPGA,”
2016 IEEE International Conference on Real-time Computing and Robotics
(RCAR), 2016, pp. 272–276, Art. no. 7784038, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7784038
P. Grybos, R. Kleczek, P. Kmon, A. Krzyzanowska, P. Otfinowski, R.
Szczygiel, M. Zoladz, “Hybrid Detector with Interpixel Communication for
Color X-ray Imaging,”
2021 28th IEEE International Conference on Electronics, Circuits, and
Systems (ICECS), 2021, pp. 1–4, Art. no. 9665489, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9665489
Yao Lun Liu, Chun Hsien Liu, Chun Hao Tsai, Ce Fang Shih, Jau Yang Wu,
Chia Ming Tsai, Sheng Di Lin, “Theoretical Calculation and Demonstration
of High Radiometric Temperature Detection Using A 64 × 128 Pixel SPAD
Image Array,”
IEEE Transactions on Instrumentation and Measurement, 2023, pp.
1–8, Art. no. 10298252, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10298252
Yoshihisa Kagawa, Shuji Manda, Yukako Ikegami, Takahiro Kamei, Kan
Shimizu, Hayato Iwamoto, “3D Stacking Process Technologies for Advanced
CMOS Image Sensors,”
2024 International VLSI Symposium on Technology, Systems and
Applications (VLSI TSA), 2024, pp. 1–1, Art. no. 10546446, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10546446
Kyungmin Lee, Seung Min Heu, Soo Youn Kim, Minkyu Song, “Design of a Low
Power CMOS Image Sensor with an in-Comparator Forcasting Technique and a
Novel Counter,”
2024 31st IEEE International Conference on Electronics, Circuits and
Systems (ICECS), 2024, pp. 1–4, Art. no. 10849320, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10849320
Ramachandra Gambheer, M. S. Bhat, “CCD Sensor Based Cameras for
Sustainable Streaming IoT Applications With Compressed Sensing,”
IEEE Access, 2023, pp. 67882–67892, Art. no. 10171357, IEEE.
Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10171357
Liqiang Han, Albert J. P. Theuwissen, “A Deep Subelectron Temporal Noise
CMOS Image Sensor With Adjustable Sinc-Type Filter to Achieve
Photon-Counting Capability,” IEEE Solid-State Circuits Letters,
2021, pp. 113–116, Art. no. 9454499, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9454499
Bohyeok Jeong, Jaehwan Lee, Jaihyuk Choi, Minkyu Song, Youngdoo Son, Soo
Youn Kim, “A 0.57 mW@1 FPS In-Column Analog CNN Processor Integrated Into
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10153578, IEEE. Available:
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2021 International Symposium on Devices, Circuits and Systems
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2022 IEEE 65th International Midwest Symposium on Circuits and Systems
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2022 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), 2022, pp. 149–152, Art. no. 10090386, IEEE. Available:
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2022 47th International Conference on Infrared, Millimeter and
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2023 IEEE 7th Information Technology and Mechatronics Engineering
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2023 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), 2023, pp. 289–293, Art. no. 10509993, IEEE. Available:
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2022 China Semiconductor Technology International Conference
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2020 IEEE International Conference on Integrated Circuits, Technologies
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Christian Bespin, Ivan Caicedo, Jochen Dingfelder, Fabian Hügging, Hans
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2024 Panhellenic Conference on Electronics & Telecommunications
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Heon-Bin Jang, Yeong-Seok Kim, Jimin Cheon, “Design of a Comparator with
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Takumi Hayashi, Yuta Moritake, Yuki Hirota, Kong Xiangbo, Takeshi Kumaki,
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2022 37th International Technical Conference on Circuits/Systems,
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Zitao Zhao, Lin Wen, Yudong Li, Bingkai Liu, Jie Feng, Zhikang Yang, Yihao
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IEEE Transactions on Nuclear Science, 2024, pp. 2242–2251, Art.
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Nicolas Callens, Georges Gielen, “A Time-Interleaved Extended-Counting
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Donghui Dai, Zhenlin An, Qingrui Pan, Lei Yang, “Harnessing NFC to
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IEEE Transactions on Mobile Computing, 2024, pp. 12952–12968,
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Xueyong Zhang, Arindam Basu, “A 915–1220 TOPS/W, 976–1301 GOPS Hybrid
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Mathis Hoffmann, Thomas Köhler, Bernd Doll, Frank Schebesch, Florian
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So-Yun Kim, Joohee Kim, Heejeong Hong, Youngju Lee, Wonho Lee,
“Improvement of RTS Noise and Peel Off Issue of BSI CIS Products by
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2023 7th IEEE Electron Devices Technology & Manufacturing Conference
(EDTM), 2023, pp. 1–4, Art. no. 10102943, IEEE. Available:
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Jing Gao, Jianzhe Zhao, Kaiming Nie, Jiangtao Xu, “A Low Ripple and Fast
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IEEE Sensors Journal, 2024, pp. 8142–8149, Art. no. 10419182,
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Gines Domenech-Asensi, Francisco Javier Andreo-Oliver, Jose Angel
Diaz-Madrid, Ramon Ruiz-Merino, “CMOS Pipelined in-Memory Computing
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2024 31st IEEE International Conference on Electronics, Circuits and
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of the CLICTD Pixelated Monolithic Sensor Chip,”
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Sumon Kumar Bose, Arindam Basu, “A 389 TOPS/W, Always ON Region Proposal
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Maasa Murata, Rihito Kuroda, Yasuyuki Fujihara, Yusuke Otsuka, Hiroshi
Shibata, Taku Shibaguchi, Yutaka Kamata, Noriyuki Miura, Naoya Kuriyama,
Shigetoshi Sugawa, “A High Near-Infrared Sensitivity Over 70-dB SNR CMOS
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IEEE Transactions on Electron Devices, 2020, pp. 1653–1659, Art.
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Joo Hyoung Kim, Vladimir Pejović, Epimitheas Georgitzikis, Yunlong Li,
Jaenam Kim, Paweł E. Malinowski, Itai Lieberman, David Cheyns, Paul
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IEEE Transactions on Electron Devices, 2022, pp. 2900–2906, Art.
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Yongliang Wang, Xiaoliang Guo, “A low-cost and simple on-chip cell
counting device based on lensless imaging technology,”
2022 3rd International Conference on Computer Vision, Image and Deep
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Abhijit Chatterjee, Srimanta Mitra, Yogesh Kumar, Arti Sarkar, “Free Space
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2023 International Conference on Microwave, Optical, and Communication
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Sajna Tasneem Shoukath Ali, Abubakar Abubakar, Arshad Khan, Amine Bermak,
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2024 International Conference on Microelectronics (ICM), 2024,
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2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology
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2023 IEEE Asian Solid-State Circuits Conference (A-SSCC), 2023,
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2022 5th International Symposium on Autonomous Systems (ISAS),
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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology
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IEEE Transactions on Electron Devices, 2021, pp. 152–157, Art.
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Alexander Svetlitza, Tanya Blank, Sara Stolyarova, Igor Brouk, Sharon
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2023 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), 2023, pp. 314–318, Art. no. 10509869, IEEE. Available:
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Tanner Foley, Alex Fernández-Rajal i Sabala, Makenna Fockler, Zahra
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IEEE Sensors Journal, 2023, pp. 14882–14890, Art. no. 10129218,
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2022 45th Jubilee International Convention on Information,
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C.-M. Zhang, R. Quaglia, A. Shulga, V. Goossens, A. A.-H. Husain, B.
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2024 IEEE Nuclear Science Symposium (NSS), Medical Imaging Conference
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2023 Device Research Conference (DRC), 2023, pp. 1–2, Art. no.
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Yu-Chieh Lee, Avishek Das, Yi Huang, Logeshwaran Venkatesapandian, C. W.
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2024 International VLSI Symposium on Technology, Systems and
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Wenchao Qian, Yilin Wang, Song Zhang, Maowen Song, Yi Zou, Ting Xu,
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Lars Haab, Philipp Flotho, David Eckert, Karsten Schwerdtfeger, Matthias
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2020 42nd Annual International Conference of the IEEE Engineering in
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Yu-Hao Kuo, Chih Chen, “Hybrid Cu-Cu Bonding with Non-Conductive Paste and
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2020 15th International Microsystems, Packaging, Assembly and Circuits
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Chuangchuang Sheng, Yu Xie, Chiheng Tian, Yuansheng Xia, Zhong Chu, Xueyou
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2023 IEEE 5th International Conference on Power, Intelligent Computing
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PRH Stark, Amit Solanki, Victor Murray, Augusto Barton, Fawwaz Habbal,
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2022 Conference on Lasers and Electro-Optics (CLEO), 2022, pp.
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Saerom Lee, Jihye Lim, Jinseok Kim, Sooseok Im, Seungjun Son, Seokjun Won,
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2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference
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Min-Yang Chiu, Guan-Cheng Chen, Tzu-Hsiang Hsu, Ren-Shuo Liu, Chung-Chuan
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IEEE Journal of Solid-State Circuits, 2023, pp. 2767–2777, Art.
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H. Hillemanns, “ALICE ITS3: Technology Qualification Results on Prototype
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2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and
International Symposium on Room-Temperature Semiconductor Detectors (NSS
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Tzu-Hsiang Hsu, Guan-Cheng Chen, Yi-Ren Chen, Ren-Shuo Liu, Chung-Chuan
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Nabeel A. Riza, “Low Image Contrast Detection in a Bright Light
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IEEE Photonics Technology Letters, 2023, pp. 321–324, Art. no.
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Yutaro Shimomura, Takuya Shimada, Ryuya Kirihara, Takeshi Kumaki, “Live
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2020 IEEE International Symposium on Circuits and Systems (ISCAS), 2020, pp. 1–1, Art. no. 9181264, IEEE. Available:
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Haechang Lee, Dongwon Park, Wongi Jeong, Kijeong Kim, Hyunwoo Je, Dongil
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2023 IEEE/CVF International Conference on Computer Vision (ICCV),
2023, pp. 12704–12713, Art. no. 10377249, IEEE. Available:
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Manar Abdelatty, Joseph Incandela, Kangping Hu, Pushkaraj Joshi, Joseph W.
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IEEE Transactions on Biomedical Circuits and Systems, 2024, pp.
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Irina Kim, Dongpan Lim, Youngil Seo, Jeongguk Lee, Yunseok Choi, Seongwook
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Sanjha Khan, Josep Paradells, Marisa Catalan, “Low-Cost Optical Camera
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2023 IEEE 34th Annual International Symposium on Personal, Indoor and
Mobile Radio Communications (PIMRC), 2023, pp. 1–5, Art. no. 10294012, IEEE. Available:
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Heesung Shim, Seung-Sik Kim, Min-Woong Seo, Sangsu Park, Hyukbin Kwon,
Yongjun Kim, Sanggwon Lee, Sungbong Park, Daehee Bae, Si Gyoung Koo,
Masamichi Ito, Jae-hoon Jeon, Sol Yoon, Sung-Jae Byun, Sangyoon Kim,
KwanSik Kim, Gihwan Cho, Joonho Lee, Tekyou Kim, Sungjae Jun, Jae-kyu Lee,
Chang-Rok Moon, Jaihyuk Song, “6.1 A 3-Stacked Hybrid-Shutter CMOS Image
Sensor with Switchable $1.2\mu\mathrm{m}$ -Pitch 50Mpixel Rolling Shutter
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2025 IEEE International Solid-State Circuits Conference (ISSCC),
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Nuttapon Rothong, Pawanrat Chinakunwiphat, Sudarat Chainoi, Borihan
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2023 Research, Invention, and Innovation Congress: Innovative
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Dennis E. Robey, Wesley Thio, Herbert H. C. Iu, Jason K. Eshraghian,
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2021 IEEE International Symposium on Circuits and Systems (ISCAS), 2021, pp. 1–5, Art. no. 9401313, IEEE. Available:
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Josua Florczak, Tom Neubert, Egon Zimmermann, Heinz Rongen, Martin
Kaufmann, Ingo Rienäcker, Wojciech Hajdas, Martin Riese, Stefan Van
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IEEE Transactions on Nuclear Science, 2023, pp. 1966–1972, Art.
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Yu Feng, Tianrui Ma, Adith Boloor, Yuhao Zhu, Xuan Zhang, “Invited Paper:
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2023 IEEE/ACM International Conference on Computer Aided Design
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Ke Wu, Yuekang Guo, Jing Jin, Xiaoming Liu, Jianjun Zhou, “A
Power-Efficient CMOS Image Sensor with In-Sensor Processing and In-Pixel
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2022 IEEE 65th International Midwest Symposium on Circuits and Systems
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Abhiram Gnanasambandam, Stanley H. Chan, “HDR Imaging With Quanta Image
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IEEE Transactions on Computational Imaging, 2020, pp. 1571–1585,
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Chih Hao Wang, Shih Jen Lu, Yang Ming Chou, Chien Yi Kao, Hsin Yi Lin, “A
Wearable Solution for Obstructive Sleep Apnea Risk Evaluation Based on
Optical Sensor,” 2023 IEEE SENSORS, 2023, pp. 1–4, Art. no.
10325053, IEEE. Available:
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Haibiao Zuo, Jiacheng Hao, Haotao Lin, Xiaojin Zhao, Yatao Yang, Lei
Huang, “A 3.02 pJ/Bit 3T-APS-Based In-Sensor Strong PUF Featuring
Near-100% Hardware Reuse Ratio and High Resilience to Machine Learning
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IEEE Transactions on Circuits and Systems II: Express Briefs,
2023, pp. 4206–4210, Art. no. 10143994, IEEE. Available:
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Shigeyuki Imura, Masahide Goto, Hiroto Sato, “Demonstration of Field
Curvature Aberration Correction Using Curved CMOS Image Sensors,”
2024 IEEE SENSORS, 2024, pp. 1–4, Art. no. 10785225, IEEE.
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Han Xu, Ningchao Lin, Li Luo, Qi Wei, Runsheng Wang, Cheng Zhuo, Xunzhao
Yin, Fei Qiao, Huazhong Yang, “Senputing: An Ultra-Low-Power Always-On
Vision Perception Chip Featuring the Deep Fusion of Sensing and
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IEEE Transactions on Circuits and Systems I: Regular Papers,
2022, pp. 232–243, Art. no. 9464962, IEEE. Available:
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Hohyeon Lee, Minkyu Song, “Design of a Feature Extracted CMOS Image Sensor
with a Novel Integrator and a Configurable ADC,”
2022 International Conference on Microelectronics (ICM), 2022,
pp. 237–240, Art. no. 10005511, IEEE. Available:
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Jiwon Lee, “Offset and Gain FPN Calibrated Linear-Logarithmic Image Sensor
With Shared Pixel Architecture,”
IEEE Transactions on Circuits and Systems II: Express Briefs,
2021, pp. 3518–3521, Art. no. 9434425, IEEE. Available:
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Seddik Benhammadi, Nicola Guerrini, Deividas Krukauskas, Andrea Mifsud,
Iain Sedgwick, “PRECISE: A 5Gbps Serialiser for Scientific Detectors in a
180nm CMOS Image Sensor Process,”
2022 IEEE Nuclear Science Symposium and Medical Imaging Conference
(NSS/MIC), 2022, pp. 1–8, Art. no. 10399290, IEEE. Available:
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Tianyi Zhang, Kishore Kasichainula, Dong-Woo Jee, Injune Yeo, Yaoxin Zhuo,
Baoxin Li, Jae-sun Seo, Yu Cao, “Improving the Efficiency of CMOS Image
Sensors through In-Sensor Selective Attention,”
2023 IEEE International Symposium on Circuits and Systems (ISCAS), 2023, pp. 1–4, Art. no. 10181835, IEEE. Available:
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Hooman Saeidi, Suresh Venkatesh, Xuyang Lu, Kaushik Sengupta, “22.1 THz
Prism: One-Shot Simultaneous Multi-Node Angular Localization Using
Spectrum-to-Space Mapping with 360-to-400GHz Broadband Transceiver and
Dual-Port Integrated Leaky-Wave Antennas,”
2021 IEEE International Solid-State Circuits Conference (ISSCC),
2021, pp. 314–316, Art. no. 9366041, IEEE. Available:
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Yu Zhang, Gang Chen, Tao He, Qian Huang, Kai Huang, “ViraEye: An
Energy-Efficient Stereo Vision Accelerator with Binary Neural Network in
55 nm CMOS,”
2023 28th Asia and South Pacific Design Automation Conference
(ASP-DAC), 2023, pp. 178–179, Art. no. 10044825, IEEE. Available:
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Keunyeol Park, Seonwoo Yeom, Soo Youn Kim, “Ultra-Low Power CMOS Image
Sensor With Two-Step Logical Shift Algorithm-Based Correlated Double
Sampling Scheme,”
IEEE Transactions on Circuits and Systems I: Regular Papers,
2020, pp. 3718–3727, Art. no. 9163136, IEEE. Available:
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M. Dahoumane, L. Alvado, N. Arveuf, R. Bonnefoy, L. Caponetto, T.
Chaventré, X. Chen, S. Drouet, F. Druillole, F. Jouve, I. Laktineh, L.
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Noel, L. Raux, P. Russo, C. Sylvia, P. Vallerand, R. Vandaele, “FASTIME: A
Multi-Channel 130 nm CMOS ASIC for a Complete Fast and High-Resolution
Time Measurement Chain,”
2024 IEEE Nuclear Science Symposium (NSS), Medical Imaging Conference
(MIC) and Room Temperature Semiconductor Detector Conference (RTSD), 2024, pp. 1–1, Art. no. 10657510, IEEE. Available:
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Anurag Kamal, Vishesh Mishra, Sparsh Mittal, Mahendra Rathor, Chandan
Kumar, Urbi Chatterjee, “Sorting Attacks Resilient Authentication Protocol
for CMOS Image Sensor Based PUF,”
2024 Asian Hardware Oriented Security and Trust Symposium
(AsianHOST), 2024, pp. 1–6, Art. no. 10838484, IEEE. Available:
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Tyler Sherwood, Raghuveer Patlolla, Joe Salfelder, Thomas Kasbauer, Raghav
Sreenivasan, Kun Li, Ryan Ley, Gernot Probst, Jason Appell, Ki Cheol Ahn,
Masha Gorchichko, Thomas Uhrmann, “Aggressive Pitch Scaling (sub-0.5 μm)
of W2W Hybrid Bonding Through Process Innovations,”
2023 IEEE 73rd Electronic Components and Technology Conference
(ECTC), 2023, pp. 13–18, Art. no. 10195528, IEEE. Available:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10195528
Yoshihiro Sato, Tsutomu Kobayashi, Takayoshi Yamada, Kazuko Nishimura,
Masashi Murakami, “Impact of n+/p+-doped Polysilicon Gate in Lateral
Overflow Transistor on Organic Photoconductive Film CMOS Image Sensor Dark
Currents,”
2023 IEEE International Meeting for Future of Electron Devices, Kansai
(IMFEDK), 2023, pp. 1–2, Art. no. 10366332, IEEE. Available:
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Mohamed Akrarai, Nils Margotat, Gilles Sicard, Laurent Fesquet,
“Arbiterless Event-Based Imager Architecture with temporal and spatial
redundancies suppression,”
2020 6th International Conference on Event-Based Control,
Communication, and Signal Processing (EBCCSP), 2020, pp. 1–6, Art. no. 9291345, IEEE. Available:
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Chenggong Wan, Yi Zhu, Yingjie Ma, Xue Li, Lixia Zheng, Jin Wu, Weifeng
Sun, “A SPAD Image Sensor With Main-Sub-TDC-Based Coincidence Detection,”
IEEE Transactions on Circuits and Systems I: Regular Papers,
2025, pp. 50–60, Art. no. 10766884, IEEE. Available:
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Serena Rizzolo, Alexandre Le Roch, Olivier Marcelot, Franck Corbière,
Philippe Paillet, Marc Gaillardin, Pierre Magnan, Vincent Goiffon, “High
Displacement Damage Dose Effects in Radiation Hardened CMOS Image
Sensors,” IEEE Transactions on Nuclear Science, 2020, pp.
1256–1262, Art. no. 9076016, IEEE. Available:
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Aaron J. Hendrickson, David P. Haefner, Stanley H. Chan, Nicholas R.
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2022 IEEE International Solid-State Circuits Conference (ISSCC),
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2021 IEEE 34th International Conference on Micro Electro Mechanical
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2023 IEEE 73rd Electronic Components and Technology Conference
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2024 Conference of Science and Technology for Integrated Circuits
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2021 IEEE Asia Pacific Conference on Circuit and Systems (APCCAS), 2021, pp. 5–8, Art. no. 9687792, IEEE. Available:
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2024 IEEE Nuclear Science Symposium (NSS), Medical Imaging Conference
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2024 IEEE 100th Vehicular Technology Conference (VTC2024-Fall),
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2024 22nd IEEE Interregional NEWCAS Conference (NEWCAS), 2024,
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2022 IEEE 72nd Electronic Components and Technology Conference
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2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and
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2022 IEEE Asian Solid-State Circuits Conference (A-SSCC), 2022,
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Maliang Liu, Bingzheng Liu, Jin Hu, Dong Li, Jiaji Ma, Zekun Chu, Rui Ma,
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IEEE Transactions on Circuits and Systems I: Regular Papers,
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Andrea Vici, Felice Russo, Nicola Lovisi, Aldo Marchioni, Antonio Casella,
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IEEE Journal of the Electron Devices Society, 2020, pp. 765–772,
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Yang Qu, Qing Zang, Zehao Li, Qian Jiang, Yang Liu, Hongwei Liang, Yuchun
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Yunhong Kim, Heesung Chae, Kyung-Min Kim, Kyungtae Kim, Sukki Yoon,
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2020 IEEE International Symposium on Circuits and Systems (ISCAS), 2020, pp. 1–4, Art. no. 9180434, IEEE. Available:
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Lu Liu, Yang Guo, Binkang Li, Shaohua Yang, Ming Yan, Errui Zhou, Mingan
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IEEE Transactions on Electron Devices, 2022, pp. 5637–5643, Art.
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Michael Wayne, Arin Ulku, Andrei Ardelean, Paul Mos, Claudio Bruschini,
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Qixin Wu, Hebao Liu, Haitao Jin, Felix Li, Enjoy Yin, Horse Ma, Xinhe
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2022 China Semiconductor Technology International Conference
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Hirotaka Murakami, Eric Bohannon, John Childs, Grace Gui, Eric Moule,
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2022 IEEE International Solid-State Circuits Conference (ISSCC),
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2024 International Conference on Smart Systems for Electrical,
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Saransh Sharma, Grace Ding, Aditya Telikicherla, Fatemeh Aghlmand, Arian
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2020 IEEE International Solid-State Circuits Conference - (ISSCC), 2020, pp. 318–320, Art. no. 9063108, IEEE. Available:
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Wissam Benjilali, William Guicquero, Laurent Jacques, Gilles Sicard,
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IEEE Transactions on Circuits and Systems I: Regular Papers,
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Zeba Khanam, Bilal Aslam, Sangeet Saha, Xiaojun Zhai, Shoaib Ehsan, Rustam
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IEEE Sensors Journal, 2022, pp. 17378–17390, Art. no. 9317732,
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Kazune Yokoo, Yusuke Kozawa, Takao Sawa, “Theoretical analysis of received
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2021 24th International Symposium on Wireless Personal Multimedia
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Varun Kumar, Bibhudatta Satapathy, Wilfred Kisku, Amandeep Kaur, Deepak
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2021 IEEE International Midwest Symposium on Circuits and Systems
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Siyu Guo, Assaf Lahav, Quan Zhou, Pierre Boulenc, Alexander V. Klekachev,
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IEEE Electron Device Letters, 2025, pp. 1–1, Art. no. 10946183,
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2020 IEEE International Electron Devices Meeting (IEDM), 2020,
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Jiuxuan Zhao, Francesco Gramuglia, Pouyan Keshavarzian, Eng-Huat Toh,
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IEEE Journal of Selected Topics in Quantum Electronics, 2024, pp.
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Victor R. R. De Oliveira, Mirella M. De O. Carneiro, Fernanda D. V. R.
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2024 37th SBC/SBMicro/IEEE Symposium on Integrated Circuits and Systems
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Subhrajit Das, Janaka Senarathna, Yunke Ren, Vu Dinh, Mingyao Ying, Ralph
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IEEE Transactions on Biomedical Engineering, 2025, pp. 675–688,
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L. Huth, “The H2M project: Porting the functionality of a hybrid readout
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2024 IEEE Nuclear Science Symposium (NSS), Medical Imaging Conference
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Xiaoyu Feng, Xinyuan Lin, Huazhong Yang, Yongpan Liu, Wenyu Sun, “A
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IEEE Journal of Solid-State Circuits, 2025, pp. 1002–1013, Art.
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Ben Hendrickson, Ralf Widenhorn, Morley Blouke, Denis Heidtmann, Erik
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Xiao Meng, Konstantin D. Stefanov, Andrew D. Holland, “Proton and Gamma
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Xiaopeng Zhong, Man-Kay Law, Chi-Ying Tsui, Amine Bermak, “A Fully Dynamic
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IEEE Journal of Solid-State Circuits, 2020, pp. 1684–1697, Art.
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Kohei Tomioka, Toshio Yasue, Ryohei Funatsu, Kodai Kikuchi, Tomoki
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IEEE Transactions on Electron Devices, 2021, pp. 2326–2334, Art.
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Yves Audet, Abdelhalim Bendali, Jean-Pierre David, “A CMOS Photodetector
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Min-Sun Keel, Daeyun Kim, Yeomyung Kim, Myunghan Bae, Myoungoh Ki, Bumsik
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Yonghun Kwon, Sungyoung Seo, Sunghyuck Cho, Youngchan Kim, Young-Gu Jin,
Youngsun Oh, Yitae Kim, Jungchak Ahn, Jesuk Lee, “A 1.2-Mpixel Indirect
Time-of-Flight Image Sensor With 4-Tap 3.5-μm Pixels for Peak Current
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IEEE Journal of Solid-State Circuits, 2021, pp. 3209–3219, Art.
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Hyunjoon Sung, Yunkyung Kim, “Near-Infrared Sensing with a Stacked
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2022 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR), 2022, pp. 1–2, Art. no. 10432676, IEEE. Available:
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Konstantin D. Stefanov, Martin J. Prest, “Pinned Photodiode Imaging Pixel
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IEEE Transactions on Electron Devices, 2023, pp. 3136–3139, Art.
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Samuel Choi, Kaito Yoshimizu, Takeru Ota, Fumiaki Nin, Hiroshi Hibino,
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2022 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR), 2022, pp. 1–2, Art. no. 10432657, IEEE. Available:
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Congzhen Hu, Bing Zhang, Youze Xin, Chi Wang, Yiyun Xie, Pengfei Hu,
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J. Lefevre, P. Debaud, P. Girard, A. Virazel, “A Fast and Low Cost
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2021 IEEE International Test Conference (ITC), 2021, pp. 1–9,
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Yi Luo, Shahriar Mirabbasi, “A 60fps9.9nJ/frame·pixel CMOS Image Sensor
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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology
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Wei Jiang, Yamn Chalich, Ryan Scott, M. Jamal Deen, “Time-Gated and
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IEEE Sensors Journal, 2021, pp. 12092–12103, Art. no. 9366974,
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Jing Geng, Jun Lv, Ke Jin, Ping Ji, Yongzhi Li, Yuxiong Xue, Yang Liu,
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2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology
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2024 IEEE International Conference on Microwaves, Communications,
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Benjamin Zambrano, Sebastiano Strangio, Tommaso Rizzo, Esteban Garzón,
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Josua Florczak, Tom Neubert, Khalid El Maghawry, Egon Zimmermann, Heinz
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Yiru Wang, Babar Hussain, C. Patrick Yue, “Arbitrarily Tilted Receiver
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Chunshan Zhao, Wuzhi Zhang, Yamin Cao, Wei Zhou, “Quantum Efficiency
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2022 China Semiconductor Technology International Conference
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Takahiko Hashidzume, Takatoshi Yasui, Tomoya Tanaka, “Rapid Resolution of
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IEEE Transactions on Semiconductor Manufacturing, 2021, pp.
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Chongkwang Chang, Jingyun Kim, Hanjin Lim, Youngsun Oh, Yitae Kim,
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2020 IEEE International Solid-State Circuits Conference - (ISSCC), 2020, pp. 104–106, Art. no. 9062924, IEEE. Available:
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Kangping Hu, Christopher E. Arcadia, Jacob K. Rosenstein,
“Super-Resolution Electrochemical Impedance Imaging with a 100 ×
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2021 IEEE Biomedical Circuits and Systems Conference (BioCAS),
2021, pp. 1–4, Art. no. 9644965, IEEE. Available:
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Asako Shigenawa, Yuika Yasui, Yu Nakayama, “First Demonstration of
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2023 IEEE 97th Vehicular Technology Conference (VTC2023-Spring),
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Junming Zeng, Lei Kuang, Nicholas Miscourides, Pantelis Georgiou, “A 128 ×
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IEEE Transactions on Biomedical Circuits and Systems, 2020, pp.
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Kotaro Sakamoto, Mai Madokoro, Hiroshi Horiuchi, Junko Ishida, Tomoko
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2021 21st International Conference on Solid-State Sensors, Actuators
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Julian A. Singer, Till Stramm, Jens Fasel, Oliver Schween, Anton
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2023 IEEE 36th International Conference on Micro Electro Mechanical
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Sergio Moreno, Victor Moro, Angel Dieguez, “A CMOS SPAD pixel with an
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SMACD / PRIME 2021; International Conference on SMACD and 16th
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Zi-Rui Xiong, “A Low Power Voltage-Mode Driver Design for CIS
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2020 IEEE 15th International Conference on Solid-State & Integrated
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Joshua Moo, Paul K. Marsden, Kunal Vyas, Andrew J. Reader, “Diversified
Training Manifolds and Augmented Testing for Improved Deep Learned
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2021 IEEE Nuclear Science Symposium and Medical Imaging Conference
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Eunsung Park, Doyoon Eom, Myeong-Hun Yu, Yun-Mi Moon, Dae-Hwan Ahn,
Jongtae Ahn, Do Kyung Hwang, Woo-Young Choi, Myung-Jae Lee,
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IEEE Journal of Selected Topics in Quantum Electronics, 2024, pp.
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Jie Zhang, Jonathan P. Newman, Xiao Wang, Chetan Singh Thakur, John
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IEEE Transactions on Circuits and Systems I: Regular Papers,
2020, pp. 1803–1814, Art. no. 9016128, IEEE. Available:
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José Lipovetzky, Fabricio Alcalde Bessia, Jerónimo Blostein, Martín Pérez,
Miguel Sofo Haro, Juan Longhino, Ivan Sidelnik, Mariano Gomez Berisso,
“Thermal neutron detector for mixed neutron and gamma beams using a
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2023 Argentine Conference on Electronics (CAE), 2023, pp. 81–84,
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Hyunwoo Je, Dongil Ryu, Haechang Lee, Kijeong Kim, “Neural Network
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2023 7th IEEE Electron Devices Technology & Manufacturing Conference
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Nagaraj Lakshmana Prabhu, Nagarajan Raghavan, “Computational Failure
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Alessandro Michel Brunetti, Mattia Musolino, Bhaskar Choubey, “Staggered
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Tzu-Hsiang Hsu, Guan-Cheng Chen, Yi-Ren Chen, Chung-Chuan Lo, Ren-Shuo
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2022 IEEE International Solid-State Circuits Conference (ISSCC),
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Guangkuo Zhang, Hailong Huo, Xiangzhong Zeng, Fengyuan Zhao, “Realization
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2022 7th International Conference on Control, Robotics and Cybernetics
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Noumbissi Sidze Laure Vanessa, Folla Kamdem Jerome, Wembe Tafo Evariste,
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Hybrid MT-ToT Design for CdZnTe/SiPM in Biomedical PET Applications,”
2022 International Conference on Computing, Electronics &
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Bowen Ding, Zhiqiang Niu, Zhikun Chen, Weizhe Zhang, Bailin Zhang,
Changhui Yang, Nanjian Wu, Liyuan Liu, Peng Feng, “Analysis and
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2023 5th International Conference on Circuits and Systems (ICCS),
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Wei Deng, Eric R. Fossum, “Deep Sub-Electron Read Noise in Image Sensors
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IEEE Transactions on Electron Devices, 2022, pp. 2986–2991, Art.
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Mohamed R. Elmezayen, Suat U. Ay, “Ramp ADC Speed-up Techniques for CMOS
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2021 IEEE Workshop on Microelectronics and Electron Devices (WMED), 2021, pp. 1–4, Art. no. 9425179, IEEE. Available:
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Jinhyuk Choi, Byeongju Lee, Seho Shin, Daehyun Ji, “Fast and Easy Sensor
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Uzma Ansari, Akhilesh Kumar Chaudhary, Sudhanshu Verma, “Enhanced True
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2022 Third International Conference on Intelligent Computing
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Ken Akutsu, Akihito Otani, “Wavelength Division Multiplexing Method Using
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2020 43rd International Conference on Telecommunications and Signal
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Jiangchao Wu, Xin Lu, Man-Kay Law, Yang Jiang, Liyuan Liu, Pui-In Mak, Rui
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IEEE Sensors Journal, 2022, pp. 12808–12819, Art. no. 9789972,
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L. Huth, “A New Monolithic Pixel Sensor in a 65 nm CMOS Imaging Process,”
2024 IEEE Nuclear Science Symposium (NSS), Medical Imaging Conference
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Yunfei Li, Fuzhou Shen, Lantian Hu, Ziyue Lang, Qian Liu, Fuhong Cai, Ling
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IEEE Sensors Journal, 2023, pp. 23629–23637, Art. no. 10234213,
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Chaoyang Shi, Dezhi Song, Dewei Lai, Shuxin Wang, “Development of a
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IEEE Transactions on Medical Robotics and Bionics, 2022, pp.
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Ko-Chi Kuo, “A Novel Linear-Logarithmic Active Pixel CMOS Image Sensor
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2021 IEEE International Midwest Symposium on Circuits and Systems
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Wilfred Kisku, Amandeep Kaur, Deepak Mishra, “Efficient Framework with
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2024 IEEE International Symposium on Smart Electronic Systems
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Hyeon-June Kim, “11-bit Column-Parallel Single-Slope ADC With First-Step
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IEEE Journal of Solid-State Circuits, 2021, pp. 2132–2141, Art.
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Zheng Nie, Hao Li, Dong-Sheng Liu, Ang Hu, Jia-Hao Lu, Hai Li, “A 13-bit
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2022 IEEE 16th International Conference on Solid-State & Integrated
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Mengyao Li, Shanli Long, Chuanqi Wu, Ziqian Zhang, “The Design of
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EEI 2022; 4th International Conference on Electronic Engineering and
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Xianming Li, Weisheng Wu, Weikang Yan, Haorong Xie, Xinghui Liu, Kai Wang,
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J. Lefevre, P. Debaud, P. Girard, A. Virazel, “Predictor BIST: An
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2023 IEEE International Test Conference (ITC), 2023, pp. 310–319,
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Xingzheng Wang, “Single-Photon Cameras Image Reconstruction Using Vision
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2023 IEEE 3rd International Conference on Computer Communication and
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Miron Kłosowski, Yichuang Sun, Waldemar Jendernalik, Grzegorz Blakiewicz,
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IEEE Transactions on Circuits and Systems II: Express Briefs,
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Hejiu Zhang, Zhichao Fang, Ningmei Yu, Nan Lv, Zhongjie Guo, “A
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2022 IEEE 16th International Conference on Solid-State & Integrated
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Yong-Seok Lee, Hyeon-June Kim, “High-Speed Multilevel Binary Imaging CMOS
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IEEE Sensors Journal, 2022, pp. 15934–15943, Art. no. 9831064,
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Qihui Zhang, Ning Ning, Jing Li, Qi Yu, Kejun Wu, Zhong Zhang, “A 12-Bit
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Lixing Yu, Atsutake Kosuge, Mototsugu Hamada, Tadahiro Kuroda, “An Anomaly
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Doyeon Kim, “Development of 0.5 μm Pixel 3-Wafers Stacked CMOS Image
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2024 IEEE 74th Electronic Components and Technology Conference
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An-Nan Xiong, Yi-Fei Fan, Shun-Qi Dai, Chen Xu, Jie George Yuan, Mansun
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2022 IEEE 16th International Conference on Solid-State & Integrated
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Yusuke Oike, “Evolution of Image Sensor Architectures With Stacked Device
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Fukashi Morishita, Norihito Kato, Satoshi Okubo, Takao Toi, Mitsuru
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Image Sensor and an AI Accelerator for Realizing Edge-Computing-Based
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2021, pp. 1–2, Art. no. 9492514, IEEE. Available:
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Yang Luo, Fei Wang, KaiJian Liu, AiYing Guo, “A low-power, high-gain
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2022 19th China International Forum on Solid State Lighting & 2022 8th
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Chen Cao, Masashi Hakamata, Keita Yasutomi, Keiichiro Kagawa, Satoshi
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IEEE Transactions on Electron Devices, 2022, pp. 2851–2857, Art.
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Ke-Yang Sun, Li-Yang Pan, Zhe-yao Wang, “A novel Gate-Controlled Lateral
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2022 IEEE 16th International Conference on Solid-State & Integrated
Circuit Technology (ICSICT), 2022, pp. 1–3, Art. no. 9963238, IEEE. Available:
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Hui Chen, Chenchen Qiu, Zhengying Wei, Chang Sun, Jun Qian, Yufei Peng,
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2023 China Semiconductor Technology International Conference
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Yihao Zhang, Hongfei Zhang, Jun Zhang, Xingbo Wang, Jian Wang,
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Chun-Hsien Liu, Chin-An Hsien, Sheng-Di Lin, “2-D
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IEEE Transactions on Electron Devices, 2022, pp. 2873–2878, Art.
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Lin Li, Zhongjie Guo, Jinao Zhang, Ruiming Xu, “Adaptive Ramp Generator
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2022 7th International Conference on Integrated Circuits and
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Shenglong Zhuo, Tao Xia, Lei Zhao, Miao Sun, Yifan Wu, Lei Wang, Hengwei
Yu, Jiqing Xu, Jier Wang, Zhihong Lin, Yuan Li, Lei Qiu, Rui Bai, Xuefeng
Chen, Patrick Yin Chiang, “Solid-State dToF LiDAR System Using an
Eight-Channel Addressable, 20-W/Ch Transmitter, and a 128 × 128 SPAD
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IEEE Journal of Solid-State Circuits, 2023, pp. 757–770, Art. no.
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Sijie Lin, Renping Wang, Ting Cai, Yunze Zeng, “A Custom RISC-V Based SOC
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Yizhe Wang, Zhongjie Guo, Youmei Guo, “Pixel Sharing Based Design of High
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2024 3rd International Symposium on Semiconductor and Electronic
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J.P. Gambino, D. Price, R. Jerome, H. Ziad, T. Frank, A. Kerekes, V. Samu,
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2021 32nd Annual SEMI Advanced Semiconductor Manufacturing Conference
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Matan Assaf, Odem Harel, Erez Tadmor, Orly Yadid-Pecht, Alexander Fish,
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2023 IEEE International Interconnect Technology Conference (IITC) and
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IEEE Transactions on Nuclear Science, 2025, pp. 1217–1227, Art.
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2022 23rd International Symposium on Quality Electronic Design
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IEEE Electron Device Letters, 2024, pp. 308–311, Art. no.
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Ruotong Yin, Yinlei Liang, Weizhe Zhang, Peng Feng, Zhe Wang, Runjiang
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2024 IEEE International Conference on Integrated Circuits, Technologies
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2021 IEEE 14th International Conference on ASIC (ASICON), 2021,
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2021 IEEE International Electron Devices Meeting (IEDM), 2021,
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Soyoung Park, Changhyuk Lee, “Design and Analysis of Angle-sensitive
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2021 IEEE Photonics Conference (IPC), 2021, pp. 1–2, Art. no.
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IEEE Journal of Selected Topics in Quantum Electronics, 2023, pp.
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2020 IEEE International Symposium on Circuits and Systems (ISCAS), 2020, pp. 1–4, Art. no. 9180435, IEEE. Available:
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Mandovi Mukherjee, Burhan Ahmad Mudassar, Minah Lee, Edward Lee, Saibal
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IEEE Sensors Journal, 2022, pp. 11317–11327, Art. no. 9462938,
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Jeremy A. Theil, Thomas Workman, Dominik Suwito, Laura Mirkarimi, Gill
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2022 IEEE 72nd Electronic Components and Technology Conference
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Minkyung Kim, Hyeongseok Seo, Songhyeon Kim, Jung-Hoon Chun, Seong-Jin
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2024 IEEE International Solid-State Circuits Conference (ISSCC),
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Sangwoo Kim, Taehyoung Kim, Kiwon Seo, Gunhee Han, “A Fully Digital
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2022 IEEE International Solid-State Circuits Conference (ISSCC),
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Yeh Yee Kee, Kei Lin Sek, Lei Zhu, Younan Hua, Xiaomin Li, “A Novel CMOS
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2021 IEEE International Symposium on the Physical and Failure Analysis
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Elia A. Vallicelli, Mattia Oliver Cosmi, Mattia Tambaro, Andrea
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2022 29th IEEE International Conference on Electronics, Circuits and
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Changzhong Han, Ningmei Yu, Nan Lv, Hejiu Zhang, Mingxin Wu, Miaomiao Cao,
“Blurred Image Restoration CMOS Image Sensor Circuit Design,”
2024 9th International Conference on Integrated Circuits and
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Yao Wang, Fei Qin, Shuying Ma, Jiao Wang, Aimo Xiao, Shuai Zhao, “Process
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2020 21st International Conference on Electronic Packaging Technology
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Chaohui Gai, Zeyu Xu, Chenggang Wang, Zeyu Gao, Qianyu Shi, “Design of
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2024 IEEE 2nd International Conference on Image Processing and Computer
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Hao Shi, Dong Li, Rui Ma, Zhangming Zhu, “A 64×64 Gated-SPAD Image Sensor
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IEEE Transactions on Instrumentation and Measurement, 2025, pp.
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Nikolaos Vasileiadis, Vasileios Ntinas, Iosif-Angelos Fyrigos,
Rafailia-Eleni Karamani, Vassilios Ioannou-Sougleridis, Pascal Normand,
Ioannis Karafyllidis, Georgios Ch. Sirakoulis, Panagiotis Dimitrakis, “A
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2021 IEEE International Symposium on Circuits and Systems (ISCAS), 2021, pp. 1–5, Art. no. 9401586, IEEE. Available:
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Ming Chen, Li Zhou, Yang-Jun Yang, Cheng-Bin Zhang, Kun-Yu Wang, Cen Gao,
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2020 IEEE 15th International Conference on Solid-State & Integrated
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Calvin Yi-Ping Chao, Meng-Hsu Wu, Shang-Fu Yeh, Chin-Hao Chang, Chi-Lin
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IEEE Journal of the Electron Devices Society, 2021, pp. 972–984,
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Sachin Shah, Matthew A. Chan, Haoming Cai, Jingxi Chen, Sakshum
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2024 IEEE/CVF Conference on Computer Vision and Pattern Recognition
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Gia Bao Thieu, Sven Gesper, Guillermo Payá-Vayá, Christoph Riggers, Oliver
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Christian Weis, Lukas Steiner, Chirag Sudarshan, Norbert Wehn, Lennart M.
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2023 Design, Automation & Test in Europe Conference & Exhibition
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Francesco Gramuglia, Pouyan Keshavarzian, Ekin Kizilkan, Claudio
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IEEE Journal of Selected Topics in Quantum Electronics, 2022, pp.
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2022 IEEE International Solid-State Circuits Conference (ISSCC),
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2022 IEEE International Symposium on Circuits and Systems (ISCAS), 2022, pp. 283–287, Art. no. 9937226, IEEE. Available:
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Julius Erbach, Stepan Tulyakov, Patricia Vitoria, Alfredo Bochicchio,
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2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition
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2023 IEEE International Reliability Physics Symposium (IRPS),
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Yue Ma, Jianjun Yi, Gengshu Xu, Yuanhao Chen, Danwei Wang, Changchun Zhao,
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2021 IEEE Asia-Pacific Conference on Image Processing, Electronics and
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Tongchuan Ma, Zhihang Xu, Li Du, Yuan Du, “Inductively-Coupled High-Speed
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2022 7th International Conference on Integrated Circuits and
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Peter Palomaki, Sean Keuleyan, “Snapshots by quantum dots: Look out, CMOS
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2022 IEEE International Symposium on Circuits and Systems (ISCAS), 2022, pp. 3453–3457, Art. no. 9937269, IEEE. Available:
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Jiaji Ma, Jin Hu, Dong Li, Xiayu Wang, Rui Ma, Zhangming Zhu, “Dual-Mode
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IEEE Transactions on Circuits and Systems I: Regular Papers,
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Ajay Kumar Gurrala, Gs Rahul, S Amalan, Sp Preejith, Mohanasankar
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2023 IEEE International Symposium on Medical Measurements and
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Tae-Min Kim, Jungsan Kim, Seungho Lee, Yongsoon Park, Jong Uk Kim, Sangjin
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Taehyoung Kim, Yoonjay Han, Suji Hwang, Tae-Yon Lee, Hongki Kim, Seung-Sik
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“A High-Performance 2.2μm 1-Layer Pixel Global Shutter CMOS Image Sensor
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2024 IEEE International Electron Devices Meeting (IEDM), 2024,
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Jan Gebauer, Pavel Šofer, Martin Jurek, “The System for Fatigue Crack
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2021 22nd International Carpathian Control Conference (ICCC),
2021, pp. 1–4, Art. no. 9454600, IEEE. Available:
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Jaehoon Jun, Han Yang, Beomsoo Yoon, Yongbin Kim, Kyoungmin Koh, “A Low
Power Digitizer with Piecewise- Linear Counting Technique for High Dynamic
Range Nonacell-Based 3-D-Stacked CMOS Image Sensor,”
2023 IEEE International Symposium on Circuits and Systems (ISCAS), 2023, pp. 1–5, Art. no. 10181676, IEEE. Available:
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Khalil Imane, Addaim Adnane, Guennoun Zouhair, “Sun Centroid Extraction
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2022 IEEE 3rd International Conference on Electronics, Control,
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Chongkwang Chang, Jingyun Kim, WooGwan Shim, Taehee Kim, Jamie Lee,
Donghyuk Park, EuiYeol Kim, Howoo Park, Jaekyu Lee, Yitae Kim, JungChak
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2021 IEEE International Solid-State Circuits Conference (ISSCC),
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Haibiao Zuo, Xiaoliang Huang, Shiqiao Zhang, Chip-Hong Chang, Xiaojin
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2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology
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Hua Fan, Jie Shen, Quanyuan Feng, Qi Wei, Changtao He, “Calibration method
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2021 IEEE Asia Pacific Conference on Circuit and Systems (APCCAS), 2021, pp. 49–52, Art. no. 9687763, IEEE. Available:
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Zongwang Fan, Hongbang Liu, Huanbo Feng, Yanjun Xie, Hui Wang, Ran Chen,
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IEEE Transactions on Nuclear Science, 2023, pp. 1507–1513, Art.
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Chinatsu Kawakami, Shirlyn Eng ShuYing, Tomoko Hario, Hideo Doi, Yang-Joon
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Neurotransmitter Image Sensor with Lateral Ion Diffusion Suppressor,”
2021 21st International Conference on Solid-State Sensors, Actuators
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Yi Luo, Shahriar Mirabbasi, “A 60-Frames/s CMOS Image Sensor With
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Jin Chen, Liangzun Fu, Rikui Xiang, Shaobo Luo, Xiwei Huang, Hao Yu,
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2023 21st IEEE Interregional NEWCAS Conference (NEWCAS), 2023,
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